(PR) Razer Brings Intel RealSense Camera to VR and Game Streamers
Razer, a world leader in connected devices and software for gamers, is working with Intel to deliver a consumer-ready desktop and VR-enabled camera based on Intel RealSense technology for a wide range of experiential applications.
With Intel RealSense technology incorporated into a new Razer product design, users can expect to enjoy significantly enhanced game broadcasting and VR gaming capabilities. Among the novel features of this technology is automatic background removal, which allows game streamers and video conferencing users to remove or replace backgrounds for a more entertaining and immersive experience.
Intel RealSense Cameras are also capable of 3D scanning, motion and gesture recognition, allowing product designers to bring real-world objects and bodies into virtual spaces easily. Many more features and related applications are anticipated for the Intel RealSense technology-enabled Razer device.
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(PR) TP-LINK and Google Collaborate to Launch OnHub, a Router for a New Way to Wi-Fi
TP-LINK, a leading global provider of consumer and business networking products, has collaborated with Google to introduce OnHub, a router for the new way to Wi-Fi. OnHub is a new kind of router designed to keep up with the latest technology in the home, and help make Wi-Fi faster, more secure, and easy to use.
OnHub addresses some of the most significant challenges associated with Wi-Fi today. It's designed to be out in the open, where it works its best. It has fewer wires, a shell to keep cords tidy and lighting that is subtle and useful. OnHub's innovative antenna design combined with smart software continually work to enhance users' Wi-Fi connection. With its extensive router heritage, TP-LINK's expertise was an integral contribution to OnHub's design, in particular its unique circular antenna with 13 built-in, hidden antennas that reduce network interference and optimize network connectivity.
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Intel Readies First Consumer SSD Based on 3D Xpoint Memory
Intel plans to launch the first consumer SSD based on its new 3D Xpoint memory technology, a successor to NAND flash which promises exponential gains in performance and capacity, some time in 2016. The Intel-branded drive will be called Intel Optane, will come in modern form-factors such as M.2/NGFF, SATA-Express, PCI-Express (add-on card), and will take advantage of the new NVMe protocol. Early prototypes demoed at IDF already offer up to 5.5 times the throughput of NAND flash-based DC P3700 series SSDs, and we're only talking about single-queue performance. Compared to the queue depth of just 32 commands for AHCI, NVMe offers command queue depth of a staggering 65,535 commands. Since Micron Technology is the co-developer of 3D Xpoint, it's likely that we'll also see Micron/Crucial branded drives based on this tech.
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Intel Skylake Microarchitecture Detailed
The "Skylake" CPU microarchitecture is as much important to Intel as "Sandy Bridge" was, a few years ago. It allows Intel to facilitate mainstream adoption of the DDR4 memory standard (with DDR3 backwards compatibility encouraging cheap upgrades), and gives users IPC increases over older architectures. While users of Core "Haswell" processors and reasonably fast DDR3 memory will find "Skylake" a hard-sell, it should look appealing to users of much older chips, such as "Lynnfield," and perhaps even "Sandy Bridge."
The "Skylake" core is bigger than "Haswell," owing to wider pipelines, prefetcher improvements, more execution units, a bigger front-end with a higher-capacity branch predictor, cache optimizations, and an update to the way HyperThreading works. The instruction window is nearly 1.5x the size of Sandy Bridge, with an out-of-order execution window size of 224 (vs. 168 on Sandy Bridge), load/store sizes of 72/56 (vs. 64/36 on Sandy Bridge), 97 scheduler entries (vs. 56 on Sandy Bridge), and an allocation queue size of 64/thread (vs. 28/thread). The platform of "Skylake" is similar to that of its predecessor, with four notable changes - an integrated camera ISP with the chipset, DDR4 memory support, double the chipset bus bandwidth (64 Gb/s), and eDRAM support on certain CPU SKUs.
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(PR) Tenda AC15 Performance Router Arrives in the US Market
Tenda Technology Inc., a subsidiary of Shenzhen Tenda, a top networking brand, announces the AC15 performance router. Featuring IEEE 802.11ac, 1900Mbps Smart Dual-band Gigabit, the AC15 is designed for online entertainment, home networking with IoT, and multiple connected devices. The addition of Beamforming+ technology and three high-powered 3dBi antennas let you enjoy lag-free gaming and uninterrupted video streaming anytime, anywhere in your home. Additionally, the Smart WiFi management can turn your router and LED indicator on or off automatically to save power and reduce RF noise.
The AC15 is designed for HD video streaming and online gaming. It uses dual bands, multiple connections, multiple antennas, and dynamic adjustments to ensure each connected device is operating at its maximum speed. The router has a total speed of up to 1900Mbps. It delivers both 1300Mbps 802.11ac at 5GHz and 600Mbps 802.11n at 2.4 GHz concurrently. The Broadcom dual-core processor and DDR3 memory reduce latency for high-bandwidth operations, delivering a smooth, lag-free experience.
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(PR) G.SKILL Demos DDR4 4266MHz and DDR4 4133MHz Memory Kits
G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory solid state storage, power supplies, and gaming peripherals, demos two ultra-fast DDR4 memory kits at DDR4 4266MHz 8GB (2x4GB) and DDR4 4133MHz 8GB (2x4GB) extreme speed at the Intel IDF 2015 event this week.
Featuring the latest 6th Generation Intel Core processors and Z170 motherboards, G.SKILL is pushing dual channel DDR4 speed to new heights. The DDR4 4266MHz 8GB (2x4GB) kit is demoed on the Intel Core i7-6700K processor and ASRock Z170 OC Formula overclocking motherboard, while the DDR4 4133MHz kit is demoed on the Intel Core i7-6700K CPU and ASUS ROG Maximus VIII Hero motherboard. Both kits represent the fastest DDR4 memory speed ever seen on live air-cooling demo systems.
