(PR) Kingston Announces HyperX Savage Flash Drive
HyperX, a division of Kingston Technology Company, Inc., the independent world leader in memory products, today announced the launch of HyperX Savage USB Flash drive. The USB drive joins the HyperX Savage range of products including DRAM and SSDs, replacing the successful DataTraveler HyperX 3.0.
HyperX Savage USB Flash drive operates at exceptionally fast transfer speeds of up to 350MB/s read and 250MB/s write, and is available in 64GB, 128GB and 256GB capacities. The speedy USB 3.1 Gen. 1 (USB 3.0) Flash drive makes it great for users who want to spend less time waiting for files to transfer. HyperX Savage USB drive lets anyone store large digital files like movies, music, and hi-res images, quickly. It features a bold design with its sleek black casing and metallic red HyperX emblem. The drive both complements and is compatible with the latest desktops, notebooks and gaming consoles such as PS4 and Xbox One.
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(PR) Scythe Releases Fuma Twin-Tower CPU Cooler
Japanese cooling expert Scythe announces the availability of it's new Fuma Twin-Tower CPU-Cooler. The new model combines a compact Twin-Tower design with total height of mere 149 millimeters and impressive cooling performance. The compact tower-design allows the Scythe Fuma to easily fit into most on-market PC chassis, making it a great choice for both enthusiast and gaming systems. Fuma is supplied with two Scythe Slip Stream 120-mm PWM fans and another fan clip set for a third fan.
Scythe Engineers successfully created a compact but powerful Twin-Tower heatsink with a total height of 149 millimetres. The new Fuma utilizes 6 high-quality-copper-heatpipes with 6-millimeter diameter. Scythe has soldered the heatpipes to the solid copper-baseplate and the small cooler-block, to increase contact area and maximize the heat-transfer. Both copper-heatpipes and copper-base-plate have been nickel-plated in a final step.
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(PR) AMD Launches The "Boltzmann Initiative," Brings NVIDIA CUDA to FirePro
Building on its strategic investments in heterogeneous system architecture (HSA), AMD (NASDAQ: AMD) announced a suite of tools designed to ease development of high-performance, energy efficient heterogeneous computing systems. The "Boltzmann Initiative" leverages HSA's ability to harness both central processing units (CPU) and AMD FirePro graphics processing units (GPU) for maximum compute efficiency through software. The first results of the initiative are featured this week at SC15 and include the Heterogeneous Compute Compiler (HCC); a headless Linux driver and HSA runtime infrastructure for cluster-class, High Performance Computing (HPC); and the Heterogeneous-compute Interface for Portability (HIP) tool for porting CUDA-based applications to a common C++ programming model. The tools are designed to drive application performance across markets ranging from machine learning to molecular dynamics, and from oil and gas to visual effects and computer-generated imaging.
"AMD's Heterogeneous-compute Interface for Portability enables performance portability for the HPC community. The ability to take code that was written for one architecture and transfer it to another architecture without a negative impact on performance is extremely powerful," said Jim Belak, co-lead of the U.S. Department of Energy's Exascale Co-design Center in Extreme Materials and senior computational materials scientist at Lawrence Livermore National Laboratory. "The work AMD is doing to produce a high-performance compiler that sits below high-level programming models enables researchers to concentrate on solving problems and publishing groundbreaking research rather than worrying about hardware-specific optimizations."
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TechPowerUp News: AMD R9 380X, Faster Windows 10, and Steam Hardware
In this episode of TechPowerUp News, AMD's upcoming Radeon R9 380X graphics card, which could heat things up under the $300-mark; the major performance boost Windows 10 gets with its new build-10586; Steam Hardware finally hitting the shelves; and NVIDIA's new Jetson TX1 computing module for robots and drones, which leverage deep-learning.
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(PR) Q3-2015 VGA Market - AMD Recovers Market Share at NVIDIA's Expense: JPR
Jon Peddie Research (JPR), the industry's research and consulting firm for graphics and multimedia, announced estimated PC graphics add-in-board (AIB) shipments and suppliers' market share for Q3'15. Two big introductions came in the third quarter. AMD released their Radeon AIB lineup: the Fury series, powered by it new high-bandwidth memory (HBM), and the company's brand new Fiji GPU.
At Nvidia's GPU Technology Conference in Japan, the company revealed its next-generation GPU code-named "Pascal." AIBs based on Pascal will have up to 16GB of HBM2 with up to 1 TB/s bandwidth. JPR's AIB Report tracks PC add-in graphics boards (AIBs), which carry discrete graphics chips. AIBs are used in desktop PCs, workstations, servers, and other devices such as scientific instruments. They are sold directly to customers as aftermarket products, or are factory installed. In all cases, AIBs represent the higher end of the graphics industry using discrete chips and private high-speed memory, compared to the integrated GPUs in CPUs that share slower system memory.
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Available Tags:Kingston , CPU Cooler , CPU , AMD , NVIDIA , CUDA , FirePro , TechPowerUp , Windows , Steam , Hardware , Market Share ,
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