(PR) THine's V-by-One HS Brings NVIDIA G-SYNC Technology to 4K Displays
THine Electronics, Inc., the global leader in high-speed serial interface technology and provider of mixed-signal large-scale integration semiconductors, today announced that its high-speed interface technology, V-by-One HS, will support NVIDIA G-SYNC Technology which synchronizes display refresh rates to the GPU, eliminating screen tearing and minimizing display stutter and input lag.
V-by-One HS Technology supports higher data transmission rates inside digital equipment like monitors while reducing the number of cables and connectors. The enhanced performance and lower costs of V-by-One HS has made it the internal interconnect choice of major 4Kx2K televisions and PC monitors. In May 2014, Acer announced the world's first 4Kx2K gaming monitor, the XB280HK, which integrates NVIDIA G-SYNC technology for a vivid and responsive gaming experience.
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(PR) Philips Launches New, 24-Inch and 27-Inch PowerSensor Displays
Philips announces two new PowerSensor displays that use intuitive human sensor technology to detect user presence and automatically reduce monitor brightness when users step away, reducing energy consumption by up to 80 percent while prolonging the life of the monitor. The eco-friendly 24- and 27-inch displays utilize the LCD backlight for better dimming control and offer superior color reproduction.
The EPEAT GOLD certified monitors are not only highly energy efficient, but also feature PVC-BFR free housing. The displays come in 24-inch (model 241B4LPYCB) and 27-inch (model 271S4LPYEB) screen sizes and are available now through distributors for $249.99 MSRP and $349.99 MSRP, respectively.
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NZXT Kraken X41 and Kraken X61 Liquid CPU Coolers Now Available
NZXT started selling its Kraken X41 and Kraken X61 "smart" liquid CPU coolers. Equipped with the ability to interface with NZXT's CAM software over USB, which lets you monitor/control coolant temperature, pressure, and fan-speeds; the two are among the first to ship with 140 mm radiators. The Kraken X41 features a 140 mm x 140 mm radiator, while the Kraken X41 features 140 mm x 280 mm. Both ship with NZXT's FX V2 PWM fans which spin at speeds between 800 and 2,000 RPM, pushing between 42.4 and 106.1 CFM of air, with noise output ranging between 20 and 37 dBA. The coolers are compatible with all modern CPU socket types, including LGA2011, LGA115x, AM3+, and FM2+. The Kraken X41 is priced at 99.99€, and the Kraken X61 at 124.99€.
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AMD to Launch FX-9590 Refresh Package
AMD is preparing a new retail package of its feisty FX-9590 eight-core processor, in a bid to woo crowds away from Intel's Core i7-4790K "Devil's Canyon" processor. The package combines an FX-9590, which till now was sold chip-only (without a cooling solution), with an Asetek-made liquid CPU cooler, for US $359. Given that without the cooler, the FX-9590 costs $319, the extra $40 for a liquid cooler adds great value. Based on the 32 nm "Vishera" silicon, the FX-9590 features eight CPU cores based on the "Piledriver" micro-architecture, clocked at 4.70 GHz, with Turbo Core speeds of 5.00 GHz; a dual-channel DDR3 integrated memory controller that natively supports DDR3-1866 MHz, 8 MB of total L2 cache, 8 MB of L3 cache; and modern instruction sets such as AVX, AES, FMA3, etc.
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(PR) SilentiumPC Launches the Affordable Brutus M25 Pure Black Case
Brutus M25 Pure Black fills the gap between generic and more expensive PC cases by offering plenty of features and quality at modest price point. Simple yet elegant exterior design appeals to most users while interior is able to accommodate modern components like graphics cards up to 320 mm or efficient CPU coolers up to 158 mm high. This compact mid-tower also features SD XC card reader, 3-position fan speed controller as well as HDD/SSD docking station up top. When building a budget gaming or office PC the Brutus M25 is the most sensible choice you can make.
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(PR) LEPA Introduces the LV12 CPU Coolers
LEPA announces a new product series, the LEPA LV12 CPU air cooler. The LV12 combines the Louver design and H.D.T (Heatpipe Direct Touch) technology to accelerate the heat dissipation. The S.N.T.C (Super Nano Thermal Conductive) coating and BOL (Barometric Oil-less) bearing offer silence performance and product life extension.
The LV12 provides excellent cooling performance with Rth 0.095oC/W by LEPA's in-house technologic innovation: the Louver design. These symmetric air vents on each fin create a "U-shape" airflow to increase the effective contact area and force the air to take more heat. Once the air flows into the fans, the Louver design creates more space to disperse the heat simultaneously.
