
MSI annouces exchange procedures for P67 and H67 motherboards
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GIGABYTE shipping new B3 P67 and H67 motherboards, available as early as this week
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Play PC games on your iPhone and iPad now, PS3 games in the near future
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Zalman Launches New USB3.0 External HDD Enclosures
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Korean cooing specialist has unveiled its new line-up of USB 3.0 enclosures (ZM-HE250 U3, ZM-HE350 U3 & ZM-HE350 U3E) and a USB 3.0 expansion card (ZM-PC302 U3), targeting enthusiasts. The stylish aluminium enclosures support 2.5" and 3.5" SATA I/ II HDDs and deliver data transfer speeds up to 5Gbps via a USB 3.0 interface. The ZM-PC302 U3 is a dual USB 3.0 port expansion card with PCI-e 1X interface and 4-Pin auxiliary power support (for stability), allowing users to add USB 3.0 functionalities to their PCs.
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OCZ Preps Vertex 3 and Vertex 3 Pro SSDs
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OCZ Technology Group's Vertex 3 and Vertex 3 Pro SSDs are poised to make their debut at Cebit 2011 next week. The 2.5" SSDs, powered by SandForce's SF-2000 series controllers, deliver data transfer speeds up to 550Mb/s (read) and 500Mb/s (write) and feature TRIM support, MLC NAND flash memory, and a SATA III interface. The Vertex 3, aimed at prosumers, is equipped with the SandForce SF-2200 processor and will be available in 120Gb and 240Gb capacities. The "enterprise-class" Vertex 3 Pro features a SF-2500 chip and will come in 100Gb, 200Gb, and 400Gb models. All Vertex 3 series SSDs are covered by a three-year warranty.
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GeForce GTX 550 Ti spotted in EU e-tail
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Biostar unveils its H61 motherboards
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iPhone 5 to feature larger screen and thinner bezel?
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It seems that parts of the upcoming iPhone 5 has been leaked in China. Yes, the image is the rumoured iPhone 5 screen component.
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