Showing posts with label AnandTech. Show all posts
Showing posts with label AnandTech. Show all posts

Thursday, May 5, 2016

IT News Head Lines (AnandTech) 06/05/2016

AnandTech



HP Announces 32” Pavilion Display for Everyone: QHD for $399
HP has introduced its Pavilion 32 display (V1M69A), which promises to combine large size, QHD resolution, VA panel and affordability. The Pavilion 32 monitor may not appeal to professionals or hardcore gamers, but for mainstream users this one could be a game changer because of its price-point. The monitor will hit the market late next month as a part of HP’s back-to-school product refresh.

Modern day desktop workloads involve a lot of multitasking as well as long documents, large spreadsheets and high-resolution images. For many tasks, big displays are not a luxury, but rather a necessity. However, it is not easy to find a monitor that boasts with a large size, a good quality panel and an affordable price. There are relatively inexpensive 24” and 27” monitors with IPS or VA panels available, but when it comes to models with diagonals like 30” and larger, then it is not easy to find a good quality affordable display. While there are low-priced 32” monitors from unknown brands, they usually feature cheap TN panels and can hardly boast with good quality. Meanwhile, well-known suppliers charge $500 and up for their 32” models, which is more than many people are willing to spend on a display. With its Pavilion 32, HP wants to address the market of affordable monitors with an offering that is currently not available from its rivals.


The HP Pavilion 32 (V1M69A) display uses a 32" WVA+ panel with 2560×1440 resolution, 300 cd/m2 brightness, 3000:1 static contrast ratio, 178°/178° horizontal/vertical viewing angles as well as 60 Hz refresh rate. WVA stands for wide viewing angle, which is a general term to describe various types of panels (including *VA and PLS) used by display makers in their products. HP does not disclose exact type of the panel that powers the Pavilion 32”, but confirms that this is a VA panel (though, we have no idea whether this is AH-VA, A-MVA, etc.), not a TN (which is typically used for low-cost displays). In many ways, the Pavilion 32 resembles the Envy 32 monitor, which HP introduced several months ago. The Envy 32 has a similar WVA+ panel, but features stereo speakers as well as AMD’s FreeSync to appeal to gamers, but it is also more expensive.

Specifications of HP Pavilion 32 and HP Envy 32
HP Pavilion 32

V1M69A
HP Envy 32

N9C43AA
Panel 32" WVA+ 32" WVA+ with Anti-Glare
Resolution 2560 × 1440
Refresh Rate 60 Hz 60 Hz with AMD FreeSync
Response Time 7 ms gray-to-gray
Brightness 300 cd/m²
Contrast 3000:1
Viewing Angles 178°/178° horizontal/vertical
Color Saturation 100% sRGB
Pixel Pitch 0.276 mm
Pixel Density 91.8 pixels per inch
Inputs 2 × HDMI

1 × DP 1.2
1 × HDMI

1 × MHL

1 × DP 1.2

3.5 mm stereo-in
USB Hub 2-port USB 2.0 hub
Audio None Stereo speakers with Bang

& Olufsen enhancements
Launch Price $399.99 $499.99

The new Pavilion 32 display from HP is equipped with two HDMI and one DisplayPort 1.2 connectors (cables are included in the package). In addition, it has an integrated USB 2.0 hub, which should be enough to connect a keyboard, but which will not be sufficient for modern external USB flash memory drives that support USB 3.0 transfer rates. Keeping in mind that the hub is located on the backside of the monitor, it looks like it was not intended for removable storage in general. The design of the Pavilion 32 allows adjusting tilt, but not height. Asides from that, the monitor cannot be used in portrait mode, which is hardly a problem for the vast majority of its potential buyers.

Select retailers as well as HP’s online store will start to sell the HP Pavilion 32 on June 26 for $399.99. The monitor is covered by a one- or three year-limited warranty.

The key selling points of the HP Pavilion 32 are its relatively low price as well as its VA panel. Right now, the majority of 32” displays with QHD resolution from well-known suppliers cost over $500. By making its product available for $400, HP appeals to a broader audience of users, who currently buy smaller monitors. What remains to be seen is whether other display makers follow HP with their inexpensive 30” QHD parts.


Read More ...




The ASRock E3V5 Performance Gaming (C232) Motherboard Review
If you want to run a Skylake E3 Xeon, it needs to be placed in a motherboard with either the C232 or C236 chipsets. This is a change from the last generation, and as a result most of the motherboard manufacturers are bringing some of their consumer expertise to new products in order to get a slice of the casual Xeon user pie. We explored a server-like C236 based motherboard in the previous review, and in this review we are taking the latest edition from ASRock’s Gaming range, based on the C232 chipset, for a spin.


Read More ...




