Friday, September 2, 2011

IT News Head Lines (X-bit labs) 02/09/2011

X-bit labs



DRAM Makers Should Consolidate amid Lowering DRAM Pricing, Say Observers
As DRAM Prices Collapse, Chipmakers Should Merge or Die

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Globalfoundries and Amkor to Develop Advanced 3D Packaging Technologies for Future Chips
Globalfoundries and Amkor to Collaborate on Assembly and Test Solutions for Next-Gen Chips

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Sony Introduces World's First Head-Mounted Stereo-3D Display
Sony Unveils Head Mounted Display "Personal 3D Viewer"

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Game Publishers Disagree Over Necessity of Next-Gen Consoles
EA: Gamers Are Happy Now; Ex-Activision: Next-Gen Consoles Needed to Boost the Market

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Renesas Enables Ultra-Fast External Storage with New Chip
Renesas Announces World's First USB 3.0-to-SATA-600 Bridge Chip

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Nvidia Experiments with Video Games Streaming from PC to Tablet
Nvidia May Enable High-End Crysis 2-Like Games on Tablets

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When SSD Meets HDD: OCZ Introduces Its First Hybrid Storage Device
OCZ Announced PCI Express Based Hybrid Storage System

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Popularity of Stereo-3D LCD Panels Growth by Over Two Times in One Quarter
Shipments of Stereo-3D LCD Panels Grew 124% Sequentially in Q2 2011

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HP to Continue Making TouchPad Tablets for Several Months
HP to Sell TouchPad Tablets Till October 31, 2011

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AMD's Highly-Anticipated Bulldozer Chips May Face Further Delay
AMD's FX-Series May Face Delay as AMD Does Not Confirm Revenue Shipments of New Opterons

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Available Tags:3D , Sony , Nvidia , Tablet , SSD , OCZ , HP ,

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