BIOSTAR Launches Gaming Z97X Motherboard
BIOSTAR has launched its latest motherboard for Intel based systems, the Gaming Z97X. This motherboard represents the first attempt by BIOSTAR at a motherboard designed specifically for gamers "from the ground up to be cool looking and high performing." The board has support for socket 1150 processors in an ATX form factor with three PCIe 3.0 x16 slots, PCIe M.2 support, dual gigabit Ethernet, and BIOSTAR Super Hi-Fi Audio. Also included is the Gaming Commander box, a device that fits in a standard CD-ROM slot on your case with several interesting features. Users will have access to microphone in and audio out jacks with a built-in USB DAC, volume control buttons, and various temperature indicators.
Source: Press Release
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HyperX Announces Cloud II Gaming Headset
HyperX has announced its latest gaming peripheral, the Cloud II headset, delivering updates and improved performance over the previous generation Cloud headset. The headset uses a USB sound card audio control box to deliver hardware based 7.1 virtual surround sound. Users will have full control over their sound with separate controls for audio and microphone as well as a toggle switch for 7.1 sound. The sound card also provides "noise cancellation, auto gain control and echo cancellation," while the headband and ear cups are made of 100% memory to provide comfort when wearing them for long periods of time. The Cloud II is compatible with PC, Mac, PS4, and Xbox One.
Source: Press Release
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Mapping Temperatures in Transistors
We all know how important it is to keep our electronics cool, and on the macroscale, this is not hard to achieve. On the microscale however, it is more difficult because even measuring the temperature of the components is a challenge. Researchers at the University of Southern California though have found an ingenious way to make those measurements, which should translate to the semiconductor industry easily.
Part of what makes it so hard to measure the temperature of a microelectronic device, like a transistor, is that a temperature probe will actually affect the temperature of the system. This makes accurate measurements impossible, so simulations have been used to infer temperatures within devices. The California researchers realized a way to make the measurements without a temperature probe by using an electron microscope. When the temperature of a material changes, so too does its volume and density, which is what the researchers are measuring with a transmission electron microscope. The electrons from the microscope creates plasmons in the material, which shift depending on its density, and now these shifts have been analyzed closely enough to make local temperature measurements.
Among the advantages of this new technique, named Plasmon Energy Expansion Thermometry, is that it can measure temperatures within a device, like a transistor, and not just on its surface. Semiconductor manufacturers already use transmission electron microscopes to measure the size of their devices, so measuring temperatures should not be too difficult for them to do as well. The research has so far been done with aluminum, so the next step is to translate the technique to other materials, including silicon.
Source: University of Southern California via EurekAlert!
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ADM 2.4 Beta Released by ASUSTOR
ASUSTOR, a leading innovator and provider of network storage solutions, has just released the beta version of ADM 2.4. This latest version of the exclusive operating system for ASUSTOR NAS devices includes a variety of new functions such as an improved shared folder encryption mechanism, optimized performance for SSDs, newly added multimedia previews, and support for SNMP network management protocol. The beta version of ADM version 2.4 also includes an enhanced Network Defender that allows users to configure a trusted list of trusted IP addresses in addition to manually configuring black and white lists using the IP country or area of origin via the Geo IP expansion module.
The latest version of ADM is available for immediate download and is suitable for use on all ASUSTOR NAS devices.
Source: Press Release
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Super Bowl Halftime Show Powered by MAINGEAR System with Four GeForce GTX Titan Z GPUs
Although information surrounding the systems that power the Super Bowl is generally not revealed to the public, it has been announced this year that a custom system from MAINGEAR was used to run the Super Bowl halftime show. The system, which was needed to render animation at 3780 x 3024, was comprised of an Intel Core i7-5930K processor, an ASUS X-99E WS motherboard, 16GB of Corsair Vengeance DDR4 RAM, a Samsung 850 PRO 256GB SSD, two Corsair AX 1200i PSUs, and four NVIDIA GeForce GTX Titan Z GPUs in SLI. Cooling for the MAINGEAR system was provided through an all liquid cooling solution utilizing EK Water Block products.
Source: TweakTown
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Double the Distance of Fiber Optic Signals
Of all the data used by humanity, some 99% of it travels along optical fibers, and with demand for the Internet rising, the capacity of optical fibers becomes more and more important. One way to carry more information on optical fibers is to send multiple signals at different frequencies. The issue is that these separate optical channels will still interfere with each other, causing errors, but researchers at University College London have found a way to address it.
What the researchers achieved was a way to receive all of the optical channels together, effectively eliminating the interactions between them. The researchers have already tested it using a 16QAM super-channel and high-speed super-receiver, successfully receiving all of the channels without error. The researchers are next want to test with 64QAM, 256QAM, and 1024QAM, which are super-channels used for digital cable TV, cable modems, and Ethernet connections respectively. To add a bit more context to this advancement, currently optical signals can travel about 3190 Km without error. This method would increase the error-free distance to 5890 Km just be changing the receiver; without having to replace the optical cables, which can be an expensive endeavor.
Source: University College London
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Intel Plans to Bring 10nm Chips to Fruition in 2017
According to Taha Khalifa, the general manager for Intel in the Middle East and North Africa region, the company plans to launch its 10nm chips in early 2017. The first batch of 10nm processors, which will be code named Cannonlake and are the "Tick" in Intel’s "Tick Tock" cadence , are expected to offer SoC interconnect improvements such as shared coherent physical memory addresses and a more capable set of heterogeneous functionality. The 10nm chips will initially be integrated into tablet offerings and mobile devices, allowing these products to take on slimmer, lighter, and more elegant designs, all while using energy more efficiently. Mainstream and high performance 10nm chips will launch sometime afterwards, catering to other markets and consumers.
Time will tell if Intel is able to follow its current projection of launching 10nm chips in 2017, as Moore’s law continues to be difficult for semiconductor companies to keep up with.
Source: WCCFTech
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AMD's R9 300 Series Nearing Release; Early Details Leaked?
It looks like AMD isn't going to sit idly by in the video card world, as apparently it is planning to release the R9 300 series shortly. We may get the new cards this month even, or at the very least around the start of Spring. The flagship card will more than likely be the R9 390X running a Fiji XT core, with an R9 390 on a Fiji Pro core. Considering the R9 290X debuted as the flagship nearly 16 months ago, it is definitely time for AMD to get something new available. These R9 390X cards should be exceptionally fast, as they're expected to make use of SK Hynix's 3D stacked High Bandwidth Memory (HBM) to deliver up to four and a half times the bandwidth of GDDR5. This would mean 640GB/s of bandwidth on a 4096-bit bus and 1.25GT/s transfer rate, with a 1024-bit input/output interface. The R9 390X could have 4GB of HBM, along with 4096 GCN cores and maybe even a water cooler instead of an air cooler.
There is also rumor of a dual-GPU R9 395X2 planned for the end of the year, with a water cooler and $1499 price tag. First things first will be the R9 390X, 390, 380X, 380, 370X, 370, and R7 360 sometime in the next few months. We'll have to see exactly what these cards will be like and if they'll truly have that HBM memory on the 390X, but if so, they may be the new cards to consider. The other cards in the lineup will make use of GDDR5, with the R9 380X having 4GB on a 512-bit interface, the 370X running 3GB on a 384-bit interface, and the R7 360 featuring 2GB on a 256-bit interface.
Sources: WCCFTech [1], [2], [3], and KitGuru
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