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(PR) Micron Collaborates With Intel to Enhance "Knights Landing"
Micron Technology, Inc. (Nasdaq:MU), one of the world's leading providers of advanced semiconductor solutions, today announced an ongoing collaboration with Intel to deliver an on-package memory solution for Intel's next-generation Xeon Phi processor, codenamed Knights Landing. The memory solution is the result of a long-term effort between the two companies to break down the memory wall, leveraging the fundamental DRAM and stacking technologies also found in Micron's Hybrid Memory Cube products.
"The ecosystem is changing and the importance of scalable on-package memory and memory bandwidth is now coming to light," said Chirag Dekate, Research Manager at IDC. "Memory is at the heart of the solution space which will benefit both big compute and big data. This announcement is a clear validation of how Micron is advancing the role and impact of memory on systems and the value that 3D memory can deliver."
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(PR) Micron Technology Reports Results for Q3 of Fiscal 2014
Micron Technology, Inc., today announced results of operations for its third quarter of fiscal 2014, which ended May 29, 2014. Revenues for the third quarter of fiscal 2014 were $3.98 billion and were 3 percent lower compared to the second quarter of fiscal 2014 and 72 percent higher compared to the third quarter of fiscal 2013.
GAAP Income and Per Share Data - On a GAAP basis, net income attributable to Micron shareholders for the third quarter of fiscal 2014 was $806 million, or $0.68 per diluted share, compared to net income of $731 million, or $0.61 per diluted share, for the second quarter of fiscal 2014 and net income of $43 million, or $0.04 per diluted share, for the third quarter of fiscal 2013.
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(PR) Intel Details Its Next-Gen Xeon Phi Processor
Intel Corporation today announced new details for its next-generation Intel Xeon Phi processors, code-named Knights Landing, which promise to extend the benefits of code modernization investments being made for current generation products. These include a new high-speed fabric that will be integrated on-package and high-bandwidth, on-package memory that combined, promise to accelerate the rate of scientific discovery. Currently memory and fabrics are available as discrete components in servers limiting the performance and density of supercomputers.
The new interconnect technology, called Intel Omni Scale Fabric, is designed to address the requirements of the next generations of high-performance computing (HPC). Intel Omni Scale Fabric will be integrated in the next generation of Intel Xeon Phi processors as well as future general-purpose Intel Xeon processors. This integration along with the fabric's HPC-optimized architecture is designed to address the performance, scalability, reliability, power and density requirements of future HPC deployments. It is designed to balance price and performance for entry-level through extreme-scale deployments.
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(PR) QNAP Launches High-Performance & Scalable Turbo NAS TS-ECx80U-RP Series
QNAP Systems, Inc. today officially launched four new business-class Turbo NAS models: TS-EC880U-RP, TS-EC1280U-RP, TS-EC1680U-RP, and TS-EC2480U-RP. Delivering high-performance, extreme scalability options and a wide array of applications to drive businesses, these models easily fulfill mission-critical storage needs of businesses, with persistent throughput to balance resource-demanding applications.
Equipped with a Quad-Core Intel Xeon 3.4GHz processor, 4GB DDR3 ECC RAM and with 10GbE-readiness and SSD caching options (including up to two internal mSATA slots), these models are capable of providing up to 3,700 MB/s throughput and 410,000 IOPS to boost the workflow of IOPS-demanding applications such as virtualization and data center deployment. With a scalable design, administrators can gradually expand their total storage to over 680TB raw capacity (depends on models) on demand by connecting multiple QNAP RAID expansion enclosures (REXP-1600U-RP and REXP-1200U-RP). With this flexibility, businesses can be confident that these models will suit their storage requirements both now and in the future.
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(PR) AMD Announces Initial Settlement of Tender Offer for Its 8.125% Senior Notes
Advanced Micro Devices, Inc. (NYSE: AMD) announced today that AMD has settled all 8.125% Senior Notes due 2017 ("8.125% Notes") that were tendered, but not validly withdrawn, at or prior to 12:00 midnight, New York City time, on June 19, 2014 (the "Consent Deadline") pursuant to its previously announced tender offer (the "Tender Offer") and consent solicitation (the "Consent Solicitation") with respect to any and all of its outstanding 8.125% Notes. The Tender Offer will expire at 12:00 midnight, New York City time, on July 3, 2014 unless extended or earlier terminated by AMD.
Under the terms of the Tender Offer, holders of 8.125% Notes who (i) validly tendered their 8.125% Notes at or prior to the Consent Deadline and (ii) consented to certain proposed amendments (the "Proposed Amendments") in the Consent Solicitation to reduce the minimum notice period required in connection with redemption of 8.125% Notes from 30 days to 3 business days were entitled to receive a total payment of $1,045.88 for each $1,000 principal amount of 8.125% Notes purchased pursuant to the Tender Offer.
