UMC Begins to Build Fab to Make 28nm, 20nm and 14nm Chips
UMC Spends $8 Billion on Expansion, Confirms Development of 14nm FinFET Process Technology
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OCZ Quietly Introduces 7mm Vertex 3 LP SSDs for Ultrathin Laptops
OCZ Reveals Low-Profile Vertex 3 LP Solid-State Drives
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Toshiba Vows to Release Hybrid Hard Disk Drive in September
Toshiba Confirms Development of Hybrid Hard Disk Drive
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Jury Finds: Google Android Did Not Infringe Oracle's Patents
Google Not Guilty of Infringing Oracle's Patents
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208 Million "Phablets" Set to Be Sold by 2015 - Analysts
Smartphones with Ultra Large Screens Will Continue Gaining Popularity
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Microsoft Expects 500 Million People to Use Windows 8 Next Year
Microsoft Projects Breakthrough for Windows 8 Sales Thanks to Compatibility with Different Devices
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Thunderbolt Interface to Receive Green Light from Mainboard Makers in Second Half of 2012 - Rumour
Thunderbolt Interconnection to Make It to Mainstream Systems Later in 2012
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Apple and Samsung Fail to Reach Settlement at Special Meeting
Court-Ordered Meeting Does Not Resolve Apple Vs. Samsung Dispute
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Seagate Set to Take Over LaCie
Seagate and LaCie Agree About Acquisition
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Foxconn to Invest $210 Million on New Apple Production Line
Additional 36 Thousand Foxconn Employees to Make Apple Products
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Google Finalizes Acquisition of Motorola Mobility
Google Becomes Hardware/Software/Service Company
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Via Technologies Kicks Off $49 Android Performance Computer Initiative
Via Starts APC Initiative: $49 Android PC
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AMD Reveals Trinity Accelerated Processing Unit for Embedded Decides
AMD Unveils R-Series APU with Trinity Architecture
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Hard Disk Drives' Densities to Double by 2016 - Analysts
60TB Hard Disk Drives Imminent This Decade
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Available Tags:OCZ , Toshiba , Google , Android , Windows 8 , Microsoft , Windows , Thunderbolt , Apple , Samsung , Seagate , Motorola , Via , AMD ,
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