Comtrend PG-9172 Powerline Adapter Review: G.hn Gets Primed for Retail Push
The battle between HomePlug and HomeGrid to emerge as the de-facto powerline networking standard was quite interesting between 2010 and 2013. However, despite silicon getting demonstrated at various trade shows, G.hn was unable to get a retail product out for a long time. This changed last summer, when Comtrend introduced the PG-9172, a 1200 Mbps G.hn powerline adapter. In this review, we take a look at the performance of the Comtrend PG-9172, and how it compares to some of the HomePlug products already in the market. With Arris launching a suite of G.hn networking products under the RipCurrent branding last month, we also analyze whether G.hn is finally ready for retail prime time.


Read More ...




HP Unveils Premium Chromebook: 3K Display, Intel Core M, 16 GB of RAM and USB-C
HP has announced a new family of Chromebooks, which  are powered by Intel’s high-performance processors and feature stylish design, aluminum body, high-resolution display and even Bang & Olufsen speakers. The new laptops will not be as affordable as many other mobile PCs running Google Chrome OS and will not be as powerful as Google’s Pixel, however, this is what HP believes to be the right balance between performance, style, portability and price.

When Acer and Samsung introduced their first notebooks based on Google’s Chrome OS in mid-2011, they praised their low price and mainstream computing capabilities. At the time, Chrome OS was a mystery for most people, netbooks were relatively popular and it made sense for the aforementioned PC makers and Google to address the entry-level segment of the market with something very affordable. As Chrome OS gained traction, PC makers began to install higher-performing components into their Chromebooks. However, they were still not ready to address the high-end market segment with such PCs, which is why Google released its Pixel laptop in 2013. The Chromebook Pixel is one the most advanced and stylish Chromebooks ever made because of its Core i7 “Broadwell” CPU, a display with 2560×1700 resolution and 3:2 aspect ratio. But, the Pixel costs $999 and not all users are ready to invest that sum in a Chromebook. Fortunately, different PC makers offer various systems that attempt to replicate some of the Pixel’s features. HP decided to build its own competitor for Google’s Pixel and while the product is not exactly affordable, it has a better screen than most Chromebooks and a number of other advanced features.


The HP Chromebook 13 sports a 13.3” IPS display with 3200×1800 resolution (QHD+), 170-degree viewing angles and 16:9 aspect ratio, which is good for multimedia applications and video. HP’s latest Chromebook comes in brushed anodized aluminum chassis, it is 12.9 mm thick and weighs 1.29 kilograms (2.86 pounds), which is thinner and lighter than Apple’s MacBook Air 13”. Despite the very high resolution screen, the laptop works up to 11.5 hours on one charge of its 45 Wh battery, according to the manufacturer.


To enable long battery life, HP used Intel’s Skylake-Y system-on-chips to build its Chromebook 13. Various versions of the system are powered by either Pentium or Core M SoCs with two cores, Intel’s HD Graphics 515 (Gen9) core with 24 EUs (execution units) as well as 6W or 4.5W TDP. The system will likely be considerably faster than other Chromebooks running Atom, Celeron or Pentium processors because of the high-performance CPU architecture.

HP Chromebook 13 Specifications
Screen Resolution 3200×1800
CPU Intel Core m7-6Y75 Intel Core m5-6Y57 Intel Core m3-6Y30 Intel Pentium 4405Y
Graphics Intel HD Graphics 515 (Gen9, 24 execution units)
RAM 16 GB 8 GB 4 GB
Storage NAND flash storage
Wi-Fi 2x2 MIMO 802.11ac Wi-Fi module (?)
Bluetooth Bluetooth 4.2 (?)
USB 2×USB-C, 1×USB-A ports
Other I/O Microphone, stereo speakers, audio jack
Thickness 12.9 mm/0.5 inch
Weight 1.29 kilograms / 2.86 pounds
Price $1029 $819 $599 $499

Depending on the model and price, the HP Chromebook 13 can be equipped with 4, 8 or 16 GB of RAM, an unknown amount of solid-state storage as well as wireless connectivity technologies (a 802.11ac Wi-Fi module with Bluetooth 4.2 is likely, but is not confirmed by HP). HP notes that its system has a full-sized backlit keyboard as well as Band & Olufsen-tuned speakers, which is something new for a Chromebook. The system also has a webcam, three microphones, a 3.5 mm audio port, a SD card reader, one USB Type-A port as well as two USB Type-C ports. The Chromebook 13 uses USB-C for charging and is therefore compatible with a variety of third-party chargers.


With its advanced Chromebook 13, HP offers its Elite USB-C Docking Station ($149), which plugs in to a USB-C port on the PC and enables to connect up two Full HD displays, Gigabit Ethernet as well as multiple USB Type-A devices, such as keyboards or mice.