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(PR) AMD Introduces the FirePro W8100 Professional Graphics Card
AMD today launched the AMD FirePro W8100 professional graphics card, enabling new levels of workstation performance delivered by the company's second generation, industry-leading AMD Graphics Core Next (GCN) architecture. With nearly 38 times the performance of the closest competing product based on double precision testing, and powered by OpenCL, the AMD FirePro W8100 is designed for the next generation of 4K CAD (Computing Aided Design) and Media and Entertainment (M&E) workflows, engineering analysis and supercomputing applications.
Bolstering the AMD Professional Graphics product family with yet another productive workstation solution, the AMD FirePro W8100 features a best-in-class 8 GB of GDDR5 memory, up to 4.2 TFLOPS of single precision compute performance, and unmatched double precision compute performance of up to 2.1 TFLOPS.
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KFA2 Announces GeForce GTX 780 HOF OC+ 6GB
KFA2 launched an updated version of its factory-overclocked GeForce GTX 780 HOF (hall of fame) graphics card, the GTX 780 HOF OC+. Based on the same exact board design as the original, the card features clock speeds of 1019 MHz core (1006 MHz on the original, 863 MHz reference), 1071 MHz GPU Boost (1058 MHz on the original, 902 MHz reference); while leaving the memory untouched at 6.00 GHz. It features 6 GB of memory across the chip's 384-bit wide GDDR5 memory interface, double the standard memory amount. The company didn't announce pricing.
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(PR) Avago Technologies Limited to Acquire PLX Technology
Avago Technologies Limited and PLX Technology, Inc. today announced that they have entered into a definitive agreement under which Avago will acquire PLX, a leader in PCI Express silicon and software connectivity solutions, in an all-cash transaction valued at approximately $309 million, or $293 million net of cash and debt acquired.
Under the terms of the agreement, which was approved by the Boards of Directors of both companies, a subsidiary of Avago will commence a tender offer for all of the outstanding shares of PLX common stock for $6.50 per share in cash. Avago expects to fund the transaction with cash available on its balance sheet.
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(PR) HIS Announces Multi-View Series Display Controllers
Hightech Information System (HIS) today is pleased to announce the Multi-View Series. They can expand your visual horizon in style; you can view more, work better and enjoy more! Imagine surfing the web, screening emails, watching DVD and even working on presentation all at once without flipping through windows. Just plug in the HIS Multi-View and you instantly connect to a second screen!
Supporting up to 2048x1152 (2.4 MegaPixels) pixel resolution and 6 monitors connection at the same time, it's as easy as connecting a USB gadget. Once you have multi-monitors hookup, multi-tasking is far easier with better productivity. No matter you just want to have some extra screen area, watch HD movies with your computer or be an enthusiastic gamer, HIS Multi-View Series is your perfect companion.
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(PR) NVIDIA GPUs Open the Door to ARM64 Entry Into High Performance Computing
NVIDIA today announced that multiple server vendors are leveraging the performance of NVIDIA GPU accelerators to launch the world's first 64-bit ARM development systems for high performance computing (HPC).
ARM64 server processors were primarily designed for micro-servers and web servers because of their extreme energy efficiency. Now, they can tackle HPC-class workloads when paired with GPU accelerators using the NVIDIA CUDA 6.5 parallel programming platform, which supports 64-bit ARM processors.
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(PR) Apacer Rolls Out Full Industrial MicroSD/MicroSDHC Memory Card Lineup
As in 2014 wearable devices begin to emerge in the market, personal applications like communication and music are more compact. Besides, with these devices, users are now able to record and store physical function statistics such as their heartbeats, pulse rates, daily step numbers etc. This propelsthe vigorous development of medical and health industry. According to the prediction of market research firm IDC, "wearable devices will soon be widely applied in industries including retailing, construction, and mining by enterprises, in addition to their applications in medical industry." And the small and handy Micro SD/Micro SDHC memory cards will be the best choice for expanding mobile storage capacity.
In response tothe growth trend of mobile and wearable devices, Apacer launches industrial Micro SD/Micro SDHC memory cards which conform to SD 2.0 specifications. Although the size is only one-tenth of general SD card, the Micro SD/Micro SDHC memory cards have a complete range of product types, providing SLC and MLC chips for choice. The highly reliable SLC chips have capacities ranging from 256 MB to 4 GB, which best satisfy industrial devices' demand of small capacity and high stability as a system disk. The more economic MLC chips' capacities range from 4 GB to 32 GB, meeting the high-capacity storage needs.
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(PR) BIOSTAR's TB85 Ready for Work, Play or Bitcoin Mining
The newest motherboard based on the Intel B85 chipset by BIOSTAR is ready for work, play or to even literally make you money. The TB85 supports the Intel's 4th generation Core i7 and Core i5 processors in the 1150 package using the Intel B85 single chip architecture. The TB85 includes many features that are useful for IT departments in larger companies as well as small firms. BIOSTAR's TB85 boards deliver a business-rich option at a value price compared to the other companies.
