(PR) Sparkle Announces GeForce GTX 570 V-Go Graphics Card
After the successful launch of the World's First Independent Produced GeForce GTX 580 V-Go Graphics Card, SPARKLE Computer Co., Ltd., the professional VGA card manufacturer and supplier, today announced the GeForce GTX 570 V-Go Graphics Card, becoming the world's first manufacturer who can independently produce high-end graphics cards using Fermi 2.0 architecture. "V-Go, the series is represent the independent produced graphics cards, inherit the expertise spirit on graphics cards manufacturing for 16 years" said Kevin Wang the General Manager of SPARKLE ."We are pleased with the new high level of SPARKLE R&D and production capabilities. As another masterpiece of V-Go series, GeForce GTX 570 V-Go Graphics Cards inherit the blood of Fermi 2.0 Architecture also has a better price advantage."
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AMD Revising Radeon HD 6900 Series PCB
AMD is planning a revised Radeon HD 6900 series reference-design PCB. It is reported that the delays which short-supply of TI-made driver-MOSFETs caused have been tided over with, giving AMD the opportunity to redesign the PCB to make use of the more cost-effective yet high-performance VRM circuitry. AMD is reported to have used expensive Volterra-made digital PWM chippery as a last-ditch effort to release the Radeon HD 6900 series in time for the X'mas shopping season, after TI-made VRM components couldn't make it to foundry-partners in time (which caused the launch delay in November, 2010). The redesigned PCB with its new TI-made direct-MOSFETs (DrMOS) could also present an opportunity for AMD to patch the Radeon HD 6950, making stream processor unlocking using BIOS flashing impossible, notes the source. This development surfaced after water-cooling major Swiftech announced that it delayed the launch of its Radeon HD 6900 series full-coverage water block because AMD is revising its PCB design.
Source: Plaza.fl
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AMD FX Making a Comeback, to Challenge Intel Core i7 Extreme Edition
Come 2011, and AMD is looking to give Intel its much awaited fightback at all market segments of consumer processors including the enthusiast-grade models. It will be made possible with AMD's new Bulldozer architecture, which gives the processor a much higher degree of inter-core integration, sharing of common components, higher instructions per clock-cycle, and Advanced Vector Extensions (AVX). AMD's Bulldozer "Zambezi" desktop chips will be reportedly available in two ultra high-end SKUs: the 8-core AMD Vision Black FX, and performance segment AMD Vision Ultimate FX. AMD suspended the use of "FX" identifier with its Phenom and Phenom II series processors, because it couldn't compete in higher-end market segments, and didn't want to dilute the "FX" identifier. It was replaced with "Black Edition" to help identify models with unlocked BClk multipliers. AMD's Vision Black FX processors will be competitive with Intel's highest-end processors, including Extreme Edition models.
Source: DonanimHaber
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Intel Readies Pair of New X58 Extreme Series Desktop Boards
Intel's Desktop Board division is readying two new high-end socket LGA1366 motherboards under its Extreme Series line. The company's last high-end LGA1366 motherboard, the DX58SO "SmackOver", was released more than 25 months ago in November 2008, when the first Intel Core i7 processors came to be. The new motherboards are up to date in terms of features. They use the latest Rev. 13 X58 northbridge, all solid-state capacitors, support the latest LGA1366 processors out of the box, and feature USB 3.0 and SATA 6 Gb/s support. The two motherboards consist of DX58SO2 "SmackOver II", and its "lite" variant, the DX58OG.
The DX58SO2 uses digital PWM CPU power circuit, a sporty blue heatsink cluster over the northbridge, VRM area, and southbridge, with heat spread between the northbridge and VRM using a heat-pipe. It features six internal SATA 3 Gb/s, two internal SATA 6 Gb/s, and two eSATA 3 Gb/s ports, two USB 3.0 ports, 8-channel HD audio, and expansion slots that include three PCI-Express 2.0 x16 (x16/x16/NC or x16/x8/x8), two PCI-E x1, and one PCI.
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Galaxy Readies its First Consumer SSDs
Graphics card specialist Galaxy Tech is venturing into other kinds of gaming PC hardware. The company is ready with its first line of solid-state drives. The Galaxy SATA line of SSDs come in the 2.5" SATA 3 Gb/s form-factor, in capacities of 32 GB, 64 GB, 128 GB, and 256 GB. The SSD controller supports the TRIM garbage collection feature. Typically, these drives give read/write speeds of 240 MB/s (read) and 210 MB/s (write). The company did not give out any further information, but we hope to hear more at CES.
Source: Expreview
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Kingston Readies HyperX Genesis DDR3 Memory Series for Sandy Bridge
Memory major Kingston Technology is ready to greet Intel's 2011 Core processor family with a new line of DDR3 memory kits tailored for it. The HyperX Genesis, as it's called, combines faster, lower-latency, and lower-voltage DDR3 memory with a new sporty-looking heatsink design that keeps the modules cool while maintaining standard module height. The heatsink is basically two sheets of metal interlocked at the top, with rows of holes to draw in convectional air currents, to cool the heatsink. Kingston's new HyperX Genesis series is expected to be out in early January, 2011.
A video presentation showing the modules from almost all angles follows.
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Prepare for Motherboard Price-Hike
With the entire PC motherboard industry concentrated in Taiwan and China, it is valid to say that PC prices are pretty-much pegged to Taiwan's economy. Following a wave of labor-reforms in China and Taiwan coupled with deficit of skilled labor, and inflation added to the mix; key motherboard manufacturers are finding it difficult to cope with competitive motherboard pricing. A much smaller contributor to this is Intel's decision to phase out cheap G31 chipsets, making manufacturers buy slightly costlier G41 ones for the most common motherboard models.
Industry sources told Digitimes that the big three in the motherboard industry - ASUS, Gigabyte and MSI, will be hiking prices of their motherboards shortly, to cope with increasing raw-material, labor, and component costs. The price-hike is likely to increase prices by 10% on average in the next three months. Some higher-end models could increase by as much as 20%, if labor costs in China continue to rise. Another factor here is bulk manufacturers of printed circuit boards (PCBs), who have hiked their prices following increase in price of high-grade copper by a whopping 50% (from US $6000 /ton to $9000 /ton).
Sources: DigiTimes, OCWorkbench
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AMD Mobility Radeon HD 7000 Series Reality by Q4-2011
Shortly after finishing off the top-order of its Radeon HD 6000 series desktop discrete graphics processors (GPUs), AMD is letting out information about its first line of GPUs built on the 28 nanometer fabrication process. The first products carrying the Mobility Radeon HD 7000 series brand identifiers are notebook GPUs in the MXM 3.0 form-factor. AMD is planning an entire lineup top-to-bottom to address almost all mobile computing market segments. At the very low end of course would be its Fusion accelerated processing units with GPUs embedded. On top of that is what follows.
The lineup begins with "Wimbledon", an ultra high-end mGPU. It has a 256-bit wide high-speed GDDR5 memory interface, 2-4 GB of dedicated memory, and 65W TDP. The DirectX 11 GPU will be about 25% faster than "Blackcomb", the Mobility HD 6000 series flagship. This is slated for Q2-2012. Next up is the high-end "Heathrow" mGPU, which has a 192-bit or 128-bit (selectable between variants) GDDR5 memory interface, 1-3 GB of dedicated memory, up to 45W TDP, and 30% higher performance compared to "Chelsea". This is slated for Q4-2011 (this should tell you that Radeon HD 7000 series will be in existence towards the end of 2011).
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(PR) PowerColor Announces Water Cooling-Ready Radeon HD 6970 LCS Graphics Card
TUL Corporation, a leading manufacturer of AMD graphics cards, announces the world's first liquid cooling solution for the HD6970 series. The PowerColor Liquid Cooling Solution (LCS) HD6970 2GB GDDR5 is once again working with renowned cooling manufacturer EKwaterblocks to bring the ultimate cooling solution to the HD6970. The offering aims to provide extraordinary thermal performance to enhance overclocking ability while allowing optimum system stability.
The PowerColor LCS HD6970 has a full water block mounted on the card, fully covering the key components which can be dissipate the heat from the copper base design. This allows the reduction of GPU temperatures under 50°C even under full load. PowerColor packages a high-flow 3/8" and 1/2" fittings (barbs) to maximize water flow with captured o-rings to prevent leakage. Gamers can customize their own liquid cooling system using these two fittings.
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