AMD Fiji XT Reference PCB as Short as GTX 970 Reference, R9 295X2 Performance
AMD's upcoming Radeon R9 390X graphics cards will ship in two SKUs - an air-cooled one, with a moderately long reference design board (though not as long as the R9 290X), and a new Water-Cooled Edition (WCE) SKU, which will feature a very compact PCB - one that could be no bigger than that of the GeForce GTX 970 reference. This is possible because of AMD's HBM implementation. The 8 GB of memory on this card is present on the GPU package, as bare 3D-stacked DRAM dies, surrounding the GPU die, with an IHS covering everything; rather than the GPU package being surrounded by memory chips. Other specs on hand so far, include 4,096 GCN 1.2 stream processors, 256 TMUs, 128 ROPs, and a 4096-bit wide HBM interface, which at 1.25 GHz memory clock, will offer memory bandwidth of 640 GB/s.
While Fiji package will be bigger than that of, say, "Hawaii," overall the setup is more space-efficient, and conserves PCB real-estate. The PCB hence only has the GPU package and the VRM. AMD is doing away with the DVI connector on its reference PCB. It will only feature three DisplayPort 1.2a and one HDMI 2.0a. The WCE variant will feature a pump+block covering the GPU package, which will come factory-fitted to a 120 x 120 mm radiator. The air-cooled R9 390X will be longer, but only to house a heatsink and lateral blower. The single-GPU card could offer performance comparable to the dual-GPU R9 295X2, which is faster than the GeForce GTX TITAN-X. AMD CEO Lisa Su, speaking at the Investor Day event, in New York, on 6th May, hinted that the product could launch on the sidelines of Computex 2015 (early June).
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Fixstars Unveils the Highest-Capacity 2.5-inch SSD
Fixstars unveiled the world's highest capacity SSD in the 2.5-inch form-factor, with a SATA 6 Gb/s interface, the Fixstars SSD-6000M. This drive offers 6,000 GB of unformatted space, and uses 15 nm MLC NAND flash chips. The underlying controller is unknown, but the drive offers reasonably high sequential transfer speeds of up to 540 MB/s read, with up to 520 MB/s writes. The drive supports modern SSD features, such as NCQ, TRIM, and SMART. The drive is 9.5 mm thick, and may not fit in certain kinds of notebooks. The company plans to launch the drive some time in July, 2015, backed by a 3-year warranty.
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DeepCool Announces Maelstrom T-Series AIO Liquid CPU Coolers
DeepCool announced its latest Maelstrom T-series all-in-one liquid CPU coolers, the Maelstrom 120T, and the Maelstrom 240T. As their names suggest, the two differ with radiator sizes of 120 x 120 mm and 120 mm x 240 mm, respectively. The two are characterized by a newer 0.2 mm-thick copper micro-channel design on the block, which offers higher surface area for heat dissipation to the coolant; and a new zirconia-ceramic impeller on the pump, which offers an MTBF of 120,000 hours.
The 27 mm-thick radiators on both models are mated with included blue LED-lit fans, which take in PWM input, spin between 600 and 1,800 RPM, pushing up to 83.64 CFM of air, each, with a noise output ranging between 17.8-34.1 dBA. Most modern CPU socket types are supported, including LGA2011v3, LGA1366, LGA115x, AM3+, and FM2+. The block has a glowing white LED logo, with a "breathing" effect. The company did not announce pricing or availability information.
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AeroCool Announces DS-200 Window Red Edition
AeroCool concluded its Summer-2015 case launch cycle, which included the Cyclops Advance Black and GT-RS, with the new DS-200 Window Red. A variant of the company's DS-200 chassis, the Red Window features a matte red applique on the front, which flows to the top, with side grooves for the front fan intakes, and top exhaust. It features a rectangular tinted-acrylic side window, and the feature-set of the original DS-200, with a design focus on low-noise.
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AeroCool Also Announces the Unique GT-RS Chassis
In addition to the Cyclops Advance Black, AeroCool announced availability of two other cases this week, beginning with the GT-RS. It may come across as a cube-shaped micro-ATX or even a mini-ITX case, but is actually a cleverly designed ATX compact tower. Measuring 236 mm x 353 mm x 320 mm (WxDxH), the case seats a standard ATX motherboard upside down (BTX-style), but uses its width to accommodate PSU and drive bays along the plane of the motherboard. There's still room for standard-height graphics cards.
