(PR) Sparkle Announces the Calibre X660 Dual Fan Graphics Card
Calibre Series brings introduces an exciting new product to life today: the Calibre X660 Dual Fan Solution. The latest X660 Dual Fan Solution clocks at 1059 MHz core frequency with boost up to 1124 MHz and 6008 MHz memory speed, delivering class-leading performance achieving an 8% performance increase at default overclocked setting.
Extreme Custom Cooling Delivering Class leading Performance
The Calibre X660 Dual Fan is equipped with the ultimate dual silent PWM cooling fan, by utilizing 3 units 6ø ultra cool heat pipes, the heat is easily dissipated from the surface of the cooling fin, fully covering the key components onboard. The dual Fan provides up to a 15°C lower temperature than the reference board.
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Kingston Intros Data Traveller GE9 Line of 24ct Gold-Plated USB Flash Drives Kingston unveiled the Data Traveller GE9 line of USB 2.0 flash drives, characterized by 24-carat gold-plated bodies. Available in conventional capacities of 8 GB and 16 GB, the drives are tested to provide up to 20 MB/s of transfer rates. The 16 GB variant was tested by Expreview to push bits around at 19.15 MB/s (sequential reads) and 5.14 MB/s (sequential writes). The 8 and 16 GB variants are priced at the equivalent of $8 and $14.
Source: Expreview
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Dell Unveils a Pair of E-Series Entry Level Monitors Dell unveiled the 21.5-inch E2213H widescreen, and 17-inch E1713S square monitors. The two pack LED-backlit TN-film LCD panels, and a basic feature-set. The E2213H features 1920 x 1080 pixels resolution, 160° H/V viewing angles, 5 ms response time, 250 cd/m² brightness, 1000:1 contrast ratio, and inputs that include DVI and D-Sub. The E1713S, on the other hand, features 1280 x 1024 pixels resolution, most other features remain the same, except it lacks DVI display inputs. The two are priced under $150.
Source: PC Watch
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TSMC Looking to Build Fabs in the US Global Foundries could soon howdy-neighbor TSMC in upstate New York, with the Taiwanese semiconductor giant looking to set up a fab there. According to an X-bit Labs report, TSMC began groundwork on its US venture by consulting with Deloitte, to look for viable sites in Rensselaer, Saratoga and Oneida counties, that have abundant water, power, and gas to operate 3.2 million square feet buildings with 1,000 employees, 40 percent of which are college-graduated engineers. Deloitte also took a look around Luther Forest Technology Campus, where Global Foundries' Fab 8 is located. A little earlier this week, Bill Owens, a Congressman from upstate New York flew to Taiwan, to meet with TSMC CFO Lora Ho to pitch upstate a little more. TSMC is a principal foundry partner of companies such as Qualcomm, NVIDIA, and AMD.
Source: X-bit Labs
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Scythe Monobox ATX Case Pictured Japanese PC component maker Scythe unveiled the Monobox ATX, a mid-tower case designed for silent PC builds. Made of 0.5 mm-thick steel sheets and ABS plastic, the case includes noise-absorption sheets on most of its inner surfaces. The case features three 5.25-inch, and four each of 2.5-inch and 3.5-inch drive bays. Two long graphics card stabilizers are provided, which work to counter PCB bending. Ventilation includes two 120 mm front intakes, and one rear 120 mm exhaust, with the idea of maintaining a positive air pressure within the case. Its front-panel features USB 3.0, USB 2.0/1.1, and HD audio jacks. Slated for December 5, it is expected to be priced around US $100.
