PowerColor has unveiled the world’s first passive cooled Radeon HD 6850 board, but the card is still undergoing some last minute tweaks and it’s not available just yet. It is reference clocked (775 MHz for the core and 4 GHz for the memory) and it will be marketed under PowerColor’s SCS3 brand. Of course, it’s a dual slot card, as the massive heatpipe packing cooler needs some breathing room.
Read More ...
LGA 775 still dominates Intel market
In Q4 2010, a massive 65 percent of all CPUs in desktop volume are still Intel LGA 775 socket based. This is the Core 2 and current Celeron socket. Amazingly, the current Core iX generation with all the Core i3, i5 and i7, even some Pentiums holds 27 percent of the market. This is LGA 1156 peak as the plans is that in Q1 2010 its market share goes down to 22 percent, in favour to soon to launch new Core iX (2000) generation.
Read More ...
Acer unveils Android device with massive screen
Acer has unveiled its latest Android device, a smartphone with a massive 4.8-inch display and 1024x480 resolution. The device runs on Android 2.2 Froyo, a 1GHz Snapdragon processor, and 8MP camera with AF and LED flash and a front-facing 2MP camera as well. Acer's unnamed device will also have HSDPA 14.4Mbps support, WiFi b/g/n, Bluetooth 3.0, DLNA streaming, 6-axis motion sensing, and an HDMI-out port.
Read More ...
X58E remains Intel's high end chipset for 2011
Intel Gulftown six-core Extreme Edition CPUs are working happily on X58 based motherboards, and most of the new socket B 1366 motherboards already have X58E chipset. Intel still officially talks only about X58 chipset that was introduced almost two years ago (Q4 2008) and there are no any changes in the official chipset listing at Intel’s webpage.
Read More ...
OCZ expands DRAM product families
OCZ Technology unveiled two new types of its own-designed heat-spreaders for memory modules as well as expanded its product families with new offerings. The new cooling solutions are not as compact as OCZ's own Extreme Thermal Convection (XTC) heat-spreaders, but are smaller than some of competing solutions. The new Extreme Thermal Exchange (XTE) cooling solution is a rather simple solid heat-spreaders with increased height to increase the heat dissipation surface area. The cooling devices are made of aluminum alloy. The Blade 2-branded heat-spreaders feature finned anodized aluminum heatsink design and some shapes on the surface are stylized for blades.
Read More ...
No comments:
Post a Comment