The TB85 also offers a perfect choice for "Bitcoin Mining" with six PCI-E slots for users who wish to create a dedicated mining machine. With the TB85's PCI-E slots you get a value oriented motherboard that can be loaded up with graphic cards for mining. The BIOSTAR motherboards boasts 100% solid capacitors and with the Intel chipset and 4th generation Intel Core processor platform you get out-of-the-box solutions. These boards deliver better PC performance, manageability, and security protections with features like Intel Rapid Storage Technology (Intel RST), for fast system boot and application load time, and Intel Small Business Advantage (Intel SBA), which delivers business-centric security protection, such as after-hours virus scans and data backup, and blocks recognition of unwanted USB drives.
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Core i7 "Haswell-E" HEDT Platform Launch Date Revealed
Intel Core i7 "Haswell-E" HEDT (high-end desktop) processors, along with compatible motherboards based on the Intel X99 Express chipset, are expected to launch on September 14, 2014, according to a leaked Intel supply chain document scored by VR-Zone. The Core i7 "Haswell-E" series succeeds current Core i7 "Ivy Bridge-E," and its compatible X79 Express chipset. The new chips will be built in the new LGA2011-3 package (incompatible with current LGA2011), and will be the first client desktop platform to support the new DDR4 system memory standard. The series will include three parts, the six-core Core i7-5820K and i7-4930K; and the eight-core i7-5960X. The three are detailed in our older article, here.
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(PR) GIGABYTE CATZILLA OC Contest to be Hosted on HWBOT.ORG
GIGABYTE TECHNOLOGY Co. Ltd., a leading manufacturer of motherboards and graphics cards, today announced its latest overclocking contest hosted on HWBOT.org, the GIGABYTE CATZILLA OC Contest. The main focus will be centered on the latest GIGABYTE 9 series motherboards with two stages running the CATZILLA benchmark on air/water cooling and LN2 cooling. A $500 cash prize and a GIGABYTE motherboard will be offered to the winner of each stages. An additional raffle will take place on each Friday for the opportunity to win a GIGABYTE T-Shirt.
To celebrate its new custom made skin on the Catzilla 720P benchmark, GIGABYTE is inviting the overclocking community to participate in GIGABYTE CATZILLA OC Contest. Open to all HWBOT members from June 23rd 2014 until July 21st 2014, GIGABYTE invites all Overclockers to suit up for one epic cat fight and take on the following stages using any hardware platform on a 9 Series GIGABYTE motherboard.
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(PR) HighPoint Launches the Industry's Fastest 2-Bay USB 3.0 Drive Dock
HighPoint Technologies, a pioneering force in the storage industry for over 19 years, continuously strives to deliver the fastest performing USB Drive Docks to today's marketplace, and has announced the release of its 3rd Generation Dual Dedicated 5Gb/s USB 3.0 Storage Dock - the RocketStor 5422A. The RocketStor 5422A delivers the industry's fastest USB transfer performance with a premium USB 3.0 feature set. With an MSRP of $59.99, the RocketStor 5422A is the is the easiest, quickest and most affordable way to add dual-bay, high-speed SATA SSD and multi-terabyte hard drive storage to any computer with USB ports.
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ZOTAC ZBOX CI540 nano Production Flaw Unearthed?
French tech publication 01net noticed something odd about the ZBOX CI540 from ZOTAC it was reviewing. Even for a fan-less compact desktop, its Core i5-4210Y dual-core chip was idling around 80°C. The reviewer then opened it up to find that ZOTAC left the protective plastic film on the thermal pad which conducts heat from the CPU to the body intact. Temperatures dropped with that film peeled. The kicker? Reaching for that thermal pad voids your product warranty.
Even if the ZBOX CI540 is a barebones unit, in which you drop in your own 2.5-inch HDD/SSD and SO-DIMM memory, requiring you to unscrew its body; the storage and memory compartments are located on the reverse side of the motherboard. You're not supposed to unscrew the motherboard to reveal its obverse (front) side, as there's nothing for you to "upgrade" there. The CPU is in the BGA (ball-grid array) package, and hardwired to the motherboard. The screws that let you reveal the front side are capped with warranty seals. We're not sure if it's a one-off bad piece 01net got, or an entire batch hit by one lazy hand on the production line.
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Available Tags:NVIDIA , Philips , CPU Cooler , CPU , AMD , CPU Cooler , Intel , Xeon , FirePro , GeForce , GTX , HIS , i7 , GIGABYTE , USB 3.0 , USB , ZOTAC ,
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