Source: Hermitage Akihabara
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(PR) Club 3D Announces royalKnights CrossFire Bundles Club 3D, a worldwide supplier of high performance components to the PC gaming hardware market, unveils today its new Crossfire bundles. To meet the demands of the most fanatic gamers, Club 3D has assembled 3 crossfire bundles. These bundles are cherry picked to bring you the best games, the best performance and the most fun. The crossfire bundles are:
- The 2x Radeon HD 7770 GHz Edition
- The Radeon HD 7850 royalKnights
- The Radeon HD 7870 royalKnights
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(PR) Thermalright Officially Introduces the Archon SB-E X2 CPU Cooler Ever since the introduction of the first Archon "Slim Tower Heatsink" back in 2010, Thermalright has never stopped improving on its own design. Incorporating our new proprietary Pressure Vault Bracket System we introduce to the world the all new Archon SB-E X2. Aside from a total overhaul and upgrade of the mounting bracket system, the Archon SB-E X2 will be using two TY-141 high efficient double ball bearing silent fans, giving enthusiasts the perfect mash-up of performance, compatibility and silence! The new VX BTKII mounting system on the Archon SB-E X2 brings Thermalright's Pressure Vault Bracket system to all new heights, for the first time supporting CPU's from both AMD and Intel. The VX BTK II works on almost all modern motherboards. The bracket system only takes four simple steps to mount your heatsink. A simple turn of the Central Pressure Knob lets you adjust between 40 to 70 pounds of extra pressure. The nickel plated bracket adds not only flair to your system, but also extra longevity against oxidization and rust.
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(PR) VIA Labs Announces Two New USB 3.0 Host Controllers, VIA VL805 and VIA VL806 VIA Labs, Inc., a leading supplier of USB 3.0 integrated chip controllers, today announced two next generation USB 3.0 Host controllers, the four-port VIA VL805 and the two-port VIA VL806. The VIA VL805 and VIA VL806 allow a PCI Express-equipped platform to interface with multiple SuperSpeed USB peripherals devices simultaneously for blistering fast transfers rates up to 5 Gbps while retaining full backwards compatibility with USB 2.0 and 1.1 devices. The next generation single chip VIA VL805 and VIA VL806 Host controllers include enhancements for improved performance, seamless cross compatibility and interoperability, and new features such as support for USB Battery Charging and "Charging Downstream Port" which enables both fast data sync and rapid charging with compatible devices. The VIA VL805 and VIA VL806 comply with the Universal Serial Bus 3.0 Specification for Super-Speed transfers and Intel's eXtensible Host Controller Interface (xHCI) 1.0 specification and add native inbox driver support for Windows 8. VIA VL805 and VL806 host controllers are USB-IF certified and are currently shipping.
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(PR) ROCCAT Lua Tri-Button Gaming Mouse Available Now German gaming peripherals manufacturer, ROCCAT Studios, today announces the release of the ROCCAT Lua Tri-Button Gaming Mouse. The Lua packs advanced gaming engineering into a sleek and clean ambidextrous form that offers a comfortable fit for every gamer's hand. Its advanced Pro Optic R2 sensor features a choice of seven DPI settings – 250, 500, 1000, 1250, 1500, 1750, and 2000 – so gamers can play with accuracy at the speed that matches their style. It also has a dedicated DPI button that lets players easily change speeds in the heat of battle. Gamers can even program the button to switch only between the DPI settings they use most. "We took the beloved three-button mouse design and injected it with our innovative gaming engineering – and created a killer tool that gives props to the past while heading boldly into the future," says René Korte, ROCCAT Founder and CEO. "The Lua delivers everything gamers need for control, comfort and style – all in a sleek and slim design that offers perfect comfort for every hand."
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(PR) Sapphire Announces the Edge VS Series Mini PC SAPPHIRE Technology has just introduced a new family of mini-PCs based on the latest Accelerated Processing Unit (APU) technology from AMD, codenamed Trinity. The SAPPHIRE Edge VS series delivers fantastic performance and stunning graphics in a small format for a wide range of applications, whatever the environment. At home, the compact, beautiful design can be sited anywhere, replacing older bulky PCs – yet it will breeze through almost any task. In fact scores of top applications have been optimized specifically for the technology in the SAPPHIRE Edge VS. In addition to easily handling home office applications, it delivers flawless, stutter-free HD video playback and streaming, and faster and better Internet browsing.
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