NVIDIA Stops Production of GeForce GTX 580
NVIDIA reportedly stopped production of GeForce GTX 580 graphics cards. Launched in November, 2010, the GeForce GTX 580 had been the fastest single-GPU graphics card for an year, before AMD responded with Radeon HD 7900 series. With launch of the GeForce GTX 680, and volumes of 28 nm chip production at TSMC looking positive, GeForce GTX 580 served its purpose. NVIDIA can stop production and leave remaining inventories get gradually digested by the market. NVIDIA had already stopped production of GeForce GTX 590.
Source: SweClockers
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Palit GeForce GTX 680 JetStream 4 GB Pictured
Soon after launching GeForce GTX 680 JetStream, Palit is working on its variant with double the amount of memory, at 4 GB. The GTX 680 JetStream 4 GB joins Gainward's GTX 680 Phantom 4 GB and Galaxy GTX 680 4 GB, at being some of the first cards with double the memory amount, which could just come handy with triple-monitor 3D Vision Surround setups.
Unlike the 2 GB GTX 680 JetStream, which has 1150 MHz (core boost) and 6.30 GHz (memory), the 4 GB variant sticks to NVIDIA reference clock speeds of 1056 MHz (core boost) and 6.00 GHz (memory). Like the 2 GB variant, the new card will use 6-pin and 8-pin PCIe power connectors to draw power. We can see from pictures that the PCB is a slight variation of NVIDIA's reference design, besides the GDDR5 memory chips on the reverse side of the PCB, which are not cooled by any back-plate. Its launch could be very soon.
Source: Guru3D
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14 nm "Broadwell" A True System-on-Chip (SoC)
With the 14 nm "Broadwell" architecture, Intel will take a new step towards integration of the platform-controller hub (PCH) with the CPU, by designing it to be a multi-chip module (with the CPU+northbridge in one die, and PCH on the other). This would make "Broadwell" a true System-on-chip (SoC), which allows over 90 percent of the system's I/O to be routed to the processor socket, including memory, PCI-Express, SATA, USB, etc. Although not the first to the industry with single-chip chipsets and integrated memory controllers, Intel rapidly reshaped the arrangement between CPU and core-logic, over the past four years.
It began with transfer of memory controller from northbridge to CPU die (45 nm "Bloomfield"), and transfer of the entire northbridge to the CPU die (45 nm "Lynnfield"). The graphics northbridge transferred a little more gradually, first as multi-chip module with a separate CPU die (32 nm "Clarkdale"), then complete integration with the CPU die (32 nm "Sandy Bridge"). All through, the southbridge, or I/O controller hub (ICH) remained outside the CPU package, with the addition of a display output logic, it transformed into a "platform controller hub" (PCH), which is still just a glorified southbridge. Naturally then, such a drastic relocation of system components will warrant a socket change.
Source: ComputerBase.de
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EVGA Announces the GeForce GTX 680 SC Signature Graphics Cards
EVGA has today officially introduced a fresh pair Kepler cards, the GeForce GTX 680 SC Signature and GeForce GTX 680 SC Signature+ which feature a 5 phase PWM design, 8-pin and 6-pin PCIe power connectors (stock models come with two 6-pin plugs), and increased frequencies - 1084 MHz (1006 MHz stock) for the base clock, 1150 MHz for the boost clock (1058 MHz) and 6208 MHz (6008 MHz) for the 2 GB of on board GDDR5 memory.
These two tweaked GTX 680s also have 1536 CUDA Cores, a 256-bit memory interface, PCI-Express 3.0 support, SLI and 3D Vision Surround capabilities, and four display outputs - two DVI, one HDMI and one DisplayPort. The GeForce GTX 680 SC Signature has a price tag of $529.99 while the GeForce GTX 680 SC Signature+, which comes equipped with a backplate, costs $549.99. Neither model is available at this time.