Four versions of the HP Chromebook 13 should hit the U.S. retail shortly. The most basic model running the Intel Pentium 4405Y processor and equipped with 4 GB of RAM will cost $499, whereas the top-of-the-range system featuring the Intel Core m7-6Y75 and 16 GB of RAM will cost $1029, which is even more than Google’s Pixel.

Sources: HP and Engadget.



Read More ...




NVIDIA Releases 365.10 WHQL Game Ready Driver
With more game releases and open betas coming down the pipe this spring, driver developers are getting busy preparing our graphics cards for the new games. This time NVIDIA brings us a handful of fixes and a suite of game ready support updates.

NVIDIA driver version number 365.10 is a continuation of the 364 driver branch. Included are several bug fixes, including one for when one daisy-chained monitors, FPS drops in games with the previous driver build, and SLI control panel issues under Windows 10. Also, Dark Souls III performance has been fixed under Windows 7, 8 and 8.1, as performance under that game was sometimes poor in earlier driver releases.

Moving on to game ready support we have a few upcoming games. On the list we have Battleborn by Gearbox Software which is seeing release this week. Following along we have Forza Motor Sport 6: Apex by Turn 10, Overwatch by Blizzard and Paragon by Unreal Studios which all will have beta’s open this week.

Anyone interested can download the updated drivers through GeForce Experience or on the NVIDIA driver download page.


Read More ...




NVIDIA & Samsung Settle All Patent Infringement Disputes
Roughly a year and a half ago, NVIDIA opened up a patent infringement case against Samsung and Qualcomm, claiming that the various GPUs used by the two firms violated various NVIDIA patents. In response, Samsung opened up their own counter-suit, claiming that NVIIDA and its partners were violating Samsung patents. Since then, things have not progressed well for NVIDIA, with the US International Trade Commission (ITC) ruling that Samsung’s GPUs don’t infringe on NVIDIA’s patents, while also ruling that NVIDIA’s GPUs did infringe on Samsung’s patents.

Now with the final ruling on Samsung’s counter-suit originally scheduled for today, NVIDIA has announced that they have buried the hatchet with Samsung, ending all litigation between the companies. In their announcement, NVIDIA notes that both companies have ended their suits with the US courts, US ITC, and the US Patent office, effective immediately. In turn, both companies have agreed to cross-license “a small number of patents by each company to the other,” while noting that this is not a broad cross-licensing agreement. All other terms of the deal – such as any potential payments – are not being disclosed.

As noted by Bloomberg, NVIDIA faced a potential import ban on some of their products should they have lost the final ruling on the Samsung counter-suit, so combined with their earlier losses at the ITC, there was a clear need for NVIDIA to settle the case rather than waiting on ITC and court rulings. This, in turn, seemingly puts a wrench in NVIDIA’s overall mobile patent licensing efforts, as the Samsung case was their best opportunity to get a ruling that other mobile GPUs were violating their patents. That there is some cross-licensing going on between Samsung and NVIDIA does mean that NVIDIA holds at least some patents that Samsung believes they need, but that this is being settled quietly out of court means that it’s hard to imagine that NVIDIA has a strong position for further patent licensing efforts.


Read More ...




Intel Adds Crystal Well-based Skylake-R Processors: 65W with 128MB eDRAM
Intel has added three new microprocessors for embedded and highly-integrated applications into its lineup. The new CPUs are based on the Skylake microarchitecture and feature high-performance integrated graphics cores with an added eDRAM cache called Crystal Well. The new products should offer high performance in memory bandwidth applications due to Skylake’s updated 2nd generation cache architecture.



In red is the 4+4e die with 128MB eDRAM

The chips that Intel has added to its price list are the Core i7-6785R, the Core i5-6685R, and the Core i5-6585R. The new processors are designed to fit in all-in-one PCs, small form-factor and other types of highly-integrated PCs that can satisfy the 65W TDP over the mobile Crystal Well variants that run at 45W. The new desktop chips from Intel are based on the Skylake-H silicon in its most advanced configuration: with four general-purpose cores as well as the GT4e integrated graphics. Not all the specifications of the processors are known at this point, but we are talking about quad-core processors with Generation 9 Iris Pro graphics and 72 execution units (as well as 128 MB of eDRAM), a dual-channel DDR4-2133 memory controller, a PCI Express 3.0 interface and three display outputs. The power consumption of Intel’s new embedded products for desktops does not exceed 65 W, which is typical for R-series offerings, and offer a potential upgrade path by OEMs for any equivalent systems that used an equivalent Broadwell-based R-series processor.

Intel unveiled its Skylake-H silicon in its full glory earlier this year when it released its mobile Xeon E3 v5 processors with the Iris Pro Graphics P580.


Several makers of industrial computer modules (such as Congatec) already use chips like the Intel Xeon E3-1515M v5 for their products, which is why we know what they look like. The die of the Skylake-H processor looks rather long and the lion’s portion of its transistor budget was spent on the mammoth iGPU. The extra on package die is the eDRAM, and the silicon underneath the CPU is the chipset (it's the Y/U series CPUs that have integrated chipsets).

Comparison of Intel's Embedded CPUs
i7-6785R i5-6685R i5-6585R i7-5775R i5-5675R i5-5575R
Microarchitecture Skylake Broadwell
Cores/Threads 4 / 8 4 / 4 4 / 4 4 / 8 4 / 4 4 / 4
L2 Cache 1 MB (256 KB × 4)
L3 Cache  8 MB 6 MB 6 MB 4 MB
eDRAM 128 MB 128 MB
CPU Frequency default 3.30 GHz 3.20 GHz 2.80 GHz 3.30 GHz 3.10 GHz 2.80 GHz
maximum 3.90 GHz 3.80 GHz 3.60 GHz 3.80 GHz 3.60 GHz 3.30 GHz
GPU Iris Pro 580 Iris Pro 6200
EUs 72 48
TDP 65 W 65 W
GPU Frequency 350 MHz to 1150/1150/1100 MHz 300 MHz to 1150/1100/1050 MHz
DRAM Support DDR4-2133/1866

DDR3L-1600/1333
-

DDR3L-1866/1600/1333
Packaging FCBGA1440 FCBGA1364
Process Technology 14 nm
Price $370 $288 $255 $348 $265 $244

The new parts feature higher clock rates compared to the Broadwell processors, although slightly lower than their K series counterparts. The processors have a number of important architectural improvements which will affect the performance of these CPUs in real-world applications. It is interesting to note that Intel retained the full L3 cache size in its new R-series CPUs: in the Broadwell models part of the L3 was used for eDRAM tags, reducing their capacity by 2 MB, but the new Skylake parts are now in line with their i7 and i5 naming due to the way the eDRAM is implemented. This means that the i7-6785R has 8 MB of L3, similar to the i7-6700K, and the i5-6685R/6585R has 6 MB of L3, similar to the i5-6600K.

Intel’s Skylake processors feature an upgraded microarchitecture with better parallelism and improved IPC, which means better performance almost across-the-board. An important capability of Skylake is its Speed Shift technology, which can quickly increase frequency for a short amount of time in a bid to rapidly perform an operation (~1-3 milliseconds rather than 30-100 without Speed Shift), thus providing better user experience and ultimately saving power. Intel’s Speed Shift requires support by the operating system and right now Microsoft’s Windows 10 can take advantage of the technology in a bid to improve its responsiveness.


Another important aspect of Intel’s Skylake CPUs with high-end iGPUs is their eDRAM, which means the processors also gain the code name 'Crystal Well'. The eDRAM for Skylake is different to that found in previous Crystal Well implementations: in the last generation, the eDRAM acted as a victim cache to the L3 cache, meaning that evicted cache lines from L3 would add up in the eDRAM and be quick for re-reading without having to access main memory. The downside to this is that data could not end up in eDRAM without being used first, giving initial data read latencies the same performance as previous processors. Ultimately this is still good for graphics and gaming, where textures are re-read from memory frequently. The new arrangement for the eDRAM in these Skylake processors has placed the eDRAM in a different part of the chain, between the System Agent and the DDR memory. This means that the eDRAM acts as a DRAM buffer, with 50 GBps bandwidth in each direction to the LLC, but is also accessible for early reads/writes by any device that needs memory access through the system agent (i.e. anything through PCIe). Previously this was not possible, but now it means that Skylake's eDRAM implementation should offer a speedup in many more scenarios that before.

The final noteworthy improvement of the Skylake processors compared to previous-generation offerings is revamped graphics core as well as increased amount of execution units. Based on our findings last year, real-world performance of Intel's high-end Iris Pro 6200 graphics core (Broadwell’s top iGPU) is higher than that of entry-level discrete graphics cards. Meanwhile, the highest-performing GT4e graphics core of Intel Skylake contains 72 EUs, up from 48 in the case of the Broadwell. Compute performance of Intel's contemporary top-of-the-range iGPU (Iris Pro 580) is around 1.1 TFLOPS depending on its frequency, so, this one should be tangibly faster than its predecessor. Last, but not least, Skylake’s iGPU has a revamped multimedia engine, which supports hardware decoding and encoding of UHD videos using HEVC or VP9 codecs.

Intel’s new Core i7-6785R, Core i5-6685R, and Core i5-6585R are already available at a tray price of $370, $288 and $255 respectively. Partners of the chipmaker will likely use the new processors to build their new systems in the coming months.

Image Sources: Congatec, Intel's IDF presentations.


Read More ...






Available Tags:HP , ASRock , Gaming , Intel , NVIDIA , WHQL , Driver , Samsung

Thursday, April 28, 2016

IT News Head Lines (AnandTech) 28/04/2016

AnandTech



Apple Announces Q2 Fiscal Year 2016 Results: iPhone Sales Slowed But Services Gain
This afternoon, Apple released their Q2 earnings for fiscal year 2016, which ended on March 26. The company saw revenues decline for the first time since Q1 2003, according to CNN. The results today did not meet expectations, but that was quite a run to go over 13 years without a year-over-year decline in revenue. Revenue for the quarter was $50.56 billion, which is 10% lower than the $58.01 billion announced a year ago. Gross margin was $19.9 billion, or 39.4%, which was down from the 40.8% gross margin in Q2 2015. Net income was down 22.5% as well, coming in at $10.5 billion for the quarter. This resulted in earnings per share of $1.90, down from $2.33 a year ago.

Apple Q2 2016 Financial Results (GAAP)
Q2'2016 Q1'2015 Q2'2015
Revenue (in Billions USD) $50.557 $75.872 $58.010
Gross Margin (in Billions USD) $19.921 $30.423 $23.656
Operating Income (in Billions USD) $13.987 $24.171 $18.278
Net Income (in Billions USD) $10.516 $18.361 $13.569
Margins 39.4% 40.1% 40.8%
Earnings per Share (in USD) $1.90 $3.30 $2.33

iPhone sales have certainly slowed, but Apple was almost destined to falter after reporting such strong quarters a year ago. The launch of the larger iPhone 6 and 6 Plus triggered year-over-year growth in iPhone sales of 40% a year ago, and 46% growth the quarter before that. Strong growth in China helped fuel a lot of that gain, since it was practically an untapped market for Apple, but revenue from China fell 26% from a year ago. With Apple being a company that has struggled to expand it’s market outside of iPhone, when the one segment falters it can make a big impact on the results, which is exactly what happened here.

Pretty much every earnings report, sales of the iPhone dominate the discussion, and today is not really any different. Apple sold 51.2 million iPhones this quarter, which is a drop of 16% year-over-year. That brought in revenue of $32.86 billion for the quarter, which is a drop of 18% year-over-year. A larger revenue drop than unit sales means that of the iPhones it is selling, the average selling price is also down. Apple still gets 65% of its revenue from the iPhone, even on a down quarter, but the other segments are not pulling up the slack.

iPad sales continue their downward trajectory, with sales of 10.251 million units this quarter, which is down 19% from a year ago. Revenue for the iPad was $4.4 billion, also down 19%. This has been a common trend with the iPad over the last year or two, and what originally looked to be another strong growth segment for Apple has quickly become a market where sales keep declining. Eventually they will bottom, but even with the solid new entries in the iPad Pro, the smaller iPad Pro 9.7, and even the new iPad Mini, the Apple tablet market has quickly reached a point where people are not upgrading as quickly as the iPhone market does, and you have to start to wonder when sales of the iPad are going to bottom out.

The PC market is certainly declining, but the Mac has soldiered on, generally outperforming the PC market even in the down times. That trend also stopped this quarter, with Mac sales down 12% year-over-year, to 4.0 million devices. Revenue for the Mac was $5.1 billion, which is down 12% compared to last year, meaning that Apple is also selling lower cost Macs than a year ago. We’ve not seen Apple refresh the Mac for some time though, with only the MacBook getting Skylake, so sales may be affected by this as well.

Services, which include internet services, AppleCare, Apple Pay, and others, are now the second largest revenue source for Apple, with revenues up this quarter 20% over last year, for a total of just a hair under $6 billion for the quarter. Even compared to the holiday quarter, which was Q1, sales were pretty much flat, and all of the other segments dropped significantly (and expectedly) compared to last quarter. You likely don’t think of Apple as a services company, but iTunes sales, Apple Music, and their other services are now the number two product at Apple, and that’s pretty surprising. It may not be number two next quarter, but with Apple having over a billion people using their services now, sales here should stay strong.

The final segment from Apple is “Other Products” which includes Apple Watch, Apple TV, iPod, Beats, and accessories. This segment also grew significantly year-over-year, to $2.2 billion, which is up 30%. Although Apple doesn’t break down the products inside here, the addition of Apple Watch likely makes up a good portion of this, since it wasn’t part of the category a year ago.

Apple Q2 2016 Device Sales (thousands)
Q2'2016 Q1'2016 Q2'2015 Seq Change Year/Year Change
iPhone 51,193 74,779 61,170 -32% -16%
iPad 10,251 16,122 12,623 -36% -19%
Mac 4,034 5,312 4,563 -24% -12%

Apple announced they were going to be adding an additional $50 billion to their capital return program, bringing the program up to $250 billion in cash returned to shareholders by the end of March 2018. The dividend will be increased to $0.57 per share, and they will buy back $175 billion in shares, up from the original goal of $140 billion in shares.

They also announced guidance for the next quarter, where they expect revenue between $41 and $43 billion (Q3 2015 revenue was $49.6 billion) and gross margin is expected to drop again to between 37.5 and 38%. With this guidance, next quarter may be very similar to this one.

Apple Q2 2016 Revenue by Product (billions)
Q2'2016 Q1'2016 Q2'2015 Revenue for current quarter
iPhone $32.857 $51.635 $40.282 65.0%
iPad $4.413 $7.084 $5.428 8.7%
Mac $5.107 $6.746 $5.615 10.1%
iTunes/Software/Services $5.991 $6.056 $4.996 11.8%
Other Products $2.189 $4.351 $1.689 4.3%

I don't think we have to worry about Apple going bankrupt just yet, but today’s earnings are a big change in what we’ve gotten used to in the last 13 years or so. All things must come to an end, and today it was Apple’s amazing track record over the last decade or more. They are certainly not alone in having their struggles this quarter, but the drop is pretty significant nonetheless.

Source: Apple Investor Relations


Read More ...




Intel Proposes to Use USB Type-C Digital Audio Technology
USB Type-C has a number of chances to become the standard for data and charging connector for smartphones and tablets running either Android or Windows. However, in the long-term future, Intel wants USB-C to be even more universal (and therefore pervasive) than it is going to be, which is why at IDF Shenzhen part of one of the talks evolved around using Type-C for audio.

Audio receptacles on PCs and mobile equipment are virtually the last remaining analog interfaces of modern devices, requiring certain techniques to maintain a high audio quality and remove interference. Intel proposes to replace things like 3.5 mm mini-jack with USB Type-C which will help to add features to headsets and will simplify connections of multi-channel audio equipment to various gadgets. This is not the first time a company has proposed to replace analog audio on PCs and mobile devices, but so far, nobody has succeeded due to the ubiquity of 3.5mm. Since the industry may still not be ready to go all-digital, there seems to be a backup plan.

Various types of audio jacks to connect headphones to audio equipment have been around for decades. For example, the original 6.35 mm connector, which is still widely used by audio equipment, was invented in 1878. Meanwhile, two-conductor miniature 3.5 mm audio connector (which is the most widely used audio connector at present) has been around since 1960s. Headphone jacks have evolved; they have gained contacts to support microphones and even basic programmable capabilities to enable remote controls. However, fundamentally, the ability to listen to audio through a speaker has remained the same for over a hundred years: completely analog and barely any smart functionality. Today's smartphones are used for all sorts of different purposes and are connected to a variety of devices, which requires sophisticated interconnection technologies with high data-rates. At the same time, as phones and devices get thinner, or even to simplify some of the internal design, it gets harder to install multiple ports for various purposes. If there were to be a universal connector that does it all, including audio, Intel and some other players want USB Type-C to be that universal connector.


In fact, USB-C can be used to transfer analog audio in accordance with the specification of the connector. It all comes down as to how that audio is transmitted.

The USB-C has sideband use pins (SBU1 and SBU2) which can be used for analog audio in audio adapter accessory mode. Use of the sideband pins should not impact data transfers and other vital functionality of USB-C cables, which should make them relatively simple from the engineering point of view. In this case, the USB-C connector will just replace the 3.5 mm mini jack and may even gain some additional features, such as a thermal sensor in an earpiece could measure temperature for fitness tracking.

The concept is not completely new and we saw it years ago - back in the 2000s, Motorola used the mini-USB connector on its feature phones to enable charging, data transfers and a headset connection. The idea to use one connector for everything was not entirely bad, however, it left users without a choice of headsets. However, if the makers of devices (as well as producers of audio listening equipment) adopt USB-C, the is potential that the problem will not occur again. In the advent of digital signal transfer, this allows the headset to drive the digital-to-analog conversion, removing electronic interference from the host and potentially offering a wide array of audio results.

However, transferring analog audio using USB-C’s SBU pins is not the only thing that Intel is working on.


At present, Intel is finalizing the USB Type-C Digital Audio technology and plans to release its specification later in Q2. The company does not reveal a lot about the standard right now, but notes that it is working on updating the USB Audio Device Class 2.0 specifications to support new connector, expand the list of recent audio specifications and features, improve power management and simplify the discovery and configuration model to make the upcoming headsets as easy to use as today’s headsets.

In fact, one of the important issues with streaming audio over USB is the synchronization of data streams from the host to the receiver. The USB Audio Device Class specification solved the problem in the past and because Intel mentioned the USB Audio Device Class 2.0 in its presentation at IDF, this may mean that the new the USB-C Digital Audio spec will rely on this synchronization mechanism as well. Intel wants its USB-S Digital Audio to be backward-compatible with USB Audio (1.0 and 2.0), but naturally plans to add support for new music formats.

