AMD, Cray, IBM, Intel and Nvidia Receive $25.4 Million in Contracts for Exascale Supercomputer Interconnect Design
U.S. Department of Energy Awards $25.4 Million in R&D Contracts
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AMD Develops Its Own "Discovery" Reference Tablet with Peripherals
AMD Wins CES Innovations Design and Engineering Awards with "Discovery" Tablet Platform
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OCZ Sees Growing Potential for PCIe SSDs, Hints on PCIe Drives with Own Controller
OCZ Predicts Growing Demand for PCI Express SSDs on PC and Workstation Markets
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HP Celebrates Shipment of 200 Millionth HP LaserJet Printer
HP's Laser Printers Set Up New Milestone
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Apple Invests $10.5 Billion into Production Equipment Ahead of Possible Apple TV and iWatch Launches
Apple Significantly Increases CapEx Investments to Create Unique Products
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Toshiba Introduces All-New FlashAir SDHC Memory Card with Embedded Wi-Fi
Toshiba's FlashAir Memory Cards Can Now Connect Multiple Devices At Once
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Nvidia's Cuda 6 Brings Support for Unified Memory, Multi-GPU Scaling, Drop-In Libraries
Nvidia Simplifies Parallel Programming With Cuda 6 Platform
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Microsoft Opens Up Advanced Cybercrime Center
Microsoft to Help Fighting Internet Crime
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Microsoft Xbox One and Sony PlayStation 4 Do Not Support Blu-Ray 3D Out-of-Box
Next-Gen Consoles Will Not Support Stereo-3D BD-3D Discs at Launch
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AMD Introduces GPU Accelerator for Big Data Applications
AMD Unveils FirePro S10000 12GB Edition GPU Accelerator
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GlobalFoundries May Land Chip Manufacturing Orders from Apple
GlobalFoundries and Samsung to Fight Against TSMC Together
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G.Skill Introduces 2GHz DDR3L Memory Modules for Laptops
Extreme Memory Speeds Reach Notebook PCs
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Asetek to Demonstrate RackCDU Liquid Cooled 92 Node HPC Cluster
Asetek to Show Off Liquid-Cooled HPC Cluster at SC13
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Western Digital Demos World's First Hard Drive with HAMR Technology
WD Shows Off HDD with Heat Assisted Magnetic Recording Technology
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AMD Cans Plans to Introduce Next-Gen FX Microprocessors Next Year
Second-Gen AMD FX "Vishera" Chips to Continue Be AMD's Highest-End Offering in 2014
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