Saturday, October 15, 2011

IT News Head Lines (techPowerUp) 15/10/2011

techPowerUp!



(PR) AM3+ Processor Support BIOS Updates Available for Several MSI Motherboards
Leading international mainboard and graphics card maker MSI released the mainboard BIOS with full AMD AM3+ 8-core CPU support for download today. Enthusiasts that own one of the listed mainboards1 can now download the update to support the latest AMD AM3+ 8-core CPUs (B2 Stepping). For those planning to purchase a new mainboard, if the box is labeled with "Supports AM3+ CPU with New BIOS," the mainboard will support the powerful AMD AM3+ 8-core CPUs out of the box. Enthusiasts that have purchased a mainboard that is on the list of compatible mainboards can update the BIOS themselves to support the latest AM3+ 8-core CPUs. Also, new in this BIOS update is official support for MSI's proprietary ClickBIOS II system optimization tool for all AMD 900 mainboards. The graphical UEFI BIOS provides mainboard-level support, and exporting OC Profiles to USB drives offers unparalleled convenience.





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(PR) ASRock Announces Wide-Ranged Support for AMD FX Processors
Motherboard giant, ASRock Inc. is proud to announce that their AMD Motherboard Series now can fully support the newly launched AM3+ Bulldozer processors. It's been an incredible year for multi-core processing and it's almost time for you to upgrade the essential CPU.



ASRock have prioritized AM3+ motherboard implementation and is the first to produce the most sophisticated AM3+ CPU-capable motherboards. The entire range of AM3+ mobo includes AMD's 9-Series, 8-Series, 7-Series and Nvidia's GeForce 7025 chipset series. Importantly, ASRock have a complete motherboard products line (from high-end, performance to budget-level) supporting AM3+ Bulldozer processors. Users are able to enjoy the exciting AM3+ performance with the latest BIOS update. ASRock is confident to say that they are the only motherboard maker that can offer so many AM3+ mobo choices based on difference chipsets. And this is what other mobo makers cannot do.





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AMD to Turn to TSMC for ''Bulldozer'' Manufacturing
AMD is rumored to be seeking ties with TSMC, Taiwan's premier semiconductor manufacturing foundry, for future manufacturing of its "Bulldozer" architecture processors, according to a report by DonanimHaber. This has two very distinct implications: first, AMD could be facing issues with GlobalFoundries 32 nm HKMG node, its de facto foundry for CPU manufacturing, and second, this could just be an obvious development of future low-power APUs based on the new x86 architecture being manufactured at TSMC, much like how current E-series and C-series APUs are.



Then again, AMD doesn't exactly have any APUs in works that use "Bulldozer" architecture for the x86 cores, rather, its successor codenamed "Piledriver". Another couple of important things to note here are that TSMC does not have a 32 nm bulk node (it was scrapped with the transition to 28 nm bulk), and its HKMG (high-K metal gate transistor) manufacturing technology is deployed rather recently. It would be interesting to follow this development.







Source: DonanimHaber

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(PR) DangerDen Announces Q20 Black Series Case
The color cases options are back at Danger Den with the new Q20 Black Series Case! The Q20 has standard color options for the top and bottom panels as well as the front and back grills. Now you can easily match your case color to your planned modding theme!



The front grill allows the Q20 to have an air filter that can easily be removed and blown off, keeping the dust out of your case! The internal fan shroud can be configured to mount 120mm or 140mm fans. If you want to liquid cool you can match the radiator to the fans.





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(PR) OCZ Technology Announces Deneva 2 and Intrepid Series mSATA SSDs for OEMs
OCZ Technology Group, Inc., a leading provider of high-performance solid-state drives (SSDs) for computing devices and systems, today launched the Deneva 2 and Intrepid Series mSATA SSD lineup for OEM clients. These small form factor drives are designed for a wide range of embedded applications including slim servers, tablets, dual drive notebooks, and network security devices, delivering superior performance over hard drives while meeting the stringent reliability, security, and cost-saving needs of enterprise storage environments.



