(PR) Toshiba Launches Highest Density Embedded NAND Flash Memory Devices
Toshiba Corp. (Toshiba) and Toshiba America Electronic Components, Inc. (TAEC), its subsidiary in the Americas, today announced the launch of a 64 gigabyte (GB) embedded NAND flash memory module, the highest capacity yet achieved in the industry. The chip is the flagship device in a line-up of six new embedded NAND flash memory modules that offer full compliance with the latest e-MMC standard, and that are designed for application in a wide range of digital consumer products, including Smartphones, mobile phones, netbooks and digital video cameras. Samples of the 64GB module are available from today, and mass production will start in the first quarter of 2010.
The new 64GB embedded device combines sixteen pieces of 32Gbit (equal to 4GB) NAND chips fabricated with Toshiba's cutting-edge 32nm process technology, and also integrates a dedicated controller. Toshiba is the first company to succeed in combining 16 pieces of 32Gbit NAND chips, and applied advanced chip thinning and layering technologies to realize individual chips that are only 30 micrometers thick. Full compliance with the JEDEC/MMCA Version 4.4(V4.4) standard for embedded MultiMediaCards supports standard interfacing and simplifies embedding in products, reducing development burdens on product manufacturers. Toshiba offers a comprehensive line-up of single-package embedded NAND Flash memories in densities ranging from 2GB to 64GB. All integrate a controller to manage basic control functions for NAND applications, and are compatible with the latest e-MMC standard and its new features, including defining multiple storage areas and enhanced security features.
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(PR) Corsair Launches 24GB Dominator DDR3 Memory Kit for HPC Applications
Corsair, a worldwide leader in high-performance computer and flash memory products, today announced a 24GB Dominator triple-channel DDR3 memory kit designed for high-performance desktop and workstation computing applications.
Corsair's 24GB Dominator DDR3 memory kit has been rigorously tested in high-performance platforms based on the Intel X58 motherboard chipset for Intel Core i7 [Bloomfield] processors. It comprises six 4GB DDR3 DIMMs that operate at a frequency of 1333MHz, at latency timings of 9-9-9-27, with 1.65V VDIMM. The 24GB Dominator memory kit also features Corsair's patented DHX+ heatsink technology for optimal cooling and reliability. The modules, equipped with signature American Racing Blue heatsink fins, are found on select Corsair Dominator DDR3 memory for Intel Core i5 and Core i7 platforms in 8GB and 12GB kits.
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Intel Readies 13 Westmere-based 32 nm Xeon Processors
Outgrowing the known lineup of 32 nm client processors (under the Core family), Intel's upcoming lineup of processors based on the 32 nm Westmere architecture will comprise of no less than 13 models under the Xeon E5000, L5000, X5000, and W3600 series. Among these, there are six hexa-core Xeon processors, including X5680 (3.33 GHz), X5670 (2.93 GHz), X5660 (2.80 GHz), and X5650 (2.66 GHz). X5680 has a TDP of 130W, with the latter three sub 3 GHz models having TDP as low as 95W. There is an energy-efficient L5640 hexa-core model clocked at 2.26 GHz, with TDP at 60W, and a single-socket W3680, clocked at 3.33 GHz with 130W TDP. All these models have six cores, and 12 MB of L3 cache.
Next up, are Intel's first 32 nm quad-core processors: Xeon X5677 (3.46 GHz, 130W), X5647 (3.06 GHz, 95W), E5640 (2.66 GHz, 80W), X5630 (2.53 GHz, 80W), X5620 (2.40 GHz, 80W), and energy efficient L5630 (2.13 GHz, 40W), and L5609 (1.86 GHz, 40W). Except L5609, all these quad-core chips have HyperThreading Technology and Turbo Boost available. The L2 cache amounts for each of these chips is unknown as of now, but should be up to 8 MB, or as low as 4 MB for some models. Most of these chips are slated for release on March 16, 2010.
Source: ChannelWeb
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(PR) VIA Nano Processor Readies VIA EPIA Boards for Next Generation Embedded Applications
VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest VIA EPIA-M800 Mini-ITX and VIA EPIA-N800 Nano-ITX boards. Featuring the 64-bit, high-performance VIA Nano processor, these new embedded boards bring advanced digital multimedia performance to the next wave of embedded devices on forthcoming Windows 7-based technologies.
