Intel "Ivy Bridge" Celeron and Pentium Processors Priced
Keeping up with an updated launch roadmap for Q1 2013 posted last November, Intel rolled out entry-level Celeron and Pentium dual-core processors based on its 22 nm "Ivy Bridge" silicon. All of the seven desktop and four mobile chips announced occupy price-points under $100. The desktop lineup begins with the Celeron G1610 (2.60 GHz, dual-core, 55W TDP), priced at US $42; Celeron G1610T (2.30 GHz, dual-core, 35W TDP) at $42; followed by Celeron G1620 (2.70 GHz), priced significantly higher at $52; Pentium G2010 (2.80 GHz, dual-core, 55W TDP) and G2020 (2.90 GHz), and G2020T (2.50 GHz, 35W TDP) at $64; and Pentium G2130 (3.20 GHz, dual-core, 55W TDP) at $86.
Intel has two kinds of Celeron mobile processors, targeting the mainstream and Ultrabook-like notebook form-factors. Among the mainstream notebook processors are the Celeron 1000M (1.80 GHz, dual-core, 35W TDP) and Celeron 1020M (2.10 GHz, dual-core, 35W TDP). Among the Ultrabook-like form-factor models are the Celeron 1007U (1.50 GHz, dual-core, 17W TDP), and Celeron 1037U (1.80 GHz, dual-core, 17W TDP). Interestingly, all four mobile Celeron "Ivy Bridge" CPU models are priced at $86, in 1000-unit tray quantities.
Source: PC Watch
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Mass Production at Intel's 14 nanometer Node Begins This Year In addition to the industry's first fully-patterned 450 mm wafer, Intel announced that its 14 nanometer silicon fabrication node at three of its fabs will begin this year. The next leap forward from 22 nm, on which two of the company's CPU generations "Ivy Bridge" and "Haswell" are based, the 14 nm node will eventually facilitate production of the company's 5th generation Core "Broadwell" processors, which are due to arrive in 2014. Given the pace at which the 14 nm node is being developed, some of the first Broadwell Core chips, at least engineering samples, will be released to the industry within 2013. Among the three Intel facilities with 14 nm nodes are D1X, located in Oregon; Fab 42, located in Arizona; and Fab 24, located in Ireland.
Source: Expreview
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(PR) Axiontek Announces MANO861 Socket LGA1155 Mini-ITX Motherboard Axiomtek's MANO861 industrial-grade Mini ITX motherboard based on the Intel H61 Express chipset is designed for the 3rd Generation Intel Core i7/i5/i3 processors in LGA1155 socket. The high performance MANO861 comes with two DDR3 1333/1600 MHz SO-DIMM slots with up to 16 GB memory capacity. This cost-effective motherboard supports dual-view capability through DVI-D, VGA, and LVDS interface. It also reserved one PCI Express Mini Card slot and one PCIe x4 slot to provide for flexible applications. With a small footprint of only 170 x 170 mm, the embedded board offers a full feature set of I/O which allows system integrators to deploy their solution with this platform easily. The MANO861 is designed for customers in the industrial automation, gaming, kiosk, POS and signage markets, who are looking for advanced performance in both computing and graphics and cost optimized solution.
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Intel Shows Off Industry's First Fully-Patterned 450 mm Wafer At the SEMI Industry Strategy Symposium (ISS) held late last week, Intel unveiled the pride of its fabs, the industry's first fully-patterned (ready to slice) 450 mm wafer. Major semiconductor fabs around the world are locked in a race for who gets volume-production on 450 mm wafers going first. Among the contenders are Taiwan's TSMC, UAE's GlobalFoundries, and Korea's Samsung, and with the unveiling of the first fully-patterned wafer, Intel appears to have announced its lead. The 450 mm (diameter), thanks to its large surface area, significantly increases yields. "[This] is an important step forward and it indicates that there will soon be substantial volume of patterned test wafers for use by suppliers in developing their 450 mm tools," stated Chuck Mulloy, a spokesperson for Intel. As for what Intel etched on the wafer, a report claims it could be large dies of simple (highly-patterned) devices such as flash. The fab reportedly used Impints' J-Fil imprint lithography technology that demonstrated 24 nm patterning with line edge roughness of less than 2 nm to 3Σ and critical dimension uniformity to 1.2 nm 3Σ, offering the prospect of 10 nm patterning with single-step process.
Source: X-bit Labs
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Intel Atom "Rangeley" Enterprise Processors Detailed Intel's known lineup of low-power Atom processors based on the "Silvermont" micro-architecture spans across the "ValleyView" line of chips for tablets, nettops, and embedded systems, "Avoton" line for micro-servers, and a third line that completes the triad, "Rangeley." Designed for the networking and communications market, such as high-density switches, internet- and telephone-exchanges, etc., these chips are the first Atom-branded products to pack up to eight x86 CPU cores. The eight-core chips are built into a single-chip SoC design. The cores feature out-of-order execution, much like "Avoton," CPU clock speeds of up to 2.40 GHz, and an instruction-set that's carefully measured for Rengeley's target application, which includes SSE4.1/SSE4.2, AES acceleration, VT-x, and x86-64. Rangeley is also among the first Atom chips to feature a dual-channel DDR3 integrated memory controller, supporting DDR3-1600 MHz, blurring the lines between it and other Intel processors. Thanks to out-of-order execution, the chip gains a 35 percent performance increment over previous-generation "Saltwell" architecture. Since it's an SoC, its core-logic is completely integrated into the CPU package. Connectivity includes PCI-Express 2.0 (a total of 16 lanes spread across 4 ports), two SATA 6 Gb/s ports, gigabit Ethernet MAC, and legacy I/O. Source: CPU World Read More ...
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