Embedded system designers require small format, cost-effective SSD solutions that do not compromise performance or reliability. Unlike standard drives, OCZ mSATA SSDs are much smaller with no outer housing, making them an easy to deploy storage solution for mobile computing, boot modules for virtualization applications, or HDD caching, allowing for high capacities, high performance, and low power consumption in a very compact form factor.

"OCZ Deneva 2 and Intrepid mSATA solid state drives provide OEMs with the flexibility to address storage and caching requirements within innovative form factors, including embedded and dual-drive devices and blade servers," said Ryan Petersen, CEO of OCZ Technology Group. "These new SSDs are available in a wide range of capacities and configurations to deliver exceptional scalability, performance, and endurance, all with a compact and energy efficient design."

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Bulldozer Aims For 50% Improvement By 2014: Is This Really Enough To Counter Intel?
The reviews are now out for AMD's brand new Bulldozer architecture, in the form of the Zambezi FX 8120 & FX 8150 processors and they don't paint a pretty picture of these flagship products. The chips use lots of power, run hot and significantly underperform compared to their Intel competition. On top of that, they are being marketed as 8 core processors, when they are actually 4 core with an advanced form of multi-threading, due to the siamesed nature of each dual processor module. Perhaps to counter this negative publicity and try to restore some faith in the AMD brand, they have released a roadmap for the planned improvements to the architecture, all the way to 2014 – an ambitious timeline, given how much and how unexpectedly things can change at the cutting edge of the technology world.





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(PR) GIGABYTE Launches Force K3 Gaming Keyboard
GIGABYTE, a leading manufacturer of motherboards and graphics cards, is pleased to announce a new standard gaming keyboard – Force K3, a gaming keyboard with professional features and friendly price. Back to the end of 2010, GIGABYTE had just released the first gaming keystroke keyboard Aivia K8100 Macro Gaming Keyboard, the Red Dot design award winner, and received good reviews from all around the world. To continue fulfilling gamers' needs, GIGABYTE is launching Force K3 Gaming Keyboard, which features enlarged elastic rubber dome, one-piece rubber membrane design, enhanced frame structure, water-resistant functionality, and shock-resistant design.





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(PR) PQI Releases H552V USB 3.0 2.5'' Portable Hard Drive
Power Quotient International (PQI) has just released its all-new H552V USB 3.0 2.5" portable hard drive! The drive features sharp and refined curves that create a stylish sports car-like appearance, a dual curved back case that lends it a stunning beauty, and a precision engraving polishing technique and ornate buffing that manifests a high quality combination glossy/matte black finish. The device's smooth surface texture, which is both aesthetically pleasing and comfortable to the touch, subtly exudes a reserved sense of extravagance. The PQI H552V boasts stylish race car-like curves and also features a USB 3.0 transfer interface crafted like a hawk-eyed double headlight. The bright LED light at the center of the headlights clearly displays transfer status to help avoid interrupting data transfers-and thereby losing one's important data-as a result of accidentally removing the device at the wrong time.





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(PR) SteelSeries and Gunnar Optics Introduce SteelSeries DESMO Gaming Eyewear
Today, SteelSeries and GUNNAR Optiks introduced a new style of eyewear designed for competitive gamers, the SteelSeries Desmo. Featuring GUNNAR's i-AMP® lens technology, the new co-branded eyewear improves visual efficiency, endurance, and recovery during gaming sessions. To minimize peripheral distractions, the unique design is semi-rimless and provides an exceedingly broad visual field that allows the user to completely focus on the screen. The sleek frame features flexible twin-rail temples combined with adjustable nose pads to provide a lightweight, stable fit. As an added benefit for gamers, the ultra-slim temples rest comfortably beneath a gaming headset. The new style will be available in two color options – the Desmo Onyx and Desmo Snow (limited edition).





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Available Tags:MSI , Motherboards , ASRock , AMD , OCZ , GIGABYTE , Gaming , Keyboard , USB 3.0 , USB ,

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