Usage of digital audio means that headsets should gain their own amplifiers, DACs and various other logic, which is currently located inside smartphones. Intel proposes to install special multi-function processing units (MPUs), which will perform beam forming, noise suppression, acoustic echo suppression (AES), acoustic echo cancellation (AEC), non-linear processing and other operations. The MPUs will also support HDCP technology, hence, it will not be possible to make digital copies of records using USB-C digital headset outputs. It is unlikely that audio processing will be offloaded to external headsets completely, but the latter will clearly gain their own chips. This may, however, see a spike in cost, especially at the super-low end.

A good thing about USB Type-C headsets with MPUs is that they are going to be software upgradeable and could gain functionality over their lifespan. Intel admits that such MPUs will make digital headsets more expensive compared to analog devices, but high volumes and new process technologies will help to reduce the cost of digital headsets over time. In fact, USB Audio headsets and audio chips for them are not something completely new. For example, Plantronics Audio 655 DSP headset costs $49.99, whereas CMedia’s HS-100 chip for headsets is available $1. Therefore, from the cost perspective, digital headphones should not be too much more expensive in general. Meanwhile, Intel wants USB-C digital audio headsets to offer “significant value at higher end” and have improved functionality in a bid to become popular among consumers.


The industry has successfully replaced analog cables with HDMI for video equipment in the living room and in the coming years will retire the D-Sub interconnection for computer displays. However, audio jacks have survived multiple generations as other standards have changed. In fact, Intel itself eliminated analog audio jacks in its first-generation NUCs PCs, but had to return them in subsequent generations. With USB-C Digital Audio Intel may not be alone. Google’s Android 5.0 already supports USB DAC devices and thus digital headsets. Moreover, last week LeEco released several smartphones without audio jacks, so, there are attempts to eliminate them from mobile devices already. One maker will not make any difference, but a coordinated move by market leaders, such as Samsung, LG or HTC, could have a significant impact.



Read More ...




The Riotoro Prism CR1280 Case Review
In this review we are having our first encounter with Riotoro, a new manufacturer of PC cases and peripherals. The Prism CR1280 that we are putting to the test today is the world’s first RGB case, a very large tower primarily designed for advanced gaming systems.


Read More ...




AMD Releases Radeon Pro Duo: Dual Fiji, 350W, $1500
These recent years we have seen a slow but steady buildup of VR from both technological developments to growing enthusiasm shown by consumers and the industry. Today AMD is releasing the Radeon Pro Duo to the market as their first card targeted at VR developers. This card is not being directly aimed at gamers, despite the capability under the hood, but focuses on official support for professional software. Additionally, multiple initiatives are being both spearheaded and supported by AMD and others to encourage growth in the VR sector.

 


The AMD Radeon Pro Duo was first announced back in March, with the card is being marketed for VR content creation first and foremost. With this card, AMD is promoting the ability to allocate one GPU per eye while powering VR experiences. This way the case is opened up for performance beyond what any other single card can offer today. Another use case for developers is offloading compute work to the second GPU while the first is used for graphical work which can make for a much smoother experience during demanding a workflow.

Gaming is definitely possible on Radeon Pro Duo and alongside the FirePro drivers for content creators, Radeon drivers will be available. The Pro Duo will not see validation for as many applications as a true FirePro card, but official support will be provided for applications important to gaming content creation such as Autodesk, Maya, and Blackmagic Davinci Resolve.

AMD GPU Specification Comparison
AMD Radeon Pro Duo AMD Radeon R9 Fury X AMD Radeon R9 Fury AMD Radeon R9 295X2
Stream Processors 2 x 4096 4096 3584 2 x 2816
Texture Units 2 x 256 256 224 2 x 176
ROPs 2 x 64 64 64 2 x 64
Boost Clock 1000MHz 1050MHz 1000MHz 1018MHz
Memory Clock 1Gbps HBM 1Gbps HBM 1Gbps HBM 5Gbps GDDR5
Memory Bus Width 2 x 4096-bit 4096-bit 4096-bit 2 x 512-bit
VRAM 2 x 4GB 4GB 4GB 2 x 4GB
FP64 1/16 1/16 1/16 1/8
TrueAudio Y Y Y Y
Transistor Count 2 x 8.9B 8.9B 8.9B 2 x 6.2B
Typical Board Power 350W 275W 275W 500W
Manufacturing Process TSMC 28nm TSMC 28nm TSMC 28nm TSMC 28nm
Architecture GCN 1.2 GCN 1.2 GCN 1.2 GCN 1.1
GPU Fiji Fiji Fiji Hawaii
Launch Date Q2 2016 06/24/2015 07/14/2015 04/21/2014
Launch Price $1499 $649 $549 $1499

