(PR) Apacer Unveils The Next-Gen Industrial Modular PATA SSD
Apacer Technology Inc., the global leader in memory module, demonstrates its outstanding customizability by rolling out the next-generation industrial modular PATA SSD for embedded/Thin Client devices: ADM 4 (ATA Disk Module). ADM4 boasts the slimmest profile among Apacer's PATA SSDs. It adopts a 44-pin connector and can be used either in parallel (at 180°) or perpendicularly (at 90° or 270°) for various mechanisms. The just-launched next-generation modular SSD breaks through the speed barriers by reaching the read/write speed of as fast as 80/50 MB/sec, which is several times higher than its predecessors. Widely recognized by Thin Client device users for its extreme reliability, the ADM series has made Apacer one of the main SSD suppliers for Thin Client systems around the world.
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Lenovo Readies New ThinkVision Monitors
Lenovo is readying the launch of three new ThinkVision monitors, the 19-inch ThinkVision LT1952, the 22-inch LT2252p and the 24-inch LT2452p. The three feature LED-backlit LCD panels, among these, the LT2452p features an IPS (in-plane switching) panel, that ensures good viewing angles. A selling-point here is the UL Environment SPC Gold certification.
The LT1952p features a native resolution of 1440 x 900 pixels, a 1000:1 contrast ratio and 170°/160° viewing angles, the LT2252p has the same specifications, except for its 1680 x 1050 pixels resolution. The LT2452p leads the pack with its 1920 x 1080 pixels resolution, 178°/ 178° viewing angles thanks to the IPS panel. A built-in USB hub, and a more flexible stand that allows tilting, swiveling and lifting adjustments, makes for the rest of this screen. The Lenovo ThinkVision LT1952, LT2252p, and LT2452p are priced at US $249.99, $339.99 and $449.99, respectively.
Source: TechConnect Magazine
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(PR) Broadcom to Acquire NetLogic Microsystems, Inc., A Leader in Network Processors
Broadcom Corporation, a global innovation leader in semiconductor solutions for wired and wireless communications, and NetLogic Microsystems, Inc. (Nasdaq:NETL), a leader in high performance intelligent semiconductor solutions for next generation networks, today announced they have entered into a definitive merger agreement. Under the agreement, NetLogic Microsystems shareholders will receive $50 per share in a transaction of approximately $3.7 billion, net of cash assumed.
The acquisition meaningfully extends Broadcom's infrastructure portfolio with a number of critical new product lines and technologies, including knowledge-based processors, multi-core embedded processors, and digital front-end processors, each of which offers industry-leading performance and capabilities. The combination enables Broadcom to deliver best-in-class, seamlessly-integrated network infrastructure platforms to its customers, reducing both their time-to-market and their development costs.
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(PR) VIA Labs Launches New Second-Generation USB 3.0 Hub Controller
VIA Labs, Inc., a leading supplier of SuperSpeed USB (USB 3.0) integrated chip controllers, today unveiled the VIA Labs VL811 4-port SuperSpeed Hub Controller. The VL811 is VIA Labs' second-generation USB 3.0 Hub product, and adds support for USB Battery Charging Spec. 1.2. Beyond transfer rates of up to 5Gbps, the VL811 features improved performance for new and existing devices with host controllers, and adds rapid-charging capabilities.
"VIA Labs VL811 builds on the success of the VL810, the world's first 4-port USB 3.0 Hub controller," said Terrance Shih, Project Manager of VIA Labs, Inc USB 3.0 Hubs. "It adds exciting new features, such as the rapid charging function and improved performance."
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Radeon HD 7900 Series to Use XDR2 Memory?
AMD's next-generation enthusiast graphics processor (GPU) is shaping up to be something more unique than expected. The GPU codenamed "Tahiti" is going to be bleeding-edge in terms of its feature-set. To begin with, there's talk that it will make use of PCI-Express Generation 3 (Gen 3) system bus, which will give it a mammoth 32 GB/s of system interface bandwidth. Next, Tahiti will use a number-crunching architecture that's a generation ahead of even the VLIW4 it released with Cayman. VLIW4 will make up for most of the HD 7000 series, but not the top-end Tahiti GPU, it will use what AMD is referring to as "CoreNext Architecture", which is expected to boost performance per square millimeter die area beyond even what VLIW4 manages.
The most recent piece of information is bound to shock and awe. Tahiti, it appears, will use the XDR2 memory interface. XDR2 is an ultra-high bandwidth and power-efficient memory bus that's competitive with GDDR5, maintained by Rambus, which is claimed by it to be a generation ahead of GDDR5. It's not like XDR2 will be exotic to AIBs, the XDR architecture is used in game consoles where the high-bandwidth offsets low memory capacity by allowing quick streaming of texture data. Rambus licenses XDR memory chip manufacture to notable high-volume vendors. Nordic Hardware compiled data from various unreliable sources to sketch out what Radeon HD 7900 series could look like.
Source: NordicHardware
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AMD FX Series Processors Up For Pre-Order
At last, AMD's highly-anticipated performance desktop processors, branded under the FX-Series, are up for pre-order, letting buyers book their chips so they could have it up and running on release date. American retailer Bottom-line Telecommunications (BLT) has the FX-8150 and FX-8120 eight-core chips; and FX-6100 six-core chip up for pre-order. Its price for the FX-8150 is US $266.28, the FX-8120 is priced at US $221.73, while the FX-6100 is priced at $188.32. BLT ships over ground for free to the 48 contiguous American states.
The new FX-Series processors are based on AMD's brand new "Bulldozer" micro-architecture, and come in the AM3+ package. The FX-8150 will lead the first wave with its eight cores clocked at 3.60 GHz, 16 MB of total cache (4x 2 MB L2 + 1x 8 MB L3); followed by the FX-8120 at 3.10 GHz, also with 16 MB cache. The FX-6100 six-core processor is clocked at 3.30 GHz, with 14 MB cache (3x 2 MB L2 + 1x 8 MB L3). Market release is expected in October. You can be ready for the new chips by purchasing socket AM3+ motherboards, ideally those based on the AMD 9-series chipset, as they are already available in the market.
Source: CPU World
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(PR) Thermaltake Announces New High-Wattage, High-Efficiency Toughpower XT PSU Models
Thermaltake, an award winning state of art PC power supplies, the leader and pioneer in PC thermal solutions, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, with "delivering the perfect user experiences" as our mission, this September Thermaltake is presenting a visionary outlook of the world first efficient high-output power supply unit "The Toughpower XT Platinum & Gold series", – a rigorous power plant series aiming towards hardcore gamers, DIY enthusiasts, professionals and massive power consumption machines to fulfill every possible condition.
The new Toughpower XT Platinum & Gold series is a set of meticulous PC power plants include 1275W Platinum, 1375W Gold and 1475W Gold, are the world first high-output power supply units with 80Plus Platinum and Gold (the highest efficiency levels) certified which can perform up to 94% power efficiency.
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Available Tags:SSD , Lenovo , USB 3.0 , VIA , USB , Radeon , AMD , Thermaltake ,
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