ASUS M4A89GTD Pro / USB3 Motherboard Pictured
ASUS seems to be ready with one of its first motherboards based on the AMD 890GX chipset. This socket AM3 series of motherboards seems to come in two variants: M4A89GTD Pro and M4A89GTD Pro USB3 (with the latter having support for USB 3.0 SuperSpeed connectivity. An early development version of this motherboard was displayed at this year's CES event. Fresh pictures show a production-grade model, complete with chipset and VRM cooling, as well as a box design.
The M4A89GTD Pro / USB3 is a socket AM3 motherboard with a 10-phase CPU VRM supporting future AMD CPUs with 140W TDP, 2-phase memory VRM powering the four DDR3 DIMM slots, AMD 890GX chipset with faster DirectX 10.1 compliant graphics, and AMD SB800 southbridge. The SB800 provides six SATA 6 Gb/s ports, while an additional JMicron-made controller gives out the IDE connector (and possibly the lone eSATA port). Expansion slots include two PCI-E 2.0 x16 slots (x8/x8 when both are populated), two PCI, and one each of PCI-E x1 and PCI-E x4. Connectivity includes 8+2 channel HD audio with optical SPDIF output, gigabit Ethernet, USB 3.0 ports (on the USB3 variant), FireWire, and display connectivity including DVI, D-Sub, and HDMI. The M4A89GTD Pro / USB3 is expected to be launched a little ahead of AMD's launch of its six-core Phenom II X6 processors.
Source: Teknofrikik
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Phenom II X6 to Get C-State Performance Boost Feature
AMD's upcoming six-core desktop processor, the Phenom II X6, will introduce a new feature to the Phenom II series, currently known as "C-state performance boost". The feature gives the processor control over individual cores' power states, and the ability to gate power down completely a core. The remaining active core(s), will then be overclocked beyond the normal clock speeds, so that low-power operation with reduced parallel computing load goes on with much lesser energy consumption.
Features such as C-state performance boost and 'power-gating' is relatively new for AMD processors. The two were originally expected to be introduced with AMD's 32 nm "Llano" Fusion APUs. AMD's Phenom II X6 is expected to be released in May 2010, its architecture is derived from the six-core "Istanbul" Opteron processors, albeit in the socket AM3 package that supports dual-channel DDR3 memory. There are as many as four models in the works for an initial release. Known details of these can be found here.
Source: X-bit Labs
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(PR) Kingston Digital Ships Speedy Class 10 MicroSDHC Card
Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., the independent world leader in memory products, today announced the release of a 16GB microSDHC Class 10 card. The high-capacity card complies with the SD Association Specification 3.00 to meet Class 10 requirements. The 16GB microSDHC card has a minimum data transfer rate of 10MB/sec. and ships either as a stand-alone microSDHC card or with adapters.
"With the new speed class, host devices such as high-definition cameras or the latest smartphones are being designed to optimize their write performance to take advantage of the more responsive memory card speeds," said Wendy Lecot, Flash card business manager, Kingston. "Now that the Class 10 card specification is five times faster than a Class 2 card, users will see swifter copying and transferring of photos, music, videos and e-books when using a multi-format card reader such as the Kingston Media Reader or MobileLiteG2 with a PC.
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(PR) Transcend Upgrades 2.5-inch Solid State Drives with Tamper-Resistant Designs
Transcend Information, Inc., a global leader in storage and multimedia products, today announced a radical redesign of its 2.5-inch solid state drives (SSD). The updated SSDs now offer a superior outer casing and additional tamper-resistant features, making them the most reliable and secure alternatives to conventional hard disk drives.
Designed to deliver the highest level of quality, the new versions of Transcend's 2.5-inch SATA and IDE Solid State Drives provide customers with extra peace of mind, incorporating innovative tamper-resistant features, including an anti-counterfeit Transcend logo security hologram and tamper-evident seals. These new features assure the end-user receives a 100% genuine Transcend product that has never been tampered with or opened by unauthorized third parties or other customers, thus further guaranteeing the SSDs' authenticity and quality.
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(PR) GLOBALFOUNDRIES and ARM Define the Standard for Mobile Technology Platform Innovation
At the 2010 Mobile World Congress, GLOBALFOUNDRIES and ARM today unveiled new details on their leading-edge System-on-Chip (SoC) platform technology for powering the next generation of wireless products and applications. The new chip manufacturing platform is projected to enable a 40 percent increase in computing performance, a 30 percent decrease in power consumption, and a 100 percent increase in standby battery life. The new platform includes collaboration on two GLOBALFOUNDRIES process variants: 28nm super low power (SLP) for mobile and consumer applications and 28nm high performance (HP) for applications requiring maximum performance.
"The success of the next generation of mobile products will be increasingly dependent on their ability to deliver PC-class performance, a highly integrated rich media experience and longer battery life," said GLOBALFOUNDRIES chief operating officer Chia Song Hwee. "These demands are going to require a strong technology foundation and close collaboration between industry leaders to enable an increasing number of design companies to unlock this innovation. We are working closely with ARM to optimize the physical IP and implementation of the Cortex-A9 processor with our proven manufacturing experience in high-volume, advanced technology products, to deliver a fully integrated platform for leading-edge wireless products and applications."
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