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J&W Unveils First Nano-ITX Atom "Cedar Trail" Motherboard
Embedded systems and IPC maker J&W unveiled the first Atom "Cedar Trail" motherboard in the nano-ITX form-factor. The board measures just 120 x 120 mm, and is designed for embedded computing devices. It draws power from a 2-pin 12V DC input. It holds a dual-core Intel Atom D2700 (2.13 GHz) or D2500 (1.83 GHz) processor, one DDR3 SO-DIMM slot (reverse side), which supports up to 4 GB of DDR3-1066/800 MHz memory, and basic connectivity. The lone expansion slot is a mini-PCIe, designed to hold WLAN adapters.
Display outputs include D-Sub (by header), LVDS, and HDMI. Connectivity options include one SATA 3 Gb/s (AHCI), five USB 2.0 ports (three type-A connectors, two via headers), gigabit Ethernet, 6-channel HD audio over HDMI and 2-channel analog audio, RS232 Serial, SD/SDHC card reader, SIM card slot (3G option), consumer IR, and PS/2 (header). The CPU and core logic can be passively cooled. The Cedar Trail Nano-ITX board from J&W will be available to embedded systems and IPC markets, soon.
Source: FanlessTech
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(PR) AMD and PTC Team Up to Provide Advanced Graphics Performance in Creo Parametric 2.0
AMD today announced its collaboration with PTC, a leading provider of product development software solutions and services, to enable 900% faster performance in 3D transparency in PTC Creo Parametric 2.0 and shaded 3D frame rates and interactivity by over 4X on AMD FirePro professional graphics cards. In addition, the AMD Catalyst Pro driver supports optimizations to ensure AMD FirePro professional graphics cards enable winning performance, reliability and workflow innovation for Creo users at virtually every AMD FirePro professional graphics card price point.
"The latest AMD FirePro professional graphics cards and drivers have been specifically engineered to enhance the productivity of PTC Creo Parametric 2.0 users," said Antoine Reymond, senior strategic alliance manager, Workstation Graphics, AMD. "Technical designers rely on software and hardware tools to optimize their workflow and enable them to effectively design without performance bottlenecks. Our collaboration with PTC helps ensure design professionals using AMD FirePro professional graphics cards will experience a significant boost in performance, resulting in superior productivity and design intuition."
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(PR) ICY DOCK Introduces the MB982IP-1S-1 2.5" SAS SSD/HDD Converter
In order to provide a pure 2.5" to 3.5" SAS conversion, Icy Dock is proud to introduce the new MB982IP-1S-1 2.5" SAS/SATA to 3.5" SAS SSD & HDD Converter. The MB982IP-1S-1 is an addition to the already popular MB982 enterprise series, with an emphasis on industrial level SAS storage applications. The dimensions, connection locations, and mounting hole positions are carefully placed to mimic a standard 3.5" SAS drive or SSD.
The MB982IP-1S-1 also utilizes a full metal design, thus creating the best environment to cool any 10K, 15K RPM mechanical or enterprise SAS solid state drive, meanwhile, the rock solid construction is ideal for industrial, enterprise, and military related applications. A completely standardized SAS connection is implemented to be fully compatible with various backplanes that may be used. The converter is designed specifically to be used for 2.5" SAS/SATA drives that are required in 3.5" SAS internal hard drive bays of tower and rack mount chassis, as well as with backplanes or hot swap modules.
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Activision Blizzard Being Sued for Virtual World Infringement
ShackNews is reporting Activision Blizzard is being sued by Worlds Inc., for violating a patent on virtual worlds. The firm claims that games like Call of Duty and World of Warcraft violate its patent, and are requesting "fair compensation." The patent covers a "system and method for enabling users to interact in a virtual space," reports Games Industry International. That may sound broad, but the company did manage to get an undisclosed settlement out of NCSoft for City of Heroes in 2010. "Technologies created by Worlds have helped the businesses of virtual worlds gaming and the sale of virtual goods to grow into a multi-billion dollar industry," said Worlds CEO Thom Kidrin. "While we are pleased to see that the gaming industry and its rapidly growing customer base have enthusiastically embraced our patented technologies, we deserve fair compensation for their use." No response yet from Activision Blizzard.
