(PR) X2 Announces the X2.Kimera 4007 Gaming Keyboard
X2 proudly presents the X2.Kimera 4007 gaming keyboard. Featuring an aggressive and cool design with great performance and build out of top quality materials, this gaming keyboard has been studied to be strong and confortable at the same time. The large support base is created to keep the wrist in the correct position during a long gaming session, the big space bar key is build to never be missed hands down.
The keyboard's keys are also fitted with a changeable 3 colour backlight (blue, red, purple ). Backlight brightness control keys. The X2.Kimera 4007 gaming keyboard is desinged to enable users to react quickly & customize its performance for every game with its 26 antighost keys, and five macros custom keys (G1 ~ G5) you will never fail your next gaming mission.
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(PR) SanDisk Announces the Z400s SATA SSD for Embedded Applications
SanDisk Corporation, a global leader in flash storage solutions, today introduced the new SanDisk Z400s SSD, a cost effective solid-state drive (SSD) designed to replace hard-disk drives (HDDs) in computing platforms and embedded applications. PCs and embedded systems need consistent, reliable access to storage in order to meet business demands. The Z400s outperforms HDDs by 20x, while providing 5x the reliability with 20x lower average power consumption, all at a price point on par with HDDs. The SanDisk Z400s SSD joins the company's existing portfolio of flash-based solutions that are designed to deliver a delightful user experience and reliability at an affordable price point
"The Z400s represents a feat of engineering that addresses the needs of two distinct markets-PC OEM manufacturers and embedded application designers," said Rizwan Ahmed, senior director of product marketing, client platform solutions, SanDisk. "With a single architecture, SanDisk is able to provide OEMs with an affordable solution for displacing HDDs in today's cutting edge consumer devices, and help embedded application designers avoid overpaying for un-needed space-all while delivering the peak performance and high-reliability that only SSDs can supply."
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(PR) FSP Announces World's First Notebook Adapter with USB 3.0 Hub
FSP, the performance power specialist, today announces the first multifunction notebook adapter featuring a convenient built-in USB 3.0 hub: the NB H series. The NB H adds more convenience and usability to the world of notebook adapters. This full range (100~240V) adapter series includes built-in USB 3.0 ports to charge mobile devices and/or for increased laptop connectivity. This adapter is an excellent solution for popular ultrabooks and slim laptops that sacrifice USB ports for thinness.
The NH B uses only one power adapter for both charging and USB functionality, though does not require to be plugged in to work as a USB 3.0 hub. The NB H also maximizes compatibility, including various plug adapters to fit virtually any notebook. The NH B is only about the size of a glasses case and features a blue LED indicator light; its compact size and removable DC jack make it portable as well as useful.
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Colorful to Become World's Second Biggest Graphics Card Vendor in 2015: Report
PRC-based Colorful, which started out as (and continues to be) a vendor of wacky, over-the-top GeForce GTX graphics cards, has surpassed industry stalwarts MSI, ASUS and Gigabyte, in terms of graphics cards shipped worldwide this year, according to industry numbers published by DigiTimes. The report notes that Colorful could become the second largest graphics card maker in terms of shipments by the end of the year, next only to Palit (the current leader in terms of shipments).
Colorful has been clocking an average of 500,000 graphics cards shipped per month, and is projected to have shipped over 5 million cards in 2015. The company has currently outsold ASUS, MSI, Gigabyte, and ZOTAC, all of which are multinationals. Colorful has developed a strong brand-image in the Greater China region, particularly in the mainland. With a brand portfolio that includes Galaxy, Gainward, Point of View, and its own namesake, Palit is the biggest graphics card manufacturer by volume. Colorful's motherboard business is accelerating at a similar rate, and the report notes that the company could become "a very big threat" to ASUS and Gigabyte.
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(PR) G.Skill to Host 4th Annual OC World Record Stage at Computex 2015
G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and solid state storage, is hosting two major extreme overclocking events at Computex 2015 (June 2~6): the OC World Cup 2015 and the OC World Record Stage 2015! 19 world-class overclockers, 5 motherboard vendors, and 3 hardware sponsors - all at the G.SKILL Computex Booth I0608, located at Nangang Exhibition Hall, 1F.
