(PR) Micron Introduces a New Way to Increase Server Memory Capacity, Improve Performance
Micron Technology, Inc. today announced that it has produced the industry's first DDR3 load-reduced, dual-inline memory module (LRDIMM) and will begin sampling 16-gigabyte (GB) versions this fall. By reducing load on the server memory bus, Micron's LRDIMMs provide the option to support higher data frequencies and significantly increase memory capacity.
The new LRDIMMs will be manufactured using Micron's leading-edge 1.35-volt, 2-gigabit (Gb) 50-nanometer DDR3 memory chips, allowing the company to easily and cost-effectively increase server module capacity because of the chips' high-density and industry-leading small die size. Micron's 2Gb 50nm DDR3 product is currently in qualification with customers and is ramping toward high volume production.
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EIZO Intros New FlexiScan WUXGA Professional-Grade Monitor
EIZO Japan announced its newest 24.1 inch LCD monitor, the FlexScan S2433W-H. Aimed at graphics professionals and the likes, this monitor sports a native resolution of 1920 x 1200 pixels (WUXGA). It provides a brightness of 360cd/m2, and a static contrast ratio of 1000:1. The EcoView and EyeCare features adjusts brightness to best suit the ambient lighting conditions, and work to conserve energy. The panel has a wide viewing angle of 178 degrees. It takes input from DVI-D (HDCP capable), D-Sub, and DisplayPort. It is able to reproduce 96% of the Adobe RGB colour-space. Available in matte black and silver, the FlexScan S2433W-H started selling in Japan for 94,800 JPY (US $995).
Source: Akihabara News
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SilverStone GD03 ATX HTPC Case Hits Stores Soon
Case and power specialist SilverStone announced its latest HTPC case, the GD03, which will reach stores soon. The case features in the company's elite Grandia series of HTPC cases, and supports an ATX motherboard with seven expansion slots. Measuring 425mm (W)x182.2mm (H)x436mm (D), the GD03 weighs 7.85 kg (17.3 lbs). The front panel is made of brushed aluminum, while the rest of the case with SECC. It sports two external 5.25" drive bays, three external 3.5" bays of which two allow hard-drive hot-swapping. There are three 80 mm fans to cool this case, positioned in the front (HDD area), rear, and side. A standard ATX power supply fits in the PSU bay. The GD03 is expected to cost around 190 Euro.
Source: TechConnect Magazine
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GlacialTech Ready with LGA-1156 Igloo Coolers
GlacialTech seems to be ready with its Igloo series models for the upcoming Intel LGA-1156 socket. Igloo coolers are traditionally stock heatsink replacements that are at best slightly better than the cooler the processor ships with, ideal for OEMs. GlacialTech has two models ready this time: the smaller Igloo 1050, and the larger Igloo 1100. The two measure 95x95x57 mm and 95x95x67 mm, and weigh in at 310 g and 380 g, respectively. The two are mounted with an 80 mm PWM controlled fan. These should be out in the market by the time the first LGA-1156 processors arrive, and that's five weeks from now. Variant details follow.
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(PR) Lian Li Launches PC-8N General Purpose Midi Tower Chassis
Lian-Li Industrial Co. Ltd has launched the PC-8N Mid Tower chassis ideal for PC systems. The hair-line brushed all aluminum chassis features advanced thermal dynamics, using one fan on the front (1x 120mm@1200RPM) to pump cool air into the chassis where it exhausts out the rear fan (1x 120mm@1200RPM). The 7x PCI expansion slots are vented and assist with airflow. The chassis front face has 4x 5.25" ODD bays and a 3.5" drive bay. The front face clips off easily and conveniently. The dimensions stand at 210x450x490mm (W, H, D). The top panel is removable and the entire system has smoothed edges, and an anti-vibration design.
The chassis supports 4x 5.25" Optical drive bays with 1x 3.5" external. The HDDs have a specially designed cage that secures them snugly via thumb screw struts supported with rubber grommets. The entire cage secures the HDDs via a patented slider bar that secures all the HDDs simultaneously. The PC-8N midi case is for Micro-ATX or ATX motherboards and has 7 PCI expansion slots, which are well ventilated with special vented brackets when not in use. The top panel is removable with the multimedia I/O ports on the front panel consisting of 2x USB2.0 as well as HD+AC97 Audio. The PSU fits securely at the rear top of the chassis.
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(PR) Active Media Products Introduces Penguin Bootable Linux USB Drive
Active Media Products (AMP), manufacturer of SSDs and WWF series USB drives, today announced immediate availability of a bootable Linux USB (BLU) drive that is compatible with Windows 7 and benefits WWF. These new penguin BLU drives are preloaded with the full installation of Ubuntu Linux 9.0.4.
BLU drives allow booting into Ubuntu Linux from the USB drive regardless of what operating system is installed on the hard drive. Because the hard drive will still be fully accessible when booting from the BLU drive, it's an excellent disaster recovery solution in the event of problems with the operating system on the primary hard drive, because important data files on the hard drive can be backed up onto the BLU drive or another USB storage device.
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(PR) Silicon Power Releases Built-in Temperature Sensor DDR3 1333/1066 Server DRAM Modules
World class memory/DRAM module manufacturer, Silicon Power sets the sight on server class DDR3 DRAM module. Officially released as of today, the modules come with built-in temperature sensors and are made specifically for servers and workstations. Available in 1333/1066 MHz speeds, they are compatible with Intel Nehalem-based Xeon 5500 platform in tri-channel operation. With its built-in temperature sensor, it can effectively prevent system crashes, maximize efficiency and improve overall performances. It is the perfect fit for servers and workstation PCs that require stability, efficiency and processing power.
For serves and workstation PCs, platform stability is always a concern with system's heat production. Silicon Power's DDR3 1333/1066 temperature sensor can be monitored by the system and will address memory workloads accordingly to prevent overheating or overworking the modules. It effectively lowers module temperatures by evenly distributing workloads to ensure maximum system performance and stability.
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