(PR) AMD Announces Executive Changes
AMD (NYSE:AMD) today announced that Rick Bergman is leaving AMD. President and CEO Rory Read will serve as interim general manager of AMD's Products Group. AMD also announced that Paul Struhsaker, 49, has joined the company to lead AMD's newly-formed commercial business division as the corporate vice president and general manager, Commercial Business Division.
Struhsaker will oversee product management and roadmap planning for AMD's server, high performance computing and embedded products. He joins AMD from Comcast, where he was senior vice president of engineering responsible for all set-top box platforms and video server applications for the Comcast Video Networks.
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(PR) Elpida Develops Industry's First 25 nm Process 4-Gigabit DDR3 SDRAM
Elpida Memory, Inc., the Japan-based third largest Dynamic Random Access Memory (DRAM) maker in the world, today announced it had completed development of the industry's first 25-nanometer (nm) process 4-gigabit DDR3 SDRAM. The new chip is also the smallest 4-gigabit DRAM. The new cutting-edge smallest available 4-gigabit chip uses ultra fine-width 25nm process migration technology. Back in May, Elpida finished development of a 2-gigabit DDR3 SDRAM using the advanced 25nm process and began sample shipments in July.
By using ultra-fine process technology the 4-gigabit DDR3 SDRAM becomes a more energy efficient chip and achieves higher productivity. As a 4-gigabit product, its density is double that of Elpida's 2-gigabit DDR3 SDRAM based on the same process node. The newly developed 4-gigabit DRAM enhances productivity by about 45% compared with Elpida's 30nm 4-gigabit DDR3 SDRAM. Compared with this same 30nm DDR3, it reduces operating current by about 25-30% and standby current by about 30-50%. It has also realized the industry's highest speed data transfer rate.
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(PR) Enermax Introduces ETD-T60 Series Bottom-Flow CPU Coolers
ENERMAX introduces a new down flow CPU cooler, the ETD-T60 series. ENERMAX thermal team presents the new CPU cooler, ETD-T60, with down flow solutions and thermal resistance down to 0.12°C/W; a breakthrough for down flow CPU coolers. ETD-T60 combines six Ø6mm heat pipes that cross from two sides of the heat sink with enhanced soldering technology to ensure flawless thermal conduction from CPU to heat sink. The fins of ETD-T60 series are added with ENERMAX’s unique VGF, VEF technology and Twister-bearing fan.
Furthermore, the ETD-T60 is attached with ENERMAX’s new patented AAP (Auto-Adjustable-Pressure) universal brackets. The AAP brackets support various CPU sockets and gives perfect contact force (18~28kgw) in between CPU and cooler. Thanks to AAP, the insufficient thermal conduction due to under-pressure or damage to CPU from over-pressure will no longer be an issue for users.
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'Warco', the First Person Shooter Without a Gun
Well, this looks different to your standard gaming offering. Warco, short for "war correspondent", is a game that's a first person shooter, but without a gun. Instead, you play journalist Jesse DeMarco thrust into the middle of battle, armed only with your wits and your trusty video camera, who is tasked with documenting the horrors of war. You then have to edit your footage into a compelling news story, ranging from all-action shootouts to quiet moments, as you discuss the events of the day with your fellow journalists. This appears to be more a trainer for how to be a war correspondent than a game, as it's the brainchild of Tony Maniaty, an Australian journalist who has reported from regions like East Timor and post-Soviet Eastern Europe.
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Intel to Reorganize its LGA1155 Core i7 Unlocked Processor Market Placement
In a possible bid to counter the upcoming AMD FX eight-core processors, Intel is reportedly reorganizing its Unlocked Core i7 processor series in the LGA1155 package. Currently there's only one Unlocked Core i7 LGA1155 processor model, the Core i7-2600K, and that is holding on to a US $320 price-point. It will be joined by the Core i7-2700K in the near future.
According to sources, this won't quite be a case of i7-2700K displacing the i7-2600K from its $320 price point, but that the new chip will occupy a slightly higher price point than the $320 the i7-2600K commands. According to the sources VR-Zone spoke with, the new i7-2700K could "end up somewhere close to US$340-350." It would then give Intel the flexibility to play with the price of the i7-2600K as the situation demands (letting the i7-2600K keep its $310~$320 price, or send it down below $300). Intel's Core i7-2700K is expected to launch on October 24, close to two weeks after AMD launches its first AMD FX processors.
Source: VR-Zone
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VIA Seeks US Ban of iPhone, iPad Over Patent Infringements
Taiwan-based low-power computing technology company VIA sought a sales ban of Apple's iPhone and iPad, for what it alleges to be patent infringements of its microprocessor intellectual property. VIA sought a jury trial along with a sales ban on Apple products containing the inventions in the U.S., according to a complaint filed yesterday in federal court in Wilmington, Delaware.
In its complaint VIA says "The products at issue generally concern microprocessors included in a variety of electronic products such as certain smartphones, tablet computers, portable media players and other computing devices." This specifically impinges upon Apple's cash-cow products, the iPhone and iPad, and it isn't coming at a good time because Apple, according to market analyst Gartner Inc., will dominate tablet sales this holiday season. The case is Via Technologies v. Apple Inc. (AAPL), U.S. District Court, District of Delaware (Wilmington).
Source: Bloomberg
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