Very special thanks to Intel, Samsung, and Kingpin Cooling for sponsoring the OC World Cup 2015 and the 4th Annual OC World Record Stage extreme overclocking events. "Intel is pleased to be a sponsor of this year's G.SKILL OC World Cup & 4th Annual OC World Record Stage at Computex 2015," says Gregory Bryant, Corporate Vice President and General Manager, Intel Corporation. "Intel processors and chipsets enable mind-blowing experiences and we are glad to be a part of this exciting event."
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(PR) OWC Announces Accelsior S PCIe-SATA Riser Board
Other World Computing announced today the Accelsior S, a new PCIe card with direct mount support for a 2.5" SATA 6Gb/s SSD. The latest addition to OWC's award-winning Accelsior line enables PC, Mac Pro tower and Thunderbolt interface expansion chassis users to quickly and easily add additional storage. Utilizing the robust PCIe architecture, the Accelsior S card offers both storage expansion and 6Gb/s speeds up to 550MB/s - more than double the performance of SATA 3Gb/s.
When equipped with the Accelsior S PCIe card and an SSD, Mac Pro tower and PC users can launch, capture, render and process I/O-intensive apps without long wait times. The Accelsior S PCIe card is also extremely easy to install - no drivers or software are required.
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(PR) Thermaltake Announces the Suppressor F51 Mid-tower Chassis
Thermaltake, an industry leader in computer chassis, thermal solutions, and power supply units, has unveiled the Suppressor F51 window/non-window mid-tower chassis, the latest series to the Thermaltake case line. Featuring leading-edge sound reduction panels on all sides, expand your cooling options with removable panels for the perfect balance in silent operation and cooling performance.
The Suppressor F51 supports a range of motherboard platforms from Mini ITX to E-ATX solutions, unrivaled liquid cooling expansion and expandability for all high-end GPU solutions users. The Suppressor F51 will also be on display from June 2nd to June 6th at COMPUTEX Taipei 2015 at Taipei World Trade Center Nangang Exhibition Hall 4th floor, Booth M110.
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Intel's Post-2017 "Purley" Enterprise Platform Detailed
Intel's future enterprise computing business, post-2017, could see a unification of its 2-socket (2S), 4-socket (4S), and >8-socket (8S+) platforms unify into one, codenamed "Purley." The platform will consist of multiple SKUs, but a common socket type (Socket-P), and a new interconnect technology replacing InfiniBand, which will wire the sockets and core-logic across multiple server blades, together. Called Omni-Path Interconnect, the tech appears to be fiber-optic at the physical layer, with extremely thin cables, and bandwidths could start at 100 Gbps, for the first generation. The controller driving it will be codenamed "Storm Lake." The inter-socket communication will be care of a newer 10.4 GT/s UPI interconnect, each socket will feature three such UPI channels. The platform will support up to eight sockets per blade, with more sockets across neighboring blades over Omni-Path.
"Purley" will feature a new platform core-logic, in the form of the "Lewisburg" PCH. It will feature the new DMI3 chipset-bus, which is PCI-Express 3.0 x4 at the physical layer. This chipset will support up to four 10 GbE interfaces. On the processor front, will be as processors based on the "Skylake" micro-architecture. Intel will carve out several silicons based on "Skylake," the biggest one will feature 28 physical CPU cores, with HyperThreading enabling 56 logical CPUs, and for the first time, a six-channel (384-bit wide) DDR4 integrated memory controller, with support for DDR4-2666. On the flip side, this IMC only supports one DIMM per channel (DPC). The 3DPC support from previous platforms is gone. These chips will be built on the 14 nm silicon fab process, and their TDP will range between 45W and 165W, depending on the number of cores and clock speeds.
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Available Tags:Gaming , Keyboard , SATA , SSD , USB 3.0 , Notebook , USB , Thermaltake ,
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