Tuesday, May 29, 2012

IT News Head Lines (VR-Zone) 29/05/2012

VR-Zone



MSI R7850 Power Edition 2GD5/OC Review
vr-zone.com -
MSI has well earned a reputation for making quality custom graphics cards. Here for review we have their newest release, the R7850 Power Edition. With its use of quality components and the new Twin Frozr IV cooler, the card should be a significant improvement over the reference HD 7850. We look forward to putting this factory overclocked version through its paces.


Read More ...




PC Show 2012 Promotions: Dell
vr-zone.com -
Dell
Dell will have a huge presence at the upcoming PC Show 2012 at Suntec City Convention Centre - Level 3 Booth 3001; Level 4 A2017 (Dell Main Booth), A2018, A2031, A2028, A2056, A2040B, A2001; Level 6 B2006 and B2018. Among the products showcased include the Dell Inspiron 14, XPS 13 and Alienware X51.


Read More ...




PC Show 2012 Promotions: HP
vr-zone.com -
HP
Check out HP offers at this upcoming PC Show 2012; the PC giant's booth can be located in Hall 401 - 404, numbered A2002 and A2003. Their star products include the ENVY Sleekbook, Pavilion dv6 and g4 laptops, TouchSmart 520 and Omni 27 all-in-one desktop PCs.


Read More ...




Honkawa 2 real-leather keyboard available in June, limited to 10 pieces per month
vr-zone.com -
Like leather? Enough to buy a keyboard with even its keys made out of genuine leather? Then the Honkawa 2 real-leather keyboard from Japanese accessories maker Atelier Wagakura ("Wagakura Koubou" in their native tongue) may be just be what you need to complete your life.


Read More ...




Oppo Finder, new world's thinnest smart phone
vr-zone.com -
Measuring only 6.65 mm in thickness, the Oppo Finder is now the world’s thinnest phone.  The Chinese manufacturer Oppo somehow crammed a 1.5 GHz dual core, a 4.3 inch AMOLED PLUS display, 1 GB RAM, and 16 GB of internal storage into the Finder.  Advancements in engineering of memory chips and other electrical components of smart phones have made it possible for manufacturers to slim down phones.  However, the heat factor that coincides with CPU/GPU integration is still one of the biggest hurdles for engineers to overcome.


Read More ...






Available Tags:MSI , Dell , HP , keyboard ,

No comments: