Thermaltake Ready with Frio CPU Cooler
Thermaltake seems to have finished development of its new high-end CPU cooler, the Thermaltake Frio. Designs of this cooler surfaced as early as in June this year, originally slating it for Computex 2009. After some development delay, it has finally taken shape with the disctinct black+red color scheme the company's Level 10 case comes with. The design consists of a CPU contact block from which five seemingly 8 mm heatpipes arise, conveying heat to a dense aluminum fin array which has largely rectangular fins. The array is cooled a 120 mm fan. There is provision to install one on either sides, that rotates at speeds between 1200 - 2500 rpm. The cooler supports all current CPU sockets, including LGA-1366, LGA-1156, LGA-775, AM3/AM2+. The cooler is now slated for CES 2010.
Source: XTReview
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(PR) MSI Unveils New Refined Wind U Series Netbooks
The 2010 International Consumer Electronics Show (CES) officially kicks off on January 7 in Las Vegas! MSI's formidable achievements in R&D and design will be out in force. In addition to ultra-thin and stylish designs, the much talked about and yet to be released 2010 iF Product Design Award winning netbook, the Wind U160, will be unveiled at CES.
Embodying MSI's flawless and exquisite craftsmanship, the Wind U Series notebooks have not only won countless awards, they've also repeatedly achieved success in the market, with over one million in worldwide sales to date. MSI continues to innovate and uphold its concept of insisting on the best by infusing these concepts into the impressive MSI Wind U Series. Many of these high-quality, exquisite notebook models will be on display at CES, including the Wind12 U200, the U230, the all-new U135, and the iF Product Design Award winning ultra-thin and stylish U160 netbook. With a beautiful and stylish appearance, the U160 features MSI's distinctive Chiclet keyboard, Color Film Print Technology, an artistic and ultra-thin fuselage, and all new software upgrades. In addition its hardware has also been fully upgraded. Featuring the latest generation Intel ATOM N450 processor and Windows 7 OS, the all new elite product series is sure to once again capture international attention and capitalize on market opportunities.
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(PR) MSI Announces New Trend Towards Energy-saving PCs for CES
World-leading All-in-One PC brand MSI will be showcasing several new models that embody the global trend towards energy-saving PC design at the CES 2010 exhibition. The new models, which feature the Pine Trail technology platform with the new Intel Atom processor, include the Wind Top AP1920 All-in-One PC and the Wind Box DE220 and Wind Box DC500 Mini PCs. These products deliver low energy consumption with no compromise in performance; their average power consumption is more than 80% lower than that of a standard desktop PC. The compact, lightweight design also takes up less space than a traditional PC.
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Foxconn Intros Pine Trail Based Mini-ITX Nettop Motherboards
Foxconn has unveiled one of the first motherboards based on Intel's "Pine Trail" second generation Atom processor platform: the D41S and D51S (pictured in the same order below), both based on the mini-ITX form factor. The D41S is powered by a single-core Atom D410 processor, while the D51S is powered by dual-core Atom D510, both these processors run at speeds of 1.66 GHz. The former is cooled passively by a heatsink, while the latter makes use of a fan-heatsink. The rest of the board layouts are identical. The processor is wired to two DDR2 DIMM slots for single-channel DDR2 667 MHz memory. It embeds Intel GMA 3150 graphics with a D-Sub connector for output. A lone PCI slot provides expansion. The chipset gives out two SATA 3 Gb/s ports for storage. Its rear-panel includes six-channel HD audio, D-Sub, gigabit Ethernet, four USB 2.0 ports, PS/2, serial and parallel ports. The two will be out in the coming few weeks.
Source: XTReview
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DisplayLink to Adopt USB 3.0
DisplayLink, the company behind USB-based display controllers has disclosed plans to release a display chip during the upcoming CES event next month, that runs on USB 3.0 SuperSpeed interface. The new chip will make use of the increased bandwidth (up to 4.8 Gbps vs. 480 Mbps of USB 2.0), to transmit higher-resolution videos. The current USB 2.0 based DisplayLink chips are able to transmit display of 3D games at 60 fps and HD video at 26~27 fps. The new USB 3.0 based chip will be able to do the same faster, without any flickering, said Dennis Crespo, executive vice-president of marketing and business development at DisplayLink. The DisplayLink technology involves using the system's graphics hardware to drive multiple display-heads, by transmitting display across USB.
Source: ComputerWorld
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