(PR) Nexus Technology Announces VCT-9000 CPU Cooler
Nexus announces the VCT-9000 CPU cooler. The Nexus VCT-9000 cooler combines some of the most advanced technologies in the market used for CPU coolers: heat pipes directly on the CPU core, SkiveTek and 3 types of ultra-thin fins combined with a real silent PWM controlled 12cm fan at a 25 degree angle. This type op performance has never been this quiet before.
The 120mm fan is PWM controlled and the speed varies between an utterly low 500 and 1600 RPM creating the lowest possible noise-output. Further more the fan is fitted with for blue LED's. The 5 heatpipes - one of 8mm and four of 6mm diameter - are fitted using the advanced Heatpipe-On-Core technology to guarantee the fasted heat dissipation possible.
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Gigabyte GA-890GPA-UD3H Motherboard Gets Listed
American retailer Newegg.com has started listing Gigabyte's GA-890GPA-UD3H motherboard, one of the first motherboards based on the AMD 890GX + SB850 chipset. This socket AM3 motherboard boasts of native SATA 6 Gb/s support, USB 3.0, Radeon HD 4250 integrated graphics, at a price of $139.99. The GA-890GPA-UD3H supports socket AM3 AMD Athlon II and Phenom II series processors, including support for the upcoming Phenom II X6 six-core processors. It also supports dual-channel DDR3 memory at speeds of over 1866 MHz by overclocking. Expansion slots include two PCI-Express 2.0 x16 (electrical x8/x8 when both are populated), three PCI-E x1, and two PCI, bringing CrossfireX support. The SB850 gives out six SATA 6 Gb/s ports with RAID 0, 1, 0+1, 5, 10, and JBOD modes. An NEC-made USB 3.0 controller also provides two USB 3.0 ports. The IGP connects to displays over D-Sub, DVI, and HDMI. Presumably, this could be the starting point for more AMD 890GX based motherboards to reach stores world over.
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(PR) Samsung Expands Green Line-up with Industryآ’s First Volume 40nm-class 4Gigabit DDR3
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing the industry's first low-power (green) four gigabit (Gb) DDR3 devices using 40 nanometer (nm) class process technology. The high-density memory is expected to bring significant power savings to data centers, server systems and high-end notebooks.
"When our 40nm-class DDR3 was first introduced last July, we were well ahead of the curve for high density, high performance DDR3," said Dong-Soo Jun, executive vice president, memory marketing, Samsung Electronics. "Now, in just seven more months, we have introduced an ultra-low power 'Green Memory' - the 4Gb DDR3, which is double the density of its predecessor. At a module density of 16-gigabyte (GB), the 4Gb based module can save 35 percent in power consumption, to support customer requirements for more energy-efficient designs."
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(PR) LaCie Announces the Next-Gen Line of NAS Devices for Small to Medium Businesses
LaCie announces next generation line of network storage devices for small to medium-sized businesses: the LaCie d2 Network 2 (single disk), LaCie 2big Network 2 (two disks) and LaCie 5big Network 2 (five disks).
Delivering superb data access of up to 70 MB/s, these professional, reliable central storage devices allow users to share files instantly or back up any PC or Mac on a network. These complete backup solutions are Time Machine compatible and include Genie Backup Manager Pro (Windows) and Intego Backup Manager Pro (Mac). With these applications you can make encrypted, compressed backups, restore office files, and even perform disaster recovery.
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Thermalright Unveils VRM-R5 Heatsink for Radeon HD 5800 Series Graphics Cards
A couple of months after releasing the VRM-R3 and VRM-R4 VRM heatsinks for the ATI Radeon HD 5800 series graphics cards, Thermalright is back with yet another HD 5800 series VRM heatsink, the VRM-R5. The new heatsink offers passive or fan-assisted cooling dedicated the the graphics card's VRM chips - major heat-producing components next to the GPU and memory chips. Cooler VRM chips could mean better electrical stability, affecting overclocking headroom.
The VRM-R5 makes the main block portion of the heatsink elaborate, with complex, branched metal ridges. From here two 6 mm aluminum heat pipes conduct heat to a block of aluminum fins. The fins are punched to improve heat dissipation. An 80 mm fan can be attached to this block for active cooling. The heatsink measures 118 x 117 x 122 mm, and weighs 140 g. The heatsink is compatible with some VGA coolers by Thermalright, notably Spitfire. It will reach stores next week at a price of 23 EUR.
Source: TechConnect Magazine
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