AMD ships Llano samples to customers
After plenty of delays and rescheduling, AMD's "Fusion" project is finally nearing the end of its gestation in terms of the company's first-generation part which merges CPU and GPU, with their Llano parts now sampling to customers with an eye to hitting a retail release date early in 2011.
Quite a lot is known about Llano processor, which is a part of Sabine platform. As reported earlier, AMD Llano accelerated processing unit (APU) will have four x86 cores based on the current micro-architecture each of which will have 9.69mm² die size (without L2 cache), a little more than 35 million transistors (without L2 cache), 2.5W – 25W power consumption, 0.8V – 1.3V voltage and target clock-speeds at over 3.0GHz clock-speed. The cores will dynamically scale their clock-speeds and voltages within the designated thermal design power in order to boost performance when a program does not require all four processing engines or trim power consumption when there is no demand for resources. According to sources familiar with the matter, different versions of Llano processor will have thermal design power varying from 20W to 59W: high-end dual-core, triple-core and quad-core chips will have TDP between 35W and 59W; mainstream chips with two of four x86 cores will fit into 30W thermal envelope and low-power dual-core Llano chips will have 20W TDP. Llano will be made using 32nm SOI process technology.
AMD Sabine platform will also include code-named Hudson input/output controllers that will support PCI Express graphics port, 16 USB ports, USB 3.0 support (Hudson M3 only), 6 Serial ATA ports with RAID support, 1Gb Ethernet, integrated video DAC, integrated clock-generator and so on. Besides, Sabine may also feature optional Vancouver-series graphics processing units.
AMD Sabine platform will also include code-named Hudson input/output controllers that will support PCI Express graphics port, 16 USB ports, USB 3.0 support (Hudson M3 only), 6 Serial ATA ports with RAID support, 1Gb Ethernet, integrated video DAC, integrated clock-generator and so on. Besides, Sabine may also feature optional Vancouver-series graphics processing units.
X-Bit Labs have the full story.
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Details aplenty on Apple's next-generation iPhone
By now, you've probably heard at least some of the stories surrounding the discovery of a prototype next-generation iPhone in a bar, but thus far Gizmodo seem to have by far the best coverage of the device, complete with plenty of pictures and information - well worth checking out if you want to get an idea of what Apple have up their sleeves for the coming months.
While Apple may tinker with the final packaging and design of the final phone, it's clear that the features in this lost-and-found next-generation iPhone are drastically new and drastically different from what came before. Here's the detailed list of our findings:
What's new
• Front-facing video chat camera
• Improved regular back-camera (the lens is quite noticeably larger than the iPhone 3GS)
• Camera flash
• Micro-SIM instead of standard SIM (like the iPad)
• Improved display. It's unclear if it's the 960x640 display thrown around before—it certainly looks like it, with the "Connect to iTunes" screen displaying much higher resolution than on a 3GS.
• What looks to be a secondary mic for noise cancellation, at the top, next to the headphone jack
• Split buttons for volume
• Power, mute, and volume buttons are all metallic
What's new
• Front-facing video chat camera
• Improved regular back-camera (the lens is quite noticeably larger than the iPhone 3GS)
• Camera flash
• Micro-SIM instead of standard SIM (like the iPad)
• Improved display. It's unclear if it's the 960x640 display thrown around before—it certainly looks like it, with the "Connect to iTunes" screen displaying much higher resolution than on a 3GS.
• What looks to be a secondary mic for noise cancellation, at the top, next to the headphone jack
• Split buttons for volume
• Power, mute, and volume buttons are all metallic
You can find plenty more juicy details over here.
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