The case is split vertically in the middle, with its left-side compartment holding the drive bays: one each of exposed 5.25-inch and 3.5-inch; two discrete 3.5-inch, and 2.5-inch, each. There's room for CPU coolers as tall as 121 mm, and graphics cards as long as 300 mm. Ventilation includes two 120 mm front intakes, a red LED-lit 120 mm fan is included, and which can hold on to a 240 x 120 mm radiator; a 120 mm bottom intake, a 120 mm top exhaust, and an 80 mm rear exhaust. Front panel connectivity includes two USB 3.0 ports (standard header), two USB 2.0/1.1 ports (standard header), and HDA audio jacks. Expect a sub-$100 pricing.
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AeroCool Announces the Cyclops Advance Black Chassis
AeroCool announced three new cases this week, beginning with the Cyclops Advance Black. This ATX mid-tower measures 199 mm x 471 mm x 456 mm (WxDxH), and is made of SECC steel and matte-black ABS plastic, with a tinted acrylic side-panel window. The case offers roomy, all-black interiors, with a motherboard tray that has cutouts at all the right spots, and clearance for CPU coolers as tall as 155 mm, and add-on cards as long as 390 mm.
The Cyclops Advance Black from AeroCool offers two 5.25-inch drive bays, a 5.25-inch to 3.5-inch adapter; three 3.5-inch internal drive bays, and two stack-over 2.5-inch drive bays. Ventilation includes a 120 mm front intake, with a red LED-lit spinner being included; and a rear 120 mm exhaust (fan included). There are no side or top vents, which could either be a boon for those who don't need them, or a bane for those with liquid cooling setups. Front panel connectivity includes two USB 3.0 ports (standard header), and HDA audio jacks. Expect a sub-$50 price.
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AMD Readies 14 nm FinFET GPUs in 2016
At its ongoing Investor Day presentation, AMD announced that will continue to make GPUs for every segment of the market. The company is planning to leverage improvements to its Graphics CoreNext architecture for the foreseeable future, but is betting on a huge performance/Watt increase with its 2016 GPUs. The secret sauce here will be the shift to 14 nm FinFET process. It's important to note here, that AMD refrained from mentioning "14 nm," but the mention of FinFET is a reliable giveaway. AMD is expecting a 2x (100%) gain in performance/Watt over its current generation of GPUs, with the shift.
AMD's future GPUs will focus on several market inflection points, such as the arrival of CPU-efficient graphics APIs such as DirectX 12 and Vulkan, Windows 10 pulling users from Windows 7, 4K Ultra HD displays getting more affordable (perhaps even mainstream), which it believes will help it sell enough GPUs to return to profitability. The company also announced an unnamed major design win, which will take shape in this quarter, and which will hit the markets in 2016.
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AMD "Zen" Offers a 40% IPC Increase Over "Excavator"
In its Investor Day presentation, led by CEO Lisa Su, and CTO Mark Papermaster, AMD made a slew of careful, near-term product announcements, and market strategies. One of its announcements that strike us, is the company's emphasis on getting the CPU core design right. The company talked about its "Zen" CPU core architecture, not from a technical standpoint, on how it fits into the company's near-term. It turns out that the company is betting on a massive performance increase.
AMD announced that its "Zen" CPU core, will offer a massive 40 percent increase in IPC (instructions per clock) or in other words, performance/clock, over the existing "Excavator" CPU core architecture. Zen will introduce features such as SMT (simultaneous multi-threading), a brand new low-latency cache system, and will leverage the 14 nm FinFET process. The first products based on Zen will be desktop CPUs in the 6th generation FX processor family, which will be launched in 2016. AMD plans to unify the CPU and APU into one socket, which will be called AM4 (and not the previously thought of "FM3"). You'll be able to install both CPUs (which lack integrated graphics, but feature more CPU cores); and the company's 7th generation A-series APUs (which integrate both CPU and iGPUs), on the same kind of motherboards.