The Radeon Pro Duo is essentially and effectively two Radeon R9 Nanos together on a single PCB. At a high level, the Pro Duo should give us up to twice the performance at twice the power consumption (plus a bit extra for PCIe switches). To remove heat, the card comes with a closed loop cooler similar to that found on AMD’s Radeon R9 Fury X. This cooler, unlike the one found on the R9 295X2, provides a complete liquid cooling solution covering the VRMs on both GPUs along with the GPUs themselves. For reference, the pipes on this one are 540 mm long, and the double-thick radiator with fan comes in at 63 mm


Moving past the cooling solution we get three full sized DisplayPort connectors and one full-size HDMI port. On the side of the card there are three 8-pin PCIe power connectors which will do more than an adequate job of supplying the rated 350W power draw. Note that 350W is the equivalent of dual R9 Nano cards (rated at 175W a piece), and will be clocked similarly. The reactive frequency adjustments to heavily loading, by inference, are likely to be similar but we expect AMD to be using low-power binned parts for their new high-end card.

The Radeon Pro Duo is launching today at $1500, or three times the current price of the R9 Nano. That’s a $500 price premium to combine two cards into one. Even with the price, AMD is keen to admit that the Radeon Pro Duo is now the single fastest graphics card on the market since the competition doesn’t offer a similar product at this time. From our perspective at AnandTech, we still advise that users are better off investing in a single powerful GPU first, and only scaling out into SLI/CF when requirements for extreme performance are such that a single GPU solution cannot provide. With VR, it stands a good chance at pushing gaming machines harder than anything we’ve seen so far, especially when trying to maintain a smooth and low latency experience. It all depends on the workflow and subsequent frame rendering methods used.


Alongside all of this news and information is renewed attention for several initiatives AMD is taking part in. AMD has placed the Radeon Pro Duo as the first card in their AMD VR Ready Creator Line. The goal being that the Pro Duo, coupled with Liquid VR, will create a powerful and capable platform to develop future VR experiences. The AMD VR Ready Creator Line is also the platform of choice for Crytek’s VR First initiative, which intends to foster growth in the VR industry by supporting developers by powering virtual reality labs in colleges and universities around the world.

We are approaching a crossroads between the outgoing GPU generation and the upcoming cards coming out later this year. The Radeon Pro Duo is part of an outgoing generation but aims to provide a competent platform for VR content creation following known architecture guidelines. Along with the new hardware released today, there are many initiatives in motion that aim to encourage growth in VR, and new hardware will continue to be an important tool for creating innovative experiences moving forward.

We have already seen Tmall post up an early listing for an XFX variant of the Pro Duo, and retailers should be showing other OEMs variants today as well. At current, AMD's base design is expected to be the sole variant of the Pro Duo.

Source: AMD



Read More ...




AMD Releases Radeon Software Crimson Edition 16.4.2 Hotfix
With a couple of weeks since their last driver release, AMD has handed us another update. Alongside a list of fixes, and a focus on a narrow set of issues, the new version has now been given full support for external GPU docks using Thunderbolt 3 via AMD's XConnect platform.

Radeon Software Crimson Edition 16.4.2 brings the Driver version to 16.15.2401. With the new driver version comes a list of gaming updates with a heavy focus on Crossfire. Along with new Crossfire profiles for both Elite Dangerous and the new Need for Speed title, we have a list of 12 other fixes: eight of them are for various issues related to stuttering, flickering, or corruption in various games while playing with Crossfire enabled, and the other four target adjustments to Radeon software settings. These fixes include issues such as games failing to show up in the supported list, the power efficiency toggle showing up for some unsupported products, and some DX9 applications being unable to run with AMD Crossfire disabled. The last two relate to some users of the Radeon R9 380 experiencing slower than expected fan speed and GPU clocks on some AMD products remaining in a higher clock state after recovering from an application crash.

More importantly, this driver provides full support for AMD XConnect technology. With XConnect support, a system can have TB3 dock compatibility with either a Radeon R9 Fury, a Nano or a 300 series GPU housed in the external enclosure. As reported previously, AMD does make clear that a system also requires BIOS support alongside compatible drivers alongside the external TB3 dock. AMD also states in the fine print that not all external enclosures are pre-configured with an AMD Radeon GPU (so your mileage may vary), and also some external enclosures may not feature user upgradability.

As always, those interested in reading more or installing the updated hotfix drivers for AMD’s desktop, mobile, and integrated GPUs can find them either under the driver update section in Radeon Settings or on AMDs Radeon Software Crimson Edition download page.


Read More ...






Available Tags:Apple , iPhone , Intel , USB , AMD , Radeon