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(PR) Samsung Announces Its New USB Flash Drive Family
Samsung Electronics announced a new suite of slim and sophisticated USB Flash Drives (UFD) available in three ergonomic form factors, each equipped with robust Samsung NAND flash technology.
The introduction of this product line now provides customers with a more complete menu of branded memory products available from Samsung that currently include, a full line of SD and microSD memory cards, internal SSDs and portable SSD products. All of the USB 3.0 drives are also compatible with USB 2.0 and come in metal-based design equipped with Samsung's robust NAND flash and equipped with Samsung's 5-proof technologies and a 5 year warranty commencing on the date of purchase.
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Intel "Skylake" Die Layout Detailed
At the heart of the Core i7-6700K and Core i5-6600K quad-core processors, which made their debut at Gamescom earlier this month, is Intel's swanky new "Skylake-D" silicon, built on its new 14 nanometer silicon fab process. Intel released technical documents that give us a peek into the die layout of this chip. To begin with, the Skylake silicon is tiny, compared to its 22 nm predecessor, the Haswell-D (i7-4770K, i5-4670K, etc).
What also sets this chip apart from its predecessors, going all the way back to "Lynnfield" (and perhaps even "Nehalem,") is that it's a "square" die. The CPU component, made up of four cores based on the "Skylake" micro-architecture, is split into rows of two cores each, sitting across the chip's L3 cache. This is a departure from older layouts, in which a single file of four cores lined one side of the L3 cache. The integrated GPU, Intel's Gen9 iGPU core, takes up nearly as much die area as the CPU component. The uncore component (system agent, IMC, I/O, etc.) takes up the rest of the die. The integrated Gen9 iGPU features 24 execution units (EUs), spread across three EU-subslices of 8 EUs, each. This GPU supports DirectX 12 (feature level 12_1). We'll get you finer micro-architecture details very soon.
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(PR) Western Digital Also Announces WD Red Pro 6 TB Hard Drive for NAS
WD, a Western Digital company, and world leader in storage solutions, today announced the expansion of its award-winning WD Red Pro hard drive line with the release of 5 TB and 6 TB capacities. The WD Red Pro family is ideal for NAS (network attached storage) systems having up to 16 drive bays and serving businesses with more expansive storage needs than the standard WD Red drives.
Shipping now, WD Red Pro 5 and 6 TB drives leverage an enhanced design and 128 MB cache to deliver data transfer rates of 214 megabytes per second (MB/s). WD's NASware 3.0 features technology promoting data protection, high NAS performance and reliable integration. "WD is providing customers a full portfolio of high capacity NAS storage solutions (WD Red and WD Red Pro) for home, consumer and business NAS solutions," said Cindi Grace, senior vice president of WD storage technology group. "With the capacity expansion, there is now a path for customers to increase the storage density of their systems while knowing their data is protected with the most trusted and valued brand on the market."
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(PR) Western Digital Announces WD Black 6 TB Hard Drive
WD, a Western Digital company and a world leader in hard drives, today announced the expansion of its award-winning WD Black line of performance hard drives up to 6 TB capacity. Shipping now, the 3.5-inch, 7200 RPM drive is the perfect solution for gamers and professionals in need of high-performance desktop systems and workstations.
WD Black hard drives combine 7200 RPM spin speed, 128 MB cache, dual stage actuator technology, SATA 6 gigabits per second (Gb/s) interface, and an integrated dual processor to deliver ultimate performance in a maximum-capacity drive. The WD Black 6TB is up to 29% faster than the previous WD Black 4TB version in maximum data rate throughput and 10% faster in PCMark Vantage.
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(PR) Cooler Master Launches MasterCase 5 & Pro 5 with FreeForm Technology
Cooler Master is excited to announce the availability of the MasterCase 5 and MasterCase Pro 5, the world's first mid-sized modular towers with exterior expandability, made possible with accessories purchased separately. Debuting at Computex 2015, the MasterCase ushers in a new era of products with FreeForm Modular System that offers unparalleled control over form and function.
Speaking on the occasion, Mr. Raymen Wu, Global Marketing Director said, "The MasterCase represents the first of a new wave of products with our unique FreeForm technology that enables endless build possibilities. Launched in tandem with the new slogan 'Make It Yours.', we kicked off a new drive to harness the maker spirit in our products and community. FreeForm will be applied across all of our products in the near future ensuring you have the freedom to fully express yourself."
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AMD GPUs Show Strong DirectX 12 Performance on "Ashes of the Singularity"
Stardock's "Ashes of the Singularity" may not be particularly pathbreaking as an RTS, in the Starcraft era, but has the distinction of being the first game to the market with a DirectX 12 renderer, in addition to its default DirectX 11 one. This gave gamers the first peak at API to API comparisons, to test the tall bare-metal optimizations of DirectX 12, and as it turns out, AMD GPUs do seem to benefit big.
In a GeForce GTX 980 vs. Radeon R9 390X comparison by PC Perspective, the game seems to perform rather poorly on its default DirectX 11 renderer for the R9 390X, which when switched to DirectX 12, not only takes a big leap (in excess of 30%) in frame-rates, but also outperforms the GTX 980. A skeptical way of looking at these results would be that the R9 390X isn't optimized for the D3D 11 renderer to begin with, and merely returns to its expected performance vs. the GTX 980, with the D3D 12 renderer.
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Available Tags:Intel , Google , Router , SSD , 3D , DDR4 , DDR4 , Samsung , USB , Western Digital , Western Digital , Cooler Master , AMD ,
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