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(PR) TP-LINK Announces Availability of the RE210 AC750 Wi-Fi Range Extender
TP-LINK, a global provider of consumer and SMB networking products, today announced the availability of the RE210 AC750 Wi-Fi Range Extender with external antennas that offer better speed performance. With next-generation 802.11ac wireless technology, the RE210 boosts any Wi-Fi signal, enabling connectivity throughout the home.
"With the proliferation of laptops, smartphones, tablets and other connected devices in today's home, dependable wireless Internet is necessary," said Lewis Wu, executive vice president of TP-LINK USA. "The AC750 Wi-Fi Range Extender RE210 provides a stronger Wi-Fi signal, expanding coverage to every corner of the home and offering an Ethernet port that helps keep the entire family connected at gigabit speeds."
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(PR) MSI Unleashes 990FXA GAMING Socket AM3+ Motherboard
MSI, world leading in motherboard design, debuts the world's first USB 3.1 featured AMD GAMING motherboard, the 990FXA GAMING. Delivering blazing fast USB performance, up to 2 times faster than USB 3.0, the new 990FXA GAMING motherboard offers two USB 3.1 ports, which are fully backwards compatible with USB 3.0 and USB 2.0 devices.
Inheriting the outstanding DNA of MSI's award winning GAMING family, the new MSI AM3+ 990FXA GAMING motherboard features Killer LAN for the best online GAMING experience, Audio Boost 2 powered by Creative Sound Blaster Cinema 2 for astonishing sound quality that gives you the upper hand on the battlefield, USB Audio Power and a completely new hardware and software design for enhanced gaming performance. Get ready for high-end AMD GAMING with MSI.
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KFA2 Announces GeForce GTX 980 8Pack Edition
KFA2 announced a special edition of its GeForce GTX 980 HOF graphics card, designed by professional overclocker 8Pack. The new 8Pack Edition GTX 980 by KFA2 is one of the highest clocked cards out of the box, with 1304 MHz core, 1440 MHz GPU Boost, and an untouched 7.00 GHz memory, compared to reference clocks of 1127 MHz core and 1216 MHz GPU Boost. The card features a strong VRM that draws power from a pair of 8-pin PCIe power connectors, and a large triple-fan cooling solution. It features dual-BIOS with manual switching, letting you overclock by playing with the BIOS, with a failsafe BIOS at the push of a button. Available now, the KFA2 GTX 980 8Pack Edition is priced at 589 GBP (incl VAT). It's eligible for NVIDIA's new game bundle with game codes for "The Witcher 3: Wild Hunt" and "Batman: Arkham Knight."
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(PR) PNY Announces the HP x715w USB 3.0 Flash drive
Enjoy lightning speed and high-performance with the HP's latest USB flash drive-the HP x715w. PNY Technologies, world renowned manufacturing giant for USB and Memory products, has officially released the durable and stylish HP x715w USB 3.0 flash drive for storing and sharing your digital files. This thumb-sized drive is extremely lightweight and compact and can be easily carried around anywhere you go. Equipped with USB 3.0 hardware, you can transfer HD movies, images and documents in mere seconds.
The x715w comes encased in a shock-resistant and dustproof durable metallic casing. Its high-quality mirror finishing with electronic plating after printing technic features the HP logo engraved on the drive, which is present only on genuine PNY products and helps in distinguishing between counterfeit replacements. This ensures originality and PNY's top quality performance as promised, is not tampered with in any ways.
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(PR) Intel Announces Xeon E7 v3 Series Processors
Intel Corporation today announced the Intel Xeon processor E7-8800/4800 v3 product families, delivering accelerated business insight through real-time analytics and enhanced performance and reliability for mission-critical computing.
Real-time business intelligence is a top priority for companies across the full spectrum of industries, from healthcare to retail to telecommunications, among others. The need to rapidly extract actionable insight from large volumes of data is driving demand for new technologies for in-memory computing and big data analytics. Considering the current and future demand for in-memory computing, Gartner believes that revenue in this market will exceed $9.5 billion by year-end 2018, and at least 50 percent of large organizations will adopt in-memory computing to enable digital business strategies.
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Available Tags:AMD , GTX , SSD , CPU Cooler , CPU , MSI , GAMING , GeForce , USB 3.0 , HP , USB , Intel , Xeon ,
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