Source: ShackNews
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Samsung Urges Intel to Launch DDR4 Systems Ahead of Schedule
With over-production, swelling-inventories, and cutthroat competition that doesn't allow even subtle price-increases, DDR3 is a lost-cause for DRAM makers such as Samsung. It is hence hedging its bets on the early arrival of DDR4, and the only company that can make that happen is Intel. Samsung is not only a major supplier of DRAM memory, but also a big player in server memory. It had its first DDR4 UDIMM ready as early as in January 2011. Reports of Intel slating DDR4-equipped platforms in 2013 has Samsung perturbed. Samsung and Hynix are the only two DRAM majors with developed DDR4 products. According to DigiTimes' analysis, DRAM vendors see DDR4 as the only way they can pull themselves out of their ailing situation.
Source: DigiTimes
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Intel to Push for Higher Resolution PC Displays, Arrive in 2013
Come 2013, and PC consumers could finally break the shackles of regressive PC resolution "standards" such as 1366x768 and 1920x1080, if Intel has its way. At a presentation at IDF Beijing, Intel expressed its desire to see much higher resolution displays for all computing devices, not just PCs, which could in true terms be "retina-matched" display resolutions. At an optimal (comfortable) viewing distance, the resolution of a computing device's screen should match that of your eyes.
If Intel has its way, a 21" all-in-one desktop PC, and a 15" notebook PC screen will have a resolution of 3840x2160 pixels; a 13" Ultrabook PC could have a resolution of 2800x1800 pixels, a 11" Ultrabook and 10" tablet with 2560x1440, and 5" handheld/smartphone with 1280x800. Compare these to the $500+ 27" 1920x1080 monitors that are still sold in the market! A very bold proposal, but one only a company with the industry prominence of Intel can pull off.
Source: Liliputing
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AMD Radeon HD 7900, HD 7700 Series Price Cuts En Route: Report
Despite losing its competitive edge to NVIDIA's GeForce GTX 680, for various reasons AMD was rather slow in adjusting prices of its Radeon HD 7900 series SKUs, the HD 7970 and HD 7950. We are now learning that AMD is preparing the first round of price cuts for its flagship graphics card lineup, since the advent of NVIDIA's Kepler architecture. A Kitguru report pits price cuts of Radeon HD 7970 as much as by US $60 (from $549 to "as low as" $489). The price of HD 7950, on the other hand, is expected to go down by as much as US $55 (that's from $449 to $394). There's also a small price cut in store for Radeon HD 7770, which according to the report, could go down by $15.
Source: Kitguru
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(PR) Team Group Announces Xtreem SSD S3 PRO
Team Group Inc., one of the leading manufacturers in memory and storage products in the world, is having the eyes on the explosive potential of SSD market, as we are constantly looking for ways to improve ourselves in terms of R&D capability. Last year, the SSD S3 was a blast in the market, and this year, the blast is going to be even bigger when we launch the new generation of S3 PRO to satisfy the yearning of die-hard users. Compared to its predecessor, the S3 PRO features up to 60% more in random writing speed! Any other SSD products in the market can only bite the dusts!
Team Group SSD S3 PRO employs high standard SATA 6 Gb/s transmission interface, and is equipped with SandForce controller that all hard-core players can dream of. This serious piece of work features stability and safety that are consistent with the ultra-high standard of Team Group. The reading and writing speeds are improved to a perfect 550 MB/s. The powerful 520 MB/s write-in speed (240GB) and unprecedented random write-in speed of 90,000 IOPS (input/output per second) are integrated with the protection of S.M.A.R.T technology, RAISE and ECC correction to give pro players the turbo charger that pushes the speed to the limit. S3 PRO is now available with four volumes from 60 GB to 480 GB, allowing all levels of adrenaline seekers to experience the excellent performance of S3 PRO.
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Force Media JF-UFDP4S Flash Drive Plugs Directly to Your Portable Devices
Here's a unique USB flash drive, which has both standard and micro USB type-A connectors, that allow you to plug it to both PCs with standard USB ports, and portable devices such as smartphones and tablets, which have micro-USB ports. The JF-UFDP4S from Force Media, is what its makers are referring to as the "Perfect Media". It provides 4 GB of storage, over both interfaces, and talks to hosts over USB 2.0 (480 Mb/s).