Devices based on the VIA EPIA-M800 and VIA EPIA-N800 leverage the performance enhancements of the VIA Nano processor, offering an improved user experience with advanced human to machine interaction and a visually stunning multimedia experience through the latest HD codecs and media streaming technologies. Specific applications include the latest media-centric designs in digital signage and advanced information, ticket and kiosk machines.
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(PR) A-DATA and SandForce Team up to Offer Innovative SSD Solutions
A-DATA Technology Co., Ltd., the worldwide leader in DRAM modules and Flash application products, today announced a collaboration with SandForce Inc. on A-DATA's solid state drives (SSDs). As its major partner, A-DATA will work closely together with SandForce on a broad-scale basis in developing enterprise storage solutions for high-end workstations/servers in light of the emerging cloud computing technology in the near future. A-DATA has also planned to include the next-generation SandForce-based SSDs in its product lineup.
"Combining high-performance SSD Processors from SandForce with A-DATA's experienced design team and complete manufacturing base is expected to create synergy to further propel the SSD performance to the ultimate," said Gibson Chen, Vice President of A-DATA Technology. "From enterprise solutions designed for high-end workstations to mainstream solutions for general personal computing, A-DATA strives to optimize each aspect and detail to bring out an outstanding performance."
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(PR) QNAP Expands Capabilities of Its Turbo NAS Servers with Upgraded NAS Software
QNAP Systems, Inc., a leading manufacturer of world class NAS servers today announced an impressive update to the NAS management software that powers its business-class Intel-based Turbo NAS servers. The NAS management software version 3.2, embedded as firmware, provides a segment-leading iSCSI target solution supporting SPC-3 persistent reservation, MPIO and MC/S allowing forward-thinking SMB and corporate customers the ability to deploy the NAS as a storage server in the virtualized and clustered infrastructure. Additionally, the newly updated management software also steps up its backup capabilities by adding Apple Time Machine support and even redundant backups to Amazon's S3 cloud storage platform.
In addition, for ease of management, IT administrators can also benefit from the DFS support (Share Folder Aggregation), import of user-list, and customizable Daylight Saving Time. Further, the next-generation Internet Protocol, IPv6, has also been incorporated for future networking evolution. QNAP's Web File Manager 2 features an entirely redesigned user interface and functionality for improved file sharing and management. WebDAV is also available for users to collaboratively share, access, and edit files over HTTP and HTTPs.
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ASUS Ready with EAH5770 CuCore Graphics Card
With the recent spurt of non-reference design Radeon HD 5770 graphics cards, ASUS seems to be ready with its EAH5770 CuCore, where "CuCore" stands for copper (Cu) core, used in the GPU cooler. Speaking of which, the GPU cooler consists of a GPU base which has 5.8 oz (164.5 g) of copper, for better transfer of heat, to the rest of the heatsink which has radially-projecting aluminum fins. The PCB designed by ASUS seems to be slightly longer than the reference AMD PCB, yet it only makes room for one CrossFire connector, meaning its can pair with only one more card of its kind (or up to three more cards with two CrossFire connectors).
The 40 nm Juniper GPU has DirectX 11 compliance, and is powered by 800 stream processors, and connects to 1 GB of memory across a 128-bit GDDR5 memory interface. Despite the swanky cooling the card sticks to reference AMD clock speeds of 850/1200 MHz (core/memory), but comes with the ASUS VoltageTweak feature that allows software voltage adjustments. The rear-panel is redesigned too, with one of the slots making for a large vent, with the lower slot holding one each of DVI-D, D-Sub, and HDMI. The ASUS EAH5770 CuCore is expected to be priced under 130 EUR.
Source: PCPOP
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NesteQ Intros E2CS X-Strike PSUs
NesteQ is ready with a new high-end modular power supply, the E2CS X-Strike. Part of a series, variants include 400W, 500W, 600W, 750W, 850W, and 1000W. These PSUs feature energy efficiency ratings of up to 92%, whihch makes them 80 Plus Gold certified. The +12V circuit features as many as six rails, with a unique Power Monitoring Panel feature that provides diagnostic LED readouts for each +12V rail, and the +5V, and +3.3V circuits. Another unique feature is with its connectors, the Enhanced Easy Connecting System provides modularity to even the cables which connect to the PSU, so only the connectors that are really needed could be put in place. Further, users can chain those cables to make a single, long cable, helping in cable management in certain cases. Output diagram and connectors' list specific to the variant are provided below.
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