Thursday, March 27, 2014

IT News Head Lines (techPowerUp) 28/03/2014

techPowerUp!



(PR) Vantec Unveils a 2.5-Inch Portable WiFi Enclosure
Vantec Thermal Technologies- a worldwide leader specializing in computer accessories, storage and mobile solutions - announces one new addition to the WiFi Storage Family. The New 2.5" Portable Wireless Enclosure Allows Simultaneous WiFi Access to Data Stored in this Portable Enclosure Creating a Simple Network for File-Sharing everywhere you go.



The NexStar WiFi 2.5" Portable Wireless Enclosure allows users to connect wirelessly to the data stored in the user's hard drive using the Enclosure's Wi-Fi signal. This allows anyone with Wi-Fi capable devices like smartphones and tablets to connect to this Enclosure at home or on the go with the built-in 5000 mAh battery. In addition, the Vantec WiFi Apps are available now on Apple App Store and Google Play Store to work with the new NexStar WiFi 2.5" Portable Wireless Enclosure.


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(PR) Microsoft and Dell Sign Patent Licensing Agreement
Microsoft Corp. and Dell announced a patent licensing agreement allowing the companies to share technology and build on each other's innovations. It is the continuation of a nearly 30-year business relationship between Microsoft and Dell to deliver world-class technologies to consumers.



"Our agreement with Dell shows what can be accomplished when companies share intellectual property," said Horacio Gutierrez, corporate vice president and deputy general counsel of the Innovation and Intellectual Property Group at Microsoft. "We have been partnering with technology manufacturers and vendors for many years to craft licensing deals, instead of litigation strategies."


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(PR) V-MODA Announces the XS Foldable Headphones
V-MODA, maker of the world's finest high-fidelity headphones trusted by pros and savvy consumers alike, is thrilled to announce the latest addition to their award-wining M-Class Series - the XS. Designed for ultimate comfort and sleek ergonomic fit, the XS reflects V-MODA's commitment to fashion-forward wearable technology, combining professional-grade quality and a personalized style.



Sleek Ergonomix for Better Sound

The angles and sleek headband design of the XS "mind the gap" by minimizing the unsightly space between the headband and your head. The result is a superior fit, added comfort, grander sound and a compact profile. 5+ years of R&D resulted in a wind-tunnel worthy design that contours evenly to the shape of your head, with angles that frame facial features. Enjoy long listening sessions comfortably with supple memory foam cushions that naturally adapt to your ears for faster "burn-in" and better noise isolation. The result of the meticulous design process behind the XS is a fashionable form-fitting design that elevates your listening experience; discover why "the fit is the sound."


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(PR) Altera and Intel Extend Manufacturing Partnership
Altera Corporation and Intel Corporation today announced their collaboration on the development of multi-die devices that leverage Intel's world-class package and assembly capabilities and Altera's leading-edge programmable logic technology. The collaboration is an extension of the foundry relationship between Altera and Intel, in which Intel is manufacturing Altera's Stratix 10 FPGAs and SoCs using the 14 nm Tri-Gate process.



Altera's work with Intel will enable the development of multi-die devices that efficiently integrates monolithic 14 nm Stratix 10 FPGAs and SoCs with other advanced components, which may include DRAM, SRAM, ASICs, processors and analog components, in a single package. The integration will be enabled through the use of high-performance heterogeneous multi-die interconnect technology. Altera's heterogeneous multi-die devices provide the benefit of traditional 2.5 and 3D approaches with more favorable economic metrics. The devices will address the performance, memory bandwidth and thermal challenges impacting high-end applications in the communications, high-performance computing, broadcast and military segments.


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EVGA Announces GeForce GTX 750 FTW 2GB
EVGA announced an Amazon-exclusive 2 GB variant of its GeForce GTX 750 FTW graphics card (model: 02G-P4-2758-KR). Built in an identical board design to the original GTX 750 FTW, with the company's ACX cooling solution, the card offers factory-overclocked speeds of 1229 MHz core, 1320 MHz GPU Boost, and 5012 MHz (GDDR5-effective) memory, and features 2 GB of it across the chip's 128-bit wide memory interface. The cooling solution is designed to deal with much bigger chips, and should keep the GTX 750 quiet and comfy, even at its maker-given speeds. Based on the 28 nm GM107 silicon, the GTX 750 packs 512 CUDA cores, and is based on NVIDIA's new "Maxwell" GPU architecture. The card is priced at US $149.99.


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(PR) Connected Data Updates Its 4-Bay Drobo Storage System
Connected Data, the creator of the award-winning Drobo line of smart storage solutions, today announces the release of the latest 4-bay Drobo and the best-selling product in the company's history. This third generation Drobo is more affordable, three times faster than the previous release and includes new features such as USB 3.0, significantly faster rebuild times and enhanced support for Apple's Time Machine. The company today is also introducing a customer loyalty discount program of $50 USD off for all first and second-generation Drobo customers.



The Most Advanced 4-Bay Drobo Ever: This third generation Drobo features a new low price of $349 and a completely new architecture, making it three times faster than the previous generation. In addition, four times faster rebuild times maximize data availability in the event of a disk drive failure, and the addition of battery back up provides even more protection in case of a power outage.


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(PR) Plextor M6M mSATA SSD Maximizes Real-world Performance in Notebooks
Plextor, a leading developer of digital storage technology, announces the launch of the M6M mSATA SSD, a compact and extremely fast SSD. The new M6M is capable of matching the performance of desktop drives with impressive maximum random read/write speeds of 94K IOPS/80K IOPS and sequential read and write speeds of up to 520 MB/s and 440 MB/s. Installing an M6M in an ultra-thin notebook, NUC-style PC, or tablet PC maximizes system responsiveness and battery life.



"The M6M is all about real-world performance. We've optimized this compact SSD to deliver the best possible computing experience. We used the latest generation of components, then included a new version of True Speed for even smoother long-term operation, and focused on increasing the random speeds to give the fastest everyday operating performance", said Product Manager, Yaping Zheng.




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Finalwire Releases AIDA64 v4.30
Finalwire released the latest update to AIDA64, popular system information, diagnostic, and bechmarking suite. Version 4.30 builds on its predecessors by adding support for new hardware, newer versions of Windows, new technologies, and offers a new benchmark. To begin with, it adds support for Windows 8.1 Update 1 and Windows Server 2012 R2 Update 1. It also adds support / detection for NVIDIA's new CUDA 6.0 GPGPU API. Among the new hardware support are the AMD socket AM1 platform, Intel "Broadwell" CPUs, early support for AMD "Carrizo" and "Toronto" APUs, early support for Intel "Skylake," "Cherry Trail," and "Denverton" CPUs. Among the new GPUs supported, are AMD Radeon R7 265, and NVIDIA GeForce GTX 745, and the 800M series. A new OpenCL SHA-1 hash benchmark is added.
DOWNLOAD: Finalwire AIDA64 v4.30 (installer) | Finalwire AIDA64 v4.30 (ZIP package)

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Available Tags:Microsoft , Dell , Intel , EVGA , GeForce , GTX , SSD

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