It is a conventional-looking capped bar design, only that both its ends are capped, with a connector on each end. To prevent misplacing caps, each cap can be attached to the top of the other cap, on the other end of the drive. When plugged in via its standard connector, it works as a normal USB Mass Storage device, while with its micro-USB interface, it works plug-and-play with Android driven smartphones, tablets, and smart portable media players that have USB OTG support. Measuring 18.0 x 73.1 x 9.2 mm (WxDxH), it weighs about 39 g. Its main body is covered with a sheet of aluminum. Slated for mid-April, the JF-UFDP4S from Force Media is priced at 1,980 JPY (US $24).
Source: Hermitage Akihabara
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Valve Recruiting Electronics Engineer for Developing Homegrown Hardware
It's no news that Valve is working on its own gaming hardware platform so far referred to as Steambox, but its talk has been mostly based on rumors and anecdotal information. The Steambox theory, and the theory that Valve is working on hardware, got cemented by a new job vacancy posted by Valve, which calls for experienced electronics engineers. The posting reads "For years Valve has been all about writing software that provides great gameplay experiences. Now we're developing hardware to enhance those experiences."
The skillset asked for in the posting fills a lot of holes in the Steambox theory. It requires engineers to be proficient with prototyping, system-level design, embedded systems, high-speed serial interfaces, circuit simulation, etc., with a much more juicy "recommended" skillset requirement covering areas such as board layout, ARM/x86 system design, power/thermal management, RF and antennas, etc., basically everything a company out to design a game console would seek in its new engineers. Find the posting here, under "Electronics Engineer."
Source: Engadget
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(PR) MSI Announces the CX70 and CR70 Laptops
Looking for the biggest bang for your buck in terms of multimedia performance and style? MSI's new CX70 and CR70 17.3-inch multimedia laptops pack Intel's new generation Core i processor for the ultimate in computing power. What's more, to meet the needs of increasing high resolution of today's HD multimedia, the CX70 and CR70 come equipped with cinema-level SRS PC Sound and faster transfer ports, including USB 3.0, which is ten times faster than USB 2.0, HDMI 1.4, which can handle the latest HD resolution, and the new generation Bluetooth 4.0, which connects more quickly and covers a wider area.
Eric Kuo, associate vice president for global sales, MSI Notebook, notes that the CX70 and CR70 laptops are designed to handle the latest digital multimedia entertainment, featuring powerful transfer technologies to meet the needs of high resolution and large files as well as 17.3-inch anti-glare full HD screens. If you want something bigger than a high definition computer screen for viewing films, the MSI CX70 and CR70 laptops also come with an HDMI 1.4 port, so any type of high-fidelity, high-definition video can be played on your NB, but viewed via a cable on a large-screen LCD television.
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GIGAZONE Intros G1SGS Gaming PC Chassis
GIGAZONE, a brand owned by GIGABYTE, introduced its GZ-G1SGS gaming PC chassis. The ATX mid-tower chassis is designed to maintain positive air pressure, and cool multi-GPU gaming PC hardware inside. It features all-black interiors. Drive bays include two 5.25" (with one having an aesthetic optical drive lid), and seven 3.5" bays. The motherboard tray supports ATX, micro-ATX, and mini-ITX boards, with a cutout that makes handling CPU coolers with backplates easy.
Ventilation includes two 120 mm front intake fans, one 120 mm top exhaust fan, provision for one rear 120 mm fan, and two 120 mm fans on the side-panel. The front utility panel includes HD audio front-panel jacks, two USB 3.0 ports (standard header), and two USB 2.0/1.1 ports. Measuring 190 x 490 x 465 mm (WxDxH), the case is largely made of SECC-steel and ABS plastic. Backed by a 1 year warranty, the GIGAZONE GZ-G1SGS is priced at 6,980 JPY (US $86); it will be available from April 14.
Source: Links.co.jp
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(PR) PowerColor Introduces Ultra High-end VORTEX II Series
TUL Corporation, a leading manufacturer of AMD graphic cards, today announced a gaming graphics series designed for enthusiasts only: the PowerColor PCS+ Vortex II series. The latest patent cooling series released with HD7970 and HD7870; by taking advantage of the deluxe “Platinum Power Kit” design, allowing the best power efficiency and enhancing stability at overclocking mode.
