Bluetooth 3.0 Launches on April 21st
The anticipated Bluetooth 3.0 is gearing up to be launched this month. Set to be released on the 21st of April, the third Bluetooth specification will offer improved speeds, though they're not yet finally specified. Bluetooth 3.0 will be backward compatible with older Bluetooth standards. Most importantly Bluetooth 3.0 will use 802.11 protocol to transfer data. This will allow devices to pair through an 802.11 protocol and if there is no Wi-Fi detected, older Bluetooth standard will be used. The new Bluetooth specification will also add Enhanced Power Control - a feature that is said to reduce the number of disconnects between the paired devices and this way save the battery life. Later this month, when Bluetooth 3.0 is finally announced, the Bluetooth SIG will probably start making a list of manufacturers that will incorporate the new technology.
Source: Neowin
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(PR) Five ASUS VH Series Monitors Get the Highest EPEAT Gold Rating
Five ASUS VH Series LCD monitors with screen sizes ranging from 20" to 24" have been EPEAT registered at the Gold level, the highest EPEAT rating possible. Designed and manufactured in strict adherence to GreenASUS principles, the ASUS VH202T-P, VH222H-P, VH232H-P, VH236H-P and VH242H-P successfully met or exceeded the required criteria and at least 75% of the optional criteria necessary to receive a Gold rating from EPEAT. These LCD monitors now join ASUS' Bamboo Series and N Series notebooks in the elite rung of electronic products bearing the EPEAT Gold eco-label.
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(PR) CEA/Leti and IBM to Collaborate on Future Nanoelectronics Technology
CEA/Leti (the Electronics and Information Technology Laboratory of the CEA, based in Grenoble), and IBM today announced that they will collaborate on research in semiconductor and nanoelectronics technology. This five-year agreement is focused on advanced materials, devices and processes for the development of complementary metal oxide semiconductor (CMOS) process technology for the production of microprocessors and integrated circuits at 22nm and beyond.
With this agreement, CEA/Leti becomes a research associate of IBM and IBM's semiconductor Joint Development Alliance ecosystem centered in Albany, N.Y. CEA/Leti will reinforce this ecosystem through its specific expertise in low-power CMOS (such as SOI technologies), in e-beam lithography and in nanoscale characterization and modelling. This agreement strengthens the links between the IBM and Crolles-Grenoble ecosystems, following STMicroelectronics' decision to join the IBM Alliance in 2007, for the development of core CMOS and value-added application-specific derivative technologies and industrialization of these processes.
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NVIDIA Releases PhysX System Software 9.09.0408 WHQL
NVIDIA made an update to the PhysX system software, the common backend for all NVIDIA products that support PhysX: GeForce 8 series and above graphics processors, and Ageia PhysX accelerator cards. Version 9.09.0408 packs the following changes and features according to the company:
- Updated runtime to improved operation of Cryostasis Game.
- Supports NVIDIA PhysX acceleration on all GeForce 8-series, 9-series and 200-series GPUs with a minimum of 256MB dedicated graphics memory.
- Experience GPU PhysX acceleration in many games and demos, some of which are highlighted in PowerPack downloads on www.geforce.com.
- Runtime upgrade ONLY for AGEIA PhysX processors users. (New installations should install older PhysX system software such as version 8.09.04 آ– prior to installing this update).
- Includes the latest PhysX runtimes used in the latest game titles.
- Supports NVIDIA PhysX acceleration on GeForce via CUDA 2.0 for SDK versions 2.7.3, 2.7.2, 2.7.5, 2.8.0 and 2.8.1 (requires graphics driver v177.81 or later).
- Includes all the latest PhysX SDK Runtimes.
- Supports control of your GPU PhysX configuration from the NVIDIA display driver control panel. (requires graphics driver v180.00 or later)
DOWNLOAD: NVIDIA PhysX System Software 9.09.0408 WHQL
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(PR) UMC Becomes the First Company Ready for Real, High-Performance 40 nm Manufacturing
UMC, a leading global semiconductor foundry, today announced that it has delivered customer ICs produced on its High Performance (HP) 40 nm process technology. The products were manufactured with excellent cycle time and yields for the large die-size programmable logic chips, which leveraged the foundry's triple-gate oxide, 12 metal layers and copper/low-k technology to enable 65% reduced power consumption and more than twice the density improvement over previous 65nm generation products. The advanced 40 nm ICs have already begun shipping in volume to the customer's end users for product sampling.
S.C. Chien, vice president of advanced technology development at UMC, said, "UMC continues to remain at the forefront of semiconductor foundry technology through the timely delivery of leading-edge processes that meet the demanding requirements of today's advanced applications. The delivery of these 40 nm customer products underscores this technology commitment, we look forward to bringing the performance advantages of our proven 40 nm technology to even more UMC customers."
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EVGA Intros GeForce GTX 275 FTW Edition
Pushing up the ante, EVGA introduced the GeForce GTX 275 FTW Edition (model 896-P3-1173-AR). FTW means "for the win", in gamer jargon. The company has been using the "FTW" label for peak-performance variants of graphics cards and motherboards. In the case of graphics cards, it comes with the highest factory-overclocked parameters available in its lineup.
Featuring the default design of the rest of the cards in its series, the GeForce GTX 275 FTW comes with clock speeds of 713/1512/2520 MHz (core/shader/memory), against the reference speeds of 633/1404/2268 MHz. The card features 240 stream processors, and 896 MB of memory across a 448-bit wide GDDR3 interface. The card is listed on the company store for US $299.99, a $50 premium over the base-model.
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(PR) Thermaltake Announces V14AX CPU Cooler
Thermaltake, known as the leader in Thermal industry by continuously introducing innovative product, today officially releases another masterpiece, V14AX. With its excellent performance and included clips, it can support the latest and fastest Intel Core i7 processors.
V14AX is the best choice for gamers and over-clocking enthusiasts. It equips a giant 14cm VR fan. Users can adjust the fan speed according to their own needs. Side flow design is to integrate with the system fan and optimize the ventilation. Meanwhile, V14AX has 6 heatpipes and mirror coating copper base that can maximize the heat transferring speed from CPU to the heat sink. The large dissipating aluminum surface will also maximize the heat dissipation. With these features, users can definitely experience the ultimate performance of latest Intel Core i7 processors.
Topped off with a tube of Thermaltake superb performance thermal grease TG-1, V14AX is without a doubt the best choice for your high end cooler. For more information, please visit the product page.
Source: Thermaltake
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