ASRock Announces X99 WS-E Socket LGA2011v3 Motherboard
ASRock announced its latest high-end socket LGA2011v3 motherboard for enthusiast PC/workstation builds, the X99 WS-E. Built in the EATX form-factor, this board is driven by Intel X99 Express chipset, and can run the company's Core i7 "Haswell-E" HEDT, and Xeon E5-2600 series "Haswell-EP" processors, out of the box. The board draws power from a 24-pin ATX, an 8-pin EPS, and two optional 4-pin Molex connectors. It offers a 12-phase CPU VRM, and a 4-phase memory VRM. The CPU socket is wired to eight DDR4 DIMM slots, which can seat up to 128 GB of quad-channel memory.
Expansion slots include seven PCI-Express 3.0 x16. The board features two PLX PEX-8747 bridge chips, which take in two x16 links from the CPU, and turn them into a total of four Gen 3.0 x16 slots that run at x16 bandwidth all the time. A third PCIe 3.0 x8 slot from the CPU is directly wired out. Both these PEX-8747 chips have bypass slots, so if you have just two VGA cards and want direct paths between them and the CPU, you can have it your way. Storage includes a total of 10 SATA 6 Gb/s ports driven by the PCH, from which two convert to a single SATA-Express connector, two additional 6 Gb/s ports from a Marvell-made controller, and an M.2 (physical PCIe 2.0 x4) slot.
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(PR) HyperX Releases FURY DDR4 Memory; Adds High-capacity Predator DDR4 Kits
HyperX, a division of Kingston Technology Company, Inc., the independent world leader in memory products, today announced HyperX FURY DDR4 memory. HyperX FURY DDR4 is the first product line to offer automatic overclocking via plug-and-play functionality for the next generation of high-end desktops featuring the Intel X99 chipset and Haswell-E processors. HyperX FURY DDR4 is available in 2133MHz, 2400MHz and 2666MHz frequencies, and in various kits configurations from 8GB to 64GB.
HyperX FURY DDR4 memory is a cost-efficient high-performance upgrade for Intel 6- and 8-core processors and helps to provide faster video editing, 3D rendering, gaming and AI processing. It takes full advantage of the power efficiency of DDR4 with low 1.2V settings. HyperX FURY DDR4 features a low profile heat spreader in the signature FURY asymmetrical design with black PCB to stand out and complement the latest PC hardware designs.
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(PR) EVGA Announces GeForce GTX 960 SSC 4GB
The EVGA GeForce GTX 960 delivers incredible performance, power efficiency, and gaming technologies that only NVIDIA Maxwell technology can offer. This is the perfect upgrade, offering 60% faster performance and twice the power efficiency of previous-generation cards*. Plus, it features VXGI for realistic lighting, support for smooth, tear-free NVIDIA G-SYNC technology, and Dynamic Super Resolution for 4K-quality gaming on 1080P displays. These new versions come outfitted with 4GB of high speed GDDR5 memory giving you higher texture qualities and better 4K performance.
The new EVGA ACX 2.0+ cooler brings new features to the award winning EVGA ACX 2.0 cooling technology. A Memory MOSFET Cooling Plate (MMCP) reduces MOSFET temperatures up to 11°C, and optimized Straight Heat Pipes (SHP) reduce GPU temperature by 5°C. ACX 2.0+ coolers also feature optimized Swept fan blades, double ball bearings and an extreme low power motor, delivering more air flow with less power, unlocking additional power for the GPU.
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(PR) SYBER Announces Full Line of Steam Machines in Valve Booth at GDC
SYBER, a new division of CyberPowerPC, today announced a full line of Steam Machines during the Game Developers Conference (GDC) as part of Syber's open platform PC gaming systems. Steam Machines provide the best living room access to the greatest games and user-generated content available. Steam Machines offer the In-Home Streaming capabilities of the Steam Link, plus the ability to locally install and play your choice of over 1000 native SteamOS titles.
"For gamers who want to break out of the bedroom and into the comfort of the living room, the Syber Steam Machines offers the best performance at an affordable price," said Eric Cheung, CEO of CyberPowerPC. "We created the Syber Steam Machines to give gamers more power and more customization than the standard video game consoles like Sony PlayStation, Nintendo Wii and Microsoft Xbox," said Eddie Vong, VP of Product, CyberPowerPC.
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(PR) Tesoro Announces the Excalibur Spectrum Mechanical Keyboard
Tesoro Technology USA Inc., announces the Excalibur Spectrum mechanical keyboard, featuring individual key-specific customizability in 16.8 million colors.
The Excalibur Spectrum allows gamers to individually customize virtually any color, to any key. With 8 different LED effects, such as dimming, full zone, trigger, ripple, firework, radiation, rainbow wave, and per key customized mode as well as 5 levels of brightness and 5 distinct profiles to store them, there are endless combinations for a truly unique configuration.
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Inno3D Announces First 4 GB GeForce GTX 960 Graphics Card
Inno3D announced the first GeForce GTX 960 graphics card to feature 4 GB of video memory, double that of the standard 2 GB. The card features 4 GB of memory across the chip's 128-bit wide GDDR5 memory interface, running at reference clock speeds of 7.00 GHz. The GPU runs at 1126 MHz, with 1178 MHz GPU Boost. The card features Inno3D's in-house dual-fan cooling solution, featuring 0 dBA idle operation, and a detachable cooler shroud on which the card's two fans are suspended, letting you clean the heatsink underneath. Based on the 28 nm GM206 silicon, the GTX 960 offers 1024 CUDA cores, and a 128-bit wide memory bus. Inno3D didn't disclose pricing.
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(PR) SilentiumPC Announces Alea M50 Pure Black Case
SilentiumPC announced the Alea M50 Pure Black chassis. The new Alea M50 is the first gaming-cube type chassis from SilentiumPC. It fuses flexibility with simple yet classy exterior design. Outside plastic elements are coated with matte soft-touch layer adding premium feel while transparent widows on both sides allow for showcasing precious components of your beloved gaming rig.
Impressively roomy interior features a dual-chamber design for smart thermal management and support up to micro-ATX motherboards. There are virtually no limitations in choosing other components as the M50 will fit up to 360mm long graphics cards and massive 200mm CPU coolers. Users can also install up to 4 x 2,5" HDD/SSD or 2 x 2,5" SSD + 3 x 3,5" HDD, there is also external 5,25" drive bay available for DVD burners or fan controllers.
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(PR) HGST Announces Definitive Agreement To Acquire Amplidata
Western Digital Corporation announced today that HGST has entered into a definitive agreement to acquire Amplidata, a privately-held developer of object storage software for public and private cloud data centers. Financial terms of the transaction were not disclosed. HGST is a wholly owned subsidiary of Western Digital Corp. The acquisition supports the company's strategy to expand into higher value data storage platforms and systems that deliver breakthrough value and scalability to address the massive growth in storage requirements in cloud data centers.
Amplidata's primary offering is Himalaya, an advanced object storage software product that enables scale-out software-defined storage systems. By delivering industry leading scalability with the efficiency, resiliency, and flexibility required for demanding cloud data center environments, Amplidata's products and technology have earned the trust of leading OEMs and cloud service providers.
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AMD Releases Mantle Programming Guide and Reference API
AMD announced that it published the complete 450-page programming guide for its Mantle 3D graphics API, and the reference API itself. The two can be accessed from here. In the run up to its GDC 2015 presentation, in a blog post written by the company's top technology exec Raja Koduri, the company said it will talk about the future of Mantle in its GDC presentation. The company intends to develop, maintain and support Mantle and its eco-system, while maintaining that it will participate in the development and support of industry-standard APIs such as DirectX 12 and GLnext (the next major version of OpenGL).
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(PR) Micron Technology Breaks Ground on Expansion of Singapore NAND Flash Facility
Micron Technology, Inc., today hosted a groundbreaking ceremony with company and Singapore government officials to begin the expansion of its Singapore NAND flash memory fabrication facility.
Previously announced by the company in December, the approximate 255,000 square foot expansion will facilitate efficient implementation of 3D NAND production at the Singapore facility and give Micron the flexibility to gradually add incremental capacity in response to market requirements. In addition, the space will enable production of storage class and other memory technologies.
"Micron enjoys a strong relationship with Singapore where we employ more than 7,000 team members operating at four major facilities," said Micron President Mark Adams. "We're excited to expand our manufacturing footprint in Singapore, and we commend the government and Economic Development Board for fostering such a productive business environment."
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Sapphire Rolls Out Radeon R7 260X iCafe OC Graphics Card
Sapphire rolled out the entry-mid range Radeon R7 260X iCafe OC graphics card for casual-gaming PC builds (eg: low-cost Counter Strike gaming kiosks). Pictured below, the card looks rather premium, with its full-length, dual-slot cooler. That is, until you take a peek under its plastic shroud to find a cost-effective fan-heatsink cooling the GPU, with radially-projecting aluminium fins, a copper core base, and an 80 mm fan ventilating it.
The card draws power from a single 6-pin PCIe power connector; outputs include one each of dual-link DVI, HDMI 1.4a, and DisplayPort 1.2a. The card offers a factory-overclock of 1050 MHz core, and an untouched 5.00 GHz memory, against reference clocks of 1000 MHz on the core. Based on the 28 nm "Bonaire" silicon, the R7 260X offers 896 Graphics CoreNext stream processors, and a 128-bit wide GDDR5 memory interface, holding 2 GB of memory on this card. Expect a $100-ish pricing.
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(PR) Intel Announces Atom x3, x5, and x7 Series
Intel Corporation CEO Brian Krzanich today announced a series of mobile platforms including the company's new low-cost system-on-chip (SoC) for phones, phablets and tablets, a global LTE solution, innovative personal computing experiences, and a range of customers for mobile device and network infrastructure offerings. With technologies that span silicon, software and security, Krzanich said Intel was one of the few companies able to deliver solutions end-to-end, for devices, the network and the cloud.
The announcements include the Intel Atom x3 processor series, Intel's first integrated communications SoC solution for the growing value and entry device markets, and the five-mode Intel XMM 7360 LTE Advanced solution, designed for performance and worldwide coverage. In addition, Krzanich highlighted joint efforts with Alcatel-Lucent, Ericsson and Huawei to address the demand for new telecommunications, cloud and data center services, improve network efficiencies, and accelerate the industry's move toward a software-defined infrastructure.
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(PR) Phanteks Announces Enthoo EVOLV ITX Chassis
Phanteks introduce their first Mini ITX, a budget oriented chassis that uses metal exterior, to their EVOLV lineup in the Enthoo Series. The case has many useful features, such as a unique bracket solution for a radiator on top and a multi-functional mid plate bracket for a reservoir, pump, and SSD/HDD.
The Enthoo EVOLV ITX retains the minimalist design from the original EVOLV and features a metal exterior. The case measures at 9.1 x 14.8 x 15.6 inches and is equipped with 1x PH-F200SP fan, front I/O port, 1x SSD Bracket, and 2x 3.5" removable HDD bracket.
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Available Tags:ASRock , DDR4 , DDR4 , EVGA , GeForce , GTX , Steam , Valve , Keyboard , AMD , Sapphire , Radeon , Intel ,
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