The latest series armed with patent “Vortex” II cooling technology, featuring an adjustable and perforated fan design, gamers can manually adjust the fan and its physical attribute, optimizing the air flow and dissipating the excessive heat efficiently, providing no-compromise cooling effect with silent gaming environment.
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(PR) Synology Fixes Vulnerability in a Small Batch of DiskStations
Synology has confirmed a known system issue caused by flawed flash memory chips. This issue can occur when users reboot the DiskStation; the unit will not restart and the blue LED light will blink continuously. This issue does not affect data stored on the DiskStation and will not result in data loss.
The affected products include DS1512+ and DS1812+ worldwide, and DS212j for Asia shipments only. The best estimated quantity is 480, 120 and 700 units respectively and most of them have been returned or are on the way to Synology.
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(PR) Announcing a Breakthrough in Quantum Communication
A team of scientists at the MPQ realizes a first elementary quantum network based on interfaces between single atoms and photons. Whether it comes to phoning a friend or to using the internet – our daily communication is based on sophisticated networks, with data being transferred at the speed of light between different nodes. It is a tremendous challenge to build corresponding networks for the exchange of quantum information. These quantum networks would differ profoundly from their classical counterparts: Besides giving insights into fundamental questions in physics, they could also have applications in secure communication and the simulation of complex many-body systems, or they could be used for distributed quantum computing. One prerequisite for functional quantum networks are stationary nodes that allow for the reversible exchange of quantum information.
A major breakthrough in this field has now been achieved by scientists in the group of Professor Gerhard Rempe, director at the Max Planck Institute of Quantum Optics and head of the Quantum Dynamics division: The physicists have set up the first, elementary quantum network (Nature, DOI: 10.1038/nature11023, 12 April 2012). It consists of two coupled single-atom nodes that communicate quantum information via the coherent exchange of single photons. "This approach to quantum networking is particularly promising because it provides a clear perspective for scalability", Professor Rempe points out.
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(PR) HighPoint Unleashes Thunderbolt T Storage Controller Boards
HighPoint Technologies, Inc., an industry leading Storage HBA and RAID solutions manufacturer, will unveil a new series of Thunderbolt based Storage Controller Boards at the NAB 2012 tradeshow. This ground-breaking new product series aggregates Intel's revolutionary I/O technology, with HighPoint's extensive SAS, SATA and USB 3.0 design and manufacturing expertise, delivering innovative, highly versatile development platforms for storage solution providers.
Thunderbolt's revolutionary connectivity technology, presents great opportunities for HighPoint and solution providers the world over. For 2012, we are expanding our comprehensive product portfolio to include a new series of Thunderbolt based Storage expansion and controller boards.
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Intel Shows off "Letexo" Slider Hybrid-Ultrabook
At IDF Beijing, Intel showed off an almost unique new class of Ultrabook devices which could be sold by various notebook OEMs in the future, codenamed "Letexo". This is a tablet + slider ultrabook, similar in form (albeit larger) to the ASUS EeePad Slider, except that it has an Intel processor inside, and runs Windows 8 (the EeePad Slider was NVIDIA Tegra 2 and Android 3.0 driven). When slid down, Letexo is almost as compact and functional as a tablet PC, with its multi-touch screen, letting you take advantage of Windows Metro UI; when slid up, a keyboard and trackpad are revealed, letting you use it as just another laptop. Perhaps Letexo is intended to be a large-scale effort by Intel to bring about a transition between laptops and tablets, by shaping people's usage patterns towards more touch-based interface.
A video presentation follows.
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(PR) SteelSeries Announces Partnership with UFC
SteelSeries the leading manufacturer of premium-quality, competitive gaming peripherals today, along with the Ultimate Fighting Championship (UFC) announced a co-licensed product and collaborative marketing partnership. This announcement is the next step in the longstanding relationship between UFC and SteelSeries that has included the sponsorship of international octagon events and fighters such as Alexander Gustafsson, a top ten ranked MMA fighter in UFC. In addition to a number of marketing collaborations slated for this year, SteelSeries will also introduce a line of UFC Edition peripherals, which include a SteelSeries QcK UFC Edition mousepad, available now, and UFC edition headsets, which will be introduced later this year.
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(PR) Google Announces First Quarter 2012 Results and Proposal for New Class of Stock
Google Inc. today announced financial results for the quarter ended March 31, 2012.
"Google had another great quarter with revenues up 24% year on year," said Larry Page, CEO of Google. "We also saw tremendous momentum from the big bets we've made in products like Android, Chrome and YouTube. We are still at the very early stages of what technology can do to improve people's lives and we have enormous opportunities ahead. It is a very exciting time to be at Google."
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(PR) MAINGEAR Introduces the Quantum SHIFT 4K Workstation
MAINGEAR, an award-winning custom PC builder offering custom desktops, gaming notebooks, PC workstations, updates their Quantum SHIFT4K workstation, designed for maximum scalability and performance in Adobe Creative Suite while working with 4K source material.
MAINGEAR's powerhouse Quantum SHIFT4K PC workstations steps up the standard for workstation excellence by offering robust support for Adobe Creative Suite version 5.5. Designed to enhance workflow instead of requiring workarounds, the Quantum SHIFT 4K is a graphic and video editing PC and content creation powerhouse; courtesy of the new 8-core Intel Xeon processors E5-2600 product family that deliver up to 80% more performance vs. previous generation of Intel Xeon 5600 processors. With support for XML, EDL, and OMF import/export and networked storage, collaboration between editors and 3rd party post production houses is seamless with Quantum SHIFT 4K PC workstations. And with a wide selection of hardware options, the Quantum SHIFT 4K supports the hardware necessary to build a 4K editing PC that fits any professional editing environment. The Quantum SHIFT 4K with Adobe CS5.5 can be built to suit an existing infrastructure, not forcing the need to reinvest in new equipment.
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(PR) ASUS Releases ROG Xonar Phoebus Gaming Soundcard Set
Entry by the Republic of Gamers into the dedicated sound product arena brings PC enthusiasts ROG Xonar Phoebus, a high fidelity audio component that directly addresses the needs and concerns of contemporary gamers. The Xonar Phoebus features the exclusive ROG Command technology which reduces up to 50% of ambient noise thus providing authoritative voice quality during online multiplayer gaming sessions. And with its clear 118 dB SNR, and a powerful 600 ohm headphone amplifier, the Xonar Phoebus delivers precise positioning and lifelike immersion audio for a distinctly impactful gaming environment. Its dedicated control box extends convenience and puts more intuitive functions within easy reach for a more ergonomic desktop gaming environment.
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7 mm Won't Cut It, Intel Wants 5 mm-Thick Drives for Ultrabooks
Custodian of the Ultrabook specification, Intel pushed the storage industry to churn out slimmer devices to go with increasingly slimmer Ultrabooks sold by the various partner ODMs in the ecosystem. Even as HDD and SSD makers have only just come up with 7 mm-thick storage devices, Intel has a fresh list of changes it wishes to see with storage devices in the very near future, to be able to make it to the constantly-evolving Ultrabook specification. Intel wants near-future storage devices (SSDs and HDDs) to be no thicker than 5 mm.
Further, it wants to see the standard SATA host interface changed from "around" (out of) form, to "along" (inside) form host interface, which further slims down the drive compartment. These proposals were floated at IDF, Beijing. While coming up with slimmer SSDs was never really a tough task for SSD makers, as SSDs are essentially just millimeter-thick printed circuit boards with millimeter-thick components (controller logic, NAND flash memory, and ancillaries), it posed a huge technical challange to mechanical HDD designers, who have had to slim down key components that work to maintain inertial motion of spinning platters. This new proposal for 5 mm-thick HDDs could pose a newer, tougher desgin challenge.
Source: VR-Zone
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(PR) JEDEC Announces Plans to Standardize Non-Volatile Wireless Memory
JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced that its JC-64 Committee for Embedded Memory Storage and Removable Memory Cards has formed a Subcommittee focused on the standardization of non-volatile wireless memory. To be chaired by Nokia and vice-chaired by Micron Technology and Samsung Semiconductor, the JC-64.9 Subcommittee for Wireless Memory welcomes interested companies worldwide to participate by joining JEDEC or calling 703-907-7560 for more information.
Wireless memory is rapidly emerging as the next generation in data transfer technology, and is intended to enable fast, wireless connectivity with read/write capability between mobile devices (Wireless Memory Hosts) and battery-free memory tags (Wireless Memory Tags).
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(PR) Supermicro Expands its Networking Product Line with New, 52 Port Switches
Super Micro Computer, Inc., a global leader in high-performance, high-efficiency server technology and green computing, today announced additions to its Ethernet switch product line with a pair of powerful new 52 port 1 Gigabit Ethernet switches. The SSE-G2252 and its companion SSE-G2252P are IEEE 802.3az compliant providing Energy Efficient Ethernet services and offer 1 GbE connectivity over 48x RJ45 ports and 4x SFP ports. The SSE-G2252P model is IEEE 802.3at compliant and supports Power over Ethernet (PoE), offering the most flexible power budget allocation in the industry.
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(PR) New Hitachi Compute Blade Server Delivers High Performance and Scalability
Hitachi Data Systems Corporation, a wholly owned subsidiary of Hitachi, Ltd., today announced that it has expanded its portfolio of Hitachi Compute Systems with the addition of the new Hitachi Compute Blade 500. The new blade server is the first Hitachi Data Systems product to incorporate the latest Intel Xeon processor E5-2600. The open, flexible architecture and high-performance, high-availability features of Hitachi Compute Blade 500 make it an ideal platform for virtualized infrastructures and demanding cloud applications.
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Intel to Bring Ivy Bridge Launch Forward to April 23: Report
With eager OEMs such as ASUSTek, HP, Acer, and Lenovo breathing down its neck, Intel is reportedly pulling forward the official launch date of its 3rd Generation Core processor family based on 22 nm "Ivy Bridge" silicon, to the 23rd of April, from its older date of 29th April. 23rd April will be the day Intel announces all its processor models originally slated for the 29th.
Notebook OEMs are expected to launch their products based on these chips at the earliest, by May. The date of market-availability of these chips in the retail channel, however, remains unclear. One possibility is that Intel will announce and make these chips available on the same day (23rd), while another possibility is that it announces these chips on the 23rd, allows the media to digest them (by posting reviews), and open them up for sale on the 29th. Two models every PC enthusiast and their cat are looking out for, are the Core i7-3770K and Core i5-3570K.
Source: DigiTimes
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(PR) Fusion-io Brings the Power of ioMemory to the Workstation with Fusion ioFX
Fusion-io today announced that it is bringing the power of its ioMemory technology to visual effects professionals with the Fusion ioFX. Designed to eliminate data bottlenecks that slow the creative production process for digital artists, the Fusion ioFX enables creative professionals to meet deadlines while exploring more artistic possibilities by bridging the performance gap between workstations and today's powerful digital content creation applications.
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Intel Plans Low Power Xeon Processors for Micro-Servers This Quarter, Centerton in 2H
Intel is planning to launch a line of low-power Xeon processors in Q2-2012, which will be the company's first Xeon processors built on the 22 nm fab process, with 3D transistors. It is quite likely that these chips are built in the LGA1155 package, however Intel is only releasing low-power variants, which ensures performance-segment Xeon E3-1200 family isn't disturbed, and more importantly, it doesn't have to pull out the best bins of its 22 nm Ivy Bridge silicon just yet (for use in higher clock-speed Xeon parts).
Intel has another emerging problem. With the advent of "micro-servers" (low power independent servers in high-density data-centers, which provide better cost-performance and manageability than virtual servers), ARM processor architecture is making inroads to the enterprise computing market. Intel's answer to that is refining the same silicon that goes into making low-power Atom processors, and making it enterprise-grade. This part is codenamed "Centerton", and Intel expects an entire micro-server platform based on these chips to be out in the second half of 2012.
Source: C|Net
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