(PR) MSI Announces the Gaming 24 AIO Desktop
MSI proudly presents the upgraded Gaming All-in-One PC: MSI Gaming 24. Equipped with more powerful hardware than its predecessor, this system is capable and ready to run the newest PC games in full glory. The large 24" Full HD display offers an outstanding gaming experience with fast response times for improved gaming performance. By using the HDMI input, the display can also be used to connect a game console. The display also comes with MSI Anti-flicker technology, to prevent screen flickering and blue light emission through a smartly stabilized power current, thereby reducing eyestrain and fatigue.
The MSI Gaming 24 utilizes Intel's new Skylake-H platform enabling a better CPU performance with reduced power consumption. It supports up to 32 GB dual-channel DDR4 memory to take care of the most demanding tasks. To run the newest games, the system is equipped with a NVIDIA GeForce GTX 950M or 960M graphics chip. This time with 4GB GDDR5 memory, which is twice as much as its predecessor. The Gaming 24 features the next generation Intel Wireless-AC 3165 Wi-Fi adapter and Killer E2400 Ethernet. Ensuring faster network speeds and prioritization of network traffic for online games.
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TSMC to Launch its 5 nm Fab by 2020
Taiwan's premier semiconductor foundry, TSMC, announced that it is on track to begin production of chips on its 7 nanometer silicon fab process by the first half of 2018. The company also announced that production on an even newer 5 nanometer process should commence two years later, in 2020. The company has currently cleared all decks for mass-production of chips on its 16 nm FFC (FinFET compact) node, with the company hoping to grab over 70% of the worldwide 14/16 nm production market-share by the end of 2016.
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(PR) Samsung Begins Mass-Producing 4-Gigabyte HBM2 Memory Stacks
Samsung Electronics Co., Ltd., announced today that it has begun mass producing the industry's first 4-gigabyte (GB) DRAM package based on the second-generation High Bandwidth Memory (HBM2) interface, for use in high performance computing (HPC), advanced graphics and network systems, as well as enterprise servers. Samsung's new HBM solution will offer unprecedented DRAM performance - more than seven times faster than the current DRAM performance limit, allowing faster responsiveness for high-end computing tasks including parallel computing, graphics rendering and machine learning.
"By mass producing next-generation HBM2 DRAM, we can contribute much more to the rapid adoption of next-generation HPC systems by global IT companies," said Sewon Chun, senior vice president, Memory Marketing, Samsung Electronics. "Also, in using our 3D memory technology here, we can more proactively cope with the multifaceted needs of global IT, while at the same time strengthening the foundation for future growth of the DRAM market."
The newly introduced 4GB HBM2 DRAM, which uses Samsung's most efficient 20-nanometer process technology and advanced HBM chip design, satisfies the need for high performance, energy efficiency, reliability and small dimensions making it well suited for next-generation HPC systems and graphics cards.
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(PR) Toshiba Announces Availability of Very Read-intensive Enterprise SAS SSD
Toshiba Corporation's Semiconductor & Storage Products Company today announced the availability of a new very read-intensive, enterprise SAS solid state drive (SSD) - the PX04SL series. The PX04SL series is optimized for read-intensive application workloads such as data warehousing, web servers, media streaming and video on demand (VOD). Sample shipments start today.
The PX04SL can offer the most cost-effective solutions in Toshiba's PX04S generation of SAS interface enterprise SSDs. Available in 2TB[1] and 4TB capacities, the PX04SL enables organizations to minimize total cost of ownership (TCO) without sacrificing performance. With sustained random read performance of 270K IOPS[2], the PX04SL helps read-intensive application workloads achieve superior results. To combat bottlenecks, this SAS SSD provides high-density storage for efficient data throughput to deliver high performance, reliability and endurance for maximum application scalability.
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(PR) SilentiumPC Announces the Fortis 3 HE1425 Malik Customs Edition
Performance meets style with the new Malik Customs Edition of Fortis 3 CPU Cooler - the fruit of collaboration between SilentiumPC and Malik, owner of Malik Customs, world renowned custom system builder and hardware photographer. Based on the regular model it offers unparalleled thermal capabilities coupled with new level of customizability and aesthetics. The heatsink is coated in dark nickel and it's complimented by interchangeable top plates. Four different color plates are included to match the cooler with most popular high-end components.
Fortis 3 HE1425 MCE is a large single tower type cooler with top tier performance at moderate price point. Engineered to achieve optimal balance between heat dissipation and airflow it uses five Φ6mm high performance heatpipes transferring heat efficiently to 38 aluminum fins. In terms of styling we decided to black-out the logos giving the cooler stealth and professional look.
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KFA2 Announces the GeForce GTX 970 EXOC Sniper Edition Graphics Card
KFA2, Galaxy's EU wing, announced the GeForce GTX 970 EXOC Sniper Edition graphics card. EXOC is KFA2 equivalent for Galaxy's "Hall of Fame" edition moniker, denoting the company's highest factory-overclock tier. The card features a custom-design 27 cm long PCB, with a 2-slot thick air cooler that makes use of a dense aluminum fin-stack, to which heat drawn directly from the GPU die is fed by 8 mm-thick nickel-plated copper heat pipes; ventilated by a pair of 90 mm spinners that stay off when idling.
The GTX 970 EXOC Sniper Edition comes with factory-overclocked speeds of 1178 MHz core, with 1329 MHz max GPU Boost frequency, and an untouched 7012 MHz (GDDR5-effective) memory, against reference speeds of 1050 MHz core and 1178 MHz GPU Boost. KFA2 plans to sell the card at 349€ (including all taxes), when it hits the shelves later this month.
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(PR) Corsair Unveils its Fastest Ever 128GB, 64GB and 32GB DDR4 Kits
Corsair, a world leader in enthusiast memory, PC hardware and components, is pleased to announce the global availability of its fastest ever Vengeance LPX 128GB, 64GB and 32GB DDR4 kits. Boasting frequencies of up to 3,600MHz, these new XMP 2.0 kits bring high-frequency performance to even the largest capacity DDR4 modules.
Corsair's fastest 128GB DDR4 kit ever, the Vengeance LPX 128GB (4x16GB) 3,000MHz is designed to push Intel's X99 quad-channel platform to the next level, reaching frequencies of 3,000MHz or higher. With full XMP 2.0 support and running at 1.35V with CL16-18-18-36 low latency timings, the kit offers both the massive capacity and high-frequency DDR4 performance required by top-end work stations running the most demanding applications.
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(PR) EpicGear Announces the SonorouZ X Gaming Headset
EpicGear, international vendor of high-quality and competitive-oriented gaming peripherals, announces the first addition to their top-tier gaming product line-up for 2016 - their gaming headset SonorouZ X. Its advanced virtual 7.1 surround sound via two 50 millimeter drivers delivers impressive in-game acoustics and allows players to experience their games on a new level.
With an excellent frequency range from 20 Hz to 20 KHz they are able to hear their opponents before they can even see them, while the unidirectional microphone, with a frequency response range of 100 Hz to 10 KHz, ensures crystal-clear team communication. The handy, multifunctional in-line controller of the SonorouZ X covers all essential audio and microphone controls, while the equalizer switch provides an instant choice between music and game audio profiles.
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No Enterprise Support for Older Windows Versions on the Latest Processors: Microsoft
Microsoft, in a tactfully-worded blog post by Exec VP for its Windows and Devices Group, Terry Myerson, announced that it won't support older versions of Windows (eg: Windows 7 and Windows 8.1) on the latest/upcoming processors. The software might run on the new hardware, but the company won't provide enterprise support for such platforms. This could include software updates, as the platform won't technically meet the software's requirements.
In the post, Microsoft named upcoming platforms from the big three CPU makers - Intel, AMD, and Qualcomm, to which the company will provide enterprise support only for Windows 10. These include the 7th generation Core "Kaby Lake" processors from Intel, "Bristol Ridge" processors from AMD, and the "8996" SoC from Qualcomm. Machines running a select few models of Core "Skylake" processors will receive enterprise support, but only till 17th July, 2017. After this date, only the most critical security updates will be released for the OS running on those platforms.Sources: Microsoft, Engadget
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AMD Working on Two "Polaris" GPUs: Raja Koduri
AMD Radeon Technologies Group (RTG) head Raja Koduri, in an interview with Venture Beat, confirmed that the company is currently working on two 14 nm FinFET GPUs based on the "Polaris" (4th generation Graphics CoreNext) architecture. He was quoted as referring to the two chips as "Polaris 10" and "Polaris 11." He remarked that the two chips are "extremely power efficient."
Koduri ran Venture Beat through what's new with these chips, besides being built on the 14 nm process and GCN 4.0 stream processors - a redesigned front-end, new geometry processors, a new multimedia engine, and new display controllers. GCN 4.0 lends the chip an up-to-date API support besides significantly higher performance, the new multimedia engine features native h.265 hardware acceleration, and the display controllers support the latest DisplayPort 1.3 and HDMI 2.0a connectors.
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Available Tags:MSI , Gaming , Samsung , Toshiba , SSD , GeForce , GTX , DDR4 , Windows